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1. 发明授权

US08008767B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08008767B2
公开(公告)日：2011-08-30
申请号：US12094775
申请日：2007-09-05
申请人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
发明人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
IPC分类号： H01L23/18 , H01L23/498
CPC分类号： H01L21/563 , H01L23/145 , H01L23/498 , H01L23/49894 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/3011 , H05K1/0271 , H05K3/305 , H05K3/4602 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.
摘要翻译：本发明提供了用于抑制由于温度变化引起的半导体器件损坏的技术。当将硅芯片倒装安装在具有减薄芯的结构的积层型多层基板上时，在多层基板中使用具有小的热膨胀系数的芯，并且热膨胀系数和玻璃化转变点底部填充物根据芯的厚度和热膨胀系数进行适当设计。通过这样做，可以减轻由于温度变化而导致的多层基板的变形引起的半导体封装内的应力，从而抑制由于温度变化导致的半导体封装的损坏。

2. 发明申请

US20090267212A1 Semiconductor Device 失效
标题翻译：半导体器件
公开(公告)号：US20090267212A1
公开(公告)日：2009-10-29
申请号：US12094775
申请日：2007-09-05
申请人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
发明人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
IPC分类号： H01L23/18 , H01L23/498
CPC分类号： H01L21/563 , H01L23/145 , H01L23/498 , H01L23/49894 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/3011 , H05K1/0271 , H05K3/305 , H05K3/4602 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.
摘要翻译：本发明提供了用于抑制由于温度变化引起的半导体器件损坏的技术。当将硅芯片倒装安装在具有减薄芯的结构的积层型多层基板上时，在多层基板中使用具有小的热膨胀系数的芯，并且热膨胀系数和玻璃化转变点底部填充物根据芯的厚度和热膨胀系数进行适当设计。通过这样做，可以减轻由于温度变化而导致的多层基板的变形引起的半导体封装内的应力，从而抑制由于温度变化导致的半导体封装的损坏。

3. 发明授权

US5783830A Sample evaluation/process observation system and method 失效
标题翻译：样本评估/过程观察系统和方法
公开(公告)号：US5783830A
公开(公告)日：1998-07-21
申请号：US873788
申请日：1997-06-12
申请人： Hiroshi Hirose , Hidemi Koike , Shigeto Isakozawa , Yuji Sato , Mikio Ichihashi , Motohide Ukiana
发明人： Hiroshi Hirose , Hidemi Koike , Shigeto Isakozawa , Yuji Sato , Mikio Ichihashi , Motohide Ukiana
IPC分类号： H01J37/305 , H01J37/20
CPC分类号： H01J37/3056 , H01J37/265 , H01J2237/20 , H01J2237/26
摘要： A sample evaluation/process observation system includes a common sample stage which accommodates a plurality of samples to be processed. The common sample stage is provided with a processing/observing notch and also with a movement mechanism. The movement mechanism functions to sequentially move the plurality of samples to the notch to cause the samples to be exposed to a predetermined processing beam and observing beam. The system further includes a beam processing device in which the common sample stage can be mounted and which functions to irradiate the predetermined processing beam on the plurality of samples through the notch to thereby sequentially perform beam processing operation over the samples. The system further includes a beam observation device in which the common sample stage can be mounted and which functions to irradiate the predetermined observing beam on the plurality of samples through the notch to sequentially observe and evaluate shapes of the plurality of samples. A mark is formed on one sample by a focused ion beam device so that positioning of the mark realizes automatic processing of a part of the sample to be processed. Further, the common sample stage is used in a high-acceleration transmission electron microscope and a high-acceleration scanning electron microscope and focused ion beam device.
摘要翻译：样本评估/过程观察系统包括容纳多个待处理样本的公共样本阶段。公共样品台具有处理/观察凹口，并且还具有移动机构。移动机构用于将多个样本顺序地移动到凹口，以使样本暴露于预定的处理束和观察波束。该系统还包括其中可以安装公共样本台的束处理装置，并且其功能是通过凹口对多个采样上的预定处理光束照射，从而顺序地对采样进行光束处理操作。该系统还包括其中可以安装公共样品台的束观察装置，并且其功能是通过凹口将多个样品上的预定观察光束照射，以依次观察和评估多个样品的形状。通过聚焦离子束装置在一个样品上形成标记，使得标记的定位实现待处理样品的一部分的自动处理。此外，普通样品台用于高加速度透射电子显微镜和高加速度扫描电子显微镜和聚焦离子束装置。

4. 发明授权

US5780853A Scanning electron microscope 失效
标题翻译：扫描电子显微镜
公开(公告)号：US5780853A
公开(公告)日：1998-07-14
申请号：US749214
申请日：1996-11-14
申请人： Futoshi Mori , Kazuhiko Fukazawa , Hiroshi Hirose , Yoshiaki Kohama
发明人： Futoshi Mori , Kazuhiko Fukazawa , Hiroshi Hirose , Yoshiaki Kohama
IPC分类号： H01J37/20
CPC分类号： H01J37/20 , H01J2237/20285 , H01J2237/28
摘要： A stage on which a sample is placed is driven through feed screws rotated by pulse motors which are controlled by a micro-step drive control method. Backlash quantities and feed screw pitch errors have previously been obtained and stored in a memory, and when the stage is to be driven, a stage controller corrects the backlash and pitch errors.
摘要翻译：通过由微步驱动控制方法控制的脉冲电机旋转的进给螺杆驱动放置样品的阶段。之前已经获得了间隙数量和进给螺杆螺距误差并将其存储在存储器中，并且当级被驱动时，级控制器校正齿隙和螺距误差。

5. 发明授权

US4779982A Spectrofluorophotometer with monitor detector for light source 失效
标题翻译：分光荧光光度计，带光源监视器
公开(公告)号：US4779982A
公开(公告)日：1988-10-25
申请号：US796808
申请日：1985-11-12
申请人： Hiroyuki Koshi , Shunichi Matuura , Minoru Owada , Hiroshi Hirose , Tadao Ishii
发明人： Hiroyuki Koshi , Shunichi Matuura , Minoru Owada , Hiroshi Hirose , Tadao Ishii
IPC分类号： G01J3/443 , G01J1/16 , G01J3/04 , G01J3/28 , G01J3/44 , G01N21/64
CPC分类号： G01J3/4406 , G01J2001/1636 , G01J2003/042 , G01J2003/2873
摘要： A spectrofluorophotometer enabling spectrum correcting treatment to be done highly accurately, including an intercepter the incident light in a fluorescence detecting system, and an interceptor intercepting the incident light in a monitoring detecting system, so as to carry out zero point correction for both of these detecting systems.
摘要翻译：可以高精度地进行光谱校正处理的分光荧光光度计，包括在荧光检测系统中插入入射光，以及在监视检测系统中截取入射光的拦截器，以便对这两种检测进行零点校正系统。

6. 发明授权

US4330207A Fluorescence spectrophotometer 失效
标题翻译：荧光分光光度计
公开(公告)号：US4330207A
公开(公告)日：1982-05-18
申请号：US45630
申请日：1979-06-05
申请人： Taro Nogami , Hiroshi Hirose
发明人： Taro Nogami , Hiroshi Hirose
IPC分类号： G01J1/58 , G01J3/28 , G01J3/44 , G01J3/443 , G01N21/64
CPC分类号： G01J3/4406 , G01J3/28
摘要： A fluorescence spectrophotometer comprising a light source, an excitation side monochromator which makes light from the light source be subjected to spectroscopic analysis for illuminating as actinic light a sample, a fluoroscence side monochromator which makes fluorescence light from the sample be subjected to spectroscopic analysis, a detector which detects light from the fluorescence side monochromator, and a scanning means which adjusts both the monochromators to the wavelengths of the actinic light and the fluorescence light to be scanned. These monochromators are arranged in such a way that one of them is automatically set to the location of the peak wavelength value which is detected by itself through a simple and automatic wavelength scanning operation and then the other is wavelength-scanned for excitation spectrum or fluorescence spectrum measurement.
摘要翻译：荧光分光光度计包括光源，使来自光源的光的激发侧单色仪进行光谱分析以作为光化照射样品，使来自样品的荧光的荧光侧单色仪进行光谱分析，检测器，其检测来自荧光侧单色仪的光;以及扫描装置，其将两个单色仪调整到光化光的波长和待扫描的荧光。这些单色仪以这样的方式布置，使得它们中的一个被自动设置为通过简单和自动的波长扫描操作自身检测的峰值波长值的位置，然后另一个被波长扫描以用于激发光谱或荧光光谱测量。

7. 发明授权

US3977778A Electrophotographic apparatus 失效
标题翻译：电子照相设备
公开(公告)号：US3977778A
公开(公告)日：1976-08-31
申请号：US485751
申请日：1974-07-03
申请人： Nachio Seko , Hiroshi Hirose
发明人： Nachio Seko , Hiroshi Hirose
IPC分类号： G03G21/00 , G03G13/22 , G03G15/043 , G03G15/26
CPC分类号： G03G13/22 , G03G15/043
摘要： In electrophotographic apparatus for producing positive copies of both positive and negative originals with toner of one polarity by establishing and developing an electrostatic latent image on a light-sensitive member that is precharged to a first polarity for positive originals and to the opposite polarity for negative originals, wherein means are provided for exposing the precharged member to an optical image of the original and for controlling the exposure by varying the amount of light used, a two-position changeover switch for reversing the operation of the exposure controller depending on whether the original is positive or negative. This changeover switch, and also a switch for reversing the charging polarity of means for precharging the light-sensitive member, may be controlled by photoelectric means for determining whether the original is positive or negative by sensing the optical density of a marginal portion provided on the original.
摘要翻译：在电子照相设备中，通过在预先充电到正原稿的第一极性的感光元件上建立和显影静电潜像，并且对于正反面的原稿，反相极性产生正极和负极的两个正极和负极的正面拷贝其中提供了用于将预充电构件暴露于原稿的光学图像并通过改变所使用的光量来控制曝光的装置，用于根据原稿是否反转曝光控制器的操作的两位置转换开关正或负该转换开关以及用于反转用于对感光构件进行预充电的装置的充电极性的开关可以由光电装置来控制，用于通过感测提供在感光元件上的边缘部分的光密度来确定原稿是正还是负原版的。

8. 发明授权

US08470918B2 Epoxy resin composition and semiconductor device 失效
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US08470918B2
公开(公告)日：2013-06-25
申请号：US12088053
申请日：2006-09-27
申请人： Hiroshi Hirose , Hideaki Sasajima , Hitoshi Kawaguchi
发明人： Hiroshi Hirose , Hideaki Sasajima , Hitoshi Kawaguchi
IPC分类号： C08K3/38 , C08L63/00
CPC分类号： H01L23/293 , C08G59/32 , C08G59/4014 , C08G59/62 , H01L2924/0002 , H01L2924/00
摘要： There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.
摘要翻译：提供了在成型后和焊接处理过程中以及在例如温度循环试验的低温过程中表现出较小的翘曲性，阻燃性，耐焊料龟裂性和流动性优异的环氧树脂组合物。以及使用该半导体装置的半导体装置。在半导体装置中使用的环氧树脂组合物含有选自三官能环氧树脂和四官能环氧树脂中的至少一种环氧树脂（A），每分子具有至少两个羟基的固化剂（B），化合物 C）每分子具有至少两个氰酸酯基，和无机填料（D）作为必需组分。

9. 发明授权

US07435551B2 Method for diagnosing type II diabetes or monitoring therapeutic effects of therapeutic agents for type II diabetes 有权
标题翻译：诊断II型糖尿病或监测II型糖尿病治疗剂治疗效果的方法
公开(公告)号：US07435551B2
公开(公告)日：2008-10-14
申请号：US11157947
申请日：2005-06-22
申请人： Motowo Tomita , Yasuko Nakano , Hiroshi Hirose , Koichi Matsubara
发明人： Motowo Tomita , Yasuko Nakano , Hiroshi Hirose , Koichi Matsubara
IPC分类号： G01N33/53 , C07K16/00
CPC分类号： G01N33/6893 , A61K39/00 , C07K16/18 , G01N2800/042
摘要： This invention provides a method for diagnosing geriatric diseases associated with insulin resistance, such as type II diabetes, at an early stage and a method for monitoring the therapeutic effects of agents for type II diabetes by quantitatively assaying GBP28 with the use of a monoclonal antibody that can assay adiponectin (GBP28) in a sample.
摘要翻译：本发明提供了一种用于早期诊断与胰岛素抵抗相关的老年病（例如II型糖尿病）的方法，以及通过使用单克隆抗体定量测定GBP28来监测II型糖尿病药物的治疗效果的方法可以测定样品中的脂联素（GBP28）。

10. 发明申请

US20060258822A1 Curing accelerator, epoxy resin composition, and semiconductor device 失效
公开(公告)号：US20060258822A1
公开(公告)日：2006-11-16
申请号：US11410266
申请日：2006-04-25
申请人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
发明人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
IPC分类号： C08L63/00 , B32B27/38 , C08G65/10
CPC分类号： H01L23/293 , C07F9/5442 , C08G59/688 , C08K5/50 , C08L63/00 , C08L85/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , H01L2924/00
摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

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