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    • 1. 发明申请
    • COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
    • 铜合金及其制造方法
    • US20150170781A1
    • 2015-06-18
    • US14413300
    • 2012-07-26
    • Takefumi ItoChisako MaedaYuji YoshidaKei SaegusaTakayuki Kemmotsu
    • Takefumi ItoChisako MaedaYuji YoshidaKei SaegusaTakayuki Kemmotsu
    • H01B1/02C22C9/06C22F1/08
    • H01B1/026C22C9/06C22F1/002C22F1/08
    • A copper alloy according to the present invention is a copper alloy rolled to be plate-shaped. The copper alloy contains 8.5 to 9.5 mass % of Ni, 5.5 to 6.5 mass % of Sn with a remainder being Cu and unavoidable impurities. An average diameter of crystal grains in a cross section perpendicular to a rolling direction is less than 6 μm. A ratio x/y of an average length x of the crystal grains in a plate width direction to an average length y in a plate thickness direction satisfies 1≦x/y≦2.5. An X-ray diffracted intensity ratio in a plate surface parallel to the rolling direction of the copper alloy includes, when an X-ray diffracted intensity of a (220) plane is standardized as 1, an intensity ratio of a (200) plane being 0.30 or less, an intensity ratio of a (111) plane being 0.45 or less, and an intensity ratio of a (311) plane being 0.60 or less. The intensity ratio of the (111) plane is greater than the intensity ratio of the (200) plane and smaller than the intensity ratio of the (311) plane.
    • 根据本发明的铜合金是被轧制成板状的铜合金。 铜合金含有8.5〜9.5质量%的Ni,5.5〜6.5质量%的Sn,余量为Cu和不可避免的杂质。 垂直于轧制方向的截面中的晶粒的平均直径小于6μm。 平板宽度方向上的晶粒的平均长度x与板厚方向上的平均长度y的比率x / y满足1≦̸ x / y≦̸ 2.5。 在平行于铜合金的轧制方向的板表面中的X射线衍射强度比包括当(220)面的X射线衍射强度标准化为1时,(200)面的强度比为 0.30以下,(111)面的强度比为0.45以下,(311)面的强度比为0.60以下。 (111)面的强度比大于(200)面的强度比,小于(311)面的强度比。