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    • 4. 发明授权
    • Electric junction box for motor vehicle
    • 机动车用电接线盒
    • US07934934B2
    • 2011-05-03
    • US12314813
    • 2008-12-17
    • Takayuki TaniguchiTakeshi Yomura
    • Takayuki TaniguchiTakeshi Yomura
    • H01R12/00
    • H02G3/083
    • An electrical junction box for a motor vehicle including a casing body that contains inner circuit members, an upper cover and a lower cover that are mounted and locked on the casing body, and a wire harness connected to the inner circuit members. The casing body includes a depression section that is provided on an outer peripheral wall of the casing body to define an electrical wire arranging space, and wire harness holding portions that project from the depression section and the electrical wire arranging space. The wire harness holding portion having arcuate inner surfaces that contact an exterior of the wire harness the wire harness being disposed in the electrical wire arranging space such that the wire harness is held in the holding portions.
    • 一种用于机动车辆的电接线盒,包括:壳体,其包含安装并锁定在壳体上的内部电路构件,上部盖和下部盖,以及连接到内部电路构件的线束。 壳体包括设置在壳体的外周壁上以限定电线布置空间的凹陷部,以及从凹部和电线布置空间突出的线束保持部。 所述线束保持部分具有弧形的内表面,所述内表面与所述线束的外部接触,所述线束设置在所述电线布置空间中,使得所述线束被保持在所述保持部分中。
    • 5. 发明申请
    • Fixing structure for electrical junction box and cassette
    • 电接线盒和磁带盒的固定结构
    • US20090218129A1
    • 2009-09-03
    • US12314817
    • 2008-12-17
    • Takayuki TaniguchiTakeshi Yomura
    • Takayuki TaniguchiTakeshi Yomura
    • H01R12/00H02B1/40
    • H02G3/081Y10S439/949
    • A fixing structure for an electrical junction box and a cassette, the fixing structure being adapted to fix the cassette on a side wall outer surface of the electrical junction box. A locking portion is provided on an outer surface of the cassette. A rib plate that extends in a vertical direction and projects downward adjacent to the locking portion to come into contact with the side wall outer surface. A counterpart locking portion to be locked on the locking portion is provided on the side wall outer surface. An engaging stepped-portion receives a lower end of the rib plate. When the locking portion and the counterpart locking portion are coupled to and locked on one another, the rib plate comes into contact with the side wall outer surface, and a lower end of the rib plate comes into contact with the engaging stepped-portion to restrict rotation of the cassette.
    • 一种用于电接线盒和盒的固定结构,所述固定结构适于将所述盒固定在所述电接线盒的侧壁外表面上。 锁定部分设置在盒的外表面上。 肋板,其在垂直方向上延伸并且相邻于所述锁定部分向下突出以与所述侧壁外表面接触。 在侧壁外表面上设置有被锁定在锁定部分上的对应锁定部分。 接合台阶部分容纳肋板的下端。 当锁定部分和配对锁定部分彼此联接并相互锁定时,肋板与侧壁外表面接触,并且肋板的下端与接合台阶部分接触以限制 盒式磁带的旋转。
    • 6. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20080032485A1
    • 2008-02-07
    • US11822427
    • 2007-07-05
    • Akio ShimoyamaHajime OdaKeiichi SawaiTakayuki Taniguchi
    • Akio ShimoyamaHajime OdaKeiichi SawaiTakayuki Taniguchi
    • H01L21/30
    • H01L21/78
    • A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.
    • 制造半导体器件的方法可以抑制当将用于辅助的结合有支撑构件的集成电路的阵列分成芯片时产生毛刺。 具有位于集成电路之间延伸的划线之下相对应的位于相应于在该集成电路之间的划线的下方的具有变薄区域(或支撑构件中的开口的空隙区域)的支撑构件通过粘合剂粘合到其上集成电路排列在其上的集成电路的半导体衬底的背面 一级。 然后,将切割带附接到支撑构件以固定整个组件,并且沿着划线切割集成电路,半导体衬底,粘合剂和支撑构件的组装,然后去除切割带 。
    • 8. 发明授权
    • Process for fabricating a semiconductor device
    • 制造半导体器件的工艺
    • US06395619B2
    • 2002-05-28
    • US09203330
    • 1998-12-02
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • Takuji TanigamiKenji HakozakiNaoyuki ShinmuraShinichi SatoMasanori YoshimiTakayuki Taniguchi
    • H01L2176
    • H01L21/76229
    • The present invention provides a process for fabricating semiconductor device comprising the steps of: forming an etching-stop layer on a semiconductor substrate; patterning the etching-stop layer so that the etching-stop layer remains in a region to be an active region and is removed from a region to be a device isolation region, followed by forming a trench in the region to be the device isolation region; depositing on the semiconductor substrate an insulating film having a thickness greater than or equal to the depth of the trench; forming a resist pattern having an opening above the etching-stop layer above the active region adjacent to a device isolation region whose width is greater than or equal to a predetermined value, followed by etching the insulating film using the resist pattern as a mask; and polishing the insulating film existing on the resulting semiconductor substrate for flattening after removing the resist pattern.
    • 本发明提供一种制造半导体器件的方法,包括以下步骤:在半导体衬底上形成蚀刻停止层; 图案化蚀刻停止层,使得蚀刻停止层保持在作为有源区的区域中,并从作为器件隔离区的区域去除,然后在该区域中形成作为器件隔离区的沟槽; 在半导体衬底上沉积厚度大于或等于沟槽深度的绝缘膜; 形成抗蚀剂图案,其具有在与宽度大于或等于预定值的器件隔离区相邻的有源区上方的蚀刻停止层上方的开口,然后使用抗蚀剂图案作为掩模蚀刻绝缘膜; 并且在除去抗蚀剂图案之后,对存在于所得半导体衬底上的绝缘膜进行抛光以使其变平。