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1. 发明授权

US07938948B2 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07938948B2
公开(公告)日：2011-05-10
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C25D3/64 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

2. 发明申请

US20090321269A1 SILVER AND SILVER ALLOY PLATING BATH 有权
标题翻译：银和银合金镀锌浴
公开(公告)号：US20090321269A1
公开(公告)日：2009-12-31
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka TSUJI , Tetsuji NISHIKAWA , Takao TAKEUCHI , Keigo OBATA , Hidemi NAWAFUNE
发明人： Kiyotaka TSUJI , Tetsuji NISHIKAWA , Takao TAKEUCHI , Keigo OBATA , Hidemi NAWAFUNE
IPC分类号： C25D3/64 , C25D3/46
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

3. 发明申请

US20070241170A1 FLUX FOR SOLDERING AND CIRCUIT BOARD 有权
标题翻译：焊接电路板
公开(公告)号：US20070241170A1
公开(公告)日：2007-10-18
申请号：US11767194
申请日：2007-06-22
申请人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K31/02
CPC分类号： H05K3/3489 , H05K3/244 , H05K2203/121 , Y10T428/24917
摘要： A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
摘要翻译：助熔剂含有具有成膜能力的树脂，活化剂，溶剂和至少一种选自银络合物和铜络合物的络合物。当在具有化学镀镍的电路上进行焊接或在化学镀镍上进一步具有镀金时，使用焊剂。允许银或铜的阻挡层沉积在焊盘的表面上，抑制镍在焊接期间向熔化的焊料合金中扩散，并且还防止磷浓度。这提高了焊接的接合强度，并且抑制了银和/或铜对除了电路图案之外的部分的还原沉积。

4. 发明授权

US06570096B2 Production method of Nb3Al superconducting multifilamentary wire 失效
标题翻译： Nb3Al超导复丝的生产方法
公开(公告)号：US06570096B2
公开(公告)日：2003-05-27
申请号：US09864228
申请日：2001-05-25
申请人： Takao Takeuchi , Nobuya Banno , Toshihisa Asano , Hitoshi Wada
发明人： Takao Takeuchi , Nobuya Banno , Toshihisa Asano , Hitoshi Wada
IPC分类号： H01B1200
CPC分类号： H01L39/2409 , C30B25/105 , C30B29/04 , Y10S420/901 , Y10S505/806 , Y10S505/815 , Y10T29/49014
摘要： This invention provides a production method of Nb3Al superconducting multifilamentary wire based on rapid-heating, quenching and transformation method, capable of producing a high-performance Nb3Al superconducting multifilamentary wire by improving critical temperature thereof, upper critical field and critical current density. Upon a first stage heat treatment of beating a composite, in which bcc phase Nb—Al supersaturated solid solution is dispersed in Nb matrix, the bcc phase Nb—Al supersaturated solid solution ordered in temperature rise process is made disordered at an initial phase thereof and a non-reacting portion located adjacent is heated using a reaction heat generated when transforming this disordered bcc phase to A15 phase. Then, disordering of the bcc phase is promoted while propagating a high-temperature transformation region so as to automatically progress high-temperature beat treatment. As a result, a reaction-transformation is caused to block stacking fault from being generated in the A15 phase and crystal grain from being coarse and then, a second stage heat treatment for improving a long range ordering of the A15 phase is carried out.
摘要翻译：本发明提供了一种基于快速加热，淬火和转化方法的Nb3Al超导多丝线的制造方法，其能够通过改善其临界温度，上临界场和临界电流密度来生产高性能Nb3Al超导复丝。在将bcc相Nb-Al过饱和固溶体分散在Nb基体中的复合材料的第一阶段热处理中，在升温过程中排列的bcc相Nb-Al过饱和固溶体在其初始阶段变得无序，使用在将该无序bcc相变换为A15相时产生的反应热来加热位于相邻的非反应部分。然后，在传播高温转化区域的同时促进bcc相的无序化，以自动进行高温节拍处理。结果，导致反应转变阻止在A15相中产生的堆垛层错和晶粒粗糙化，然后进行用于改善A15相的长程排序的第二阶段热处理。

5. 发明授权

US06183545B2 Aqueous solutions for obtaining metals by reductive deposition 有权
标题翻译：用于通过还原沉积获得金属的水溶液
公开(公告)号：US06183545B2
公开(公告)日：2001-02-06
申请号：US09340894
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C25D3/02 , C22B3/0051 , C22B11/046 , C23C18/42 , Y02P10/214 , Y02P10/234
摘要： An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
摘要翻译：一种用于金属还原沉积的水溶液，除了水以外还包含（A）通式（1）的膦，其中R 1，R 2和R 3表示低级烷基，其中至少一个是羟基或氨基 - 取代的低级烷基，和（B）通过所述膦形成可溶性络合物而溶解的金属或金属化合物的可溶性化合物。

6. 发明申请

US20130316909A1 COMPOSITE BARRIER-TYPE Nb3Al SUPERCONDUCTING MULTIFILAMENT WIRE MATERIAL 有权
标题翻译：复合阻挡型Nb3Al超导多层电线材料
公开(公告)号：US20130316909A1
公开(公告)日：2013-11-28
申请号：US13977990
申请日：2012-01-13
申请人： Nobuya Banno , Takao Takeuchi
发明人： Nobuya Banno , Takao Takeuchi
IPC分类号： H01B12/08
CPC分类号： H01B12/08 , H01L39/14 , H01L39/2409 , Y10T29/49014
摘要： A composite barrier-type Nb3Al superconducting multifilament wire material comprises Nb barrier filaments, Ta barrier filaments, Nb bulk dummy filaments, and a Nb or Ta covering. In the composite barrier-type Nb3Al superconducting multifilament wire material, the Nb barrier filaments and Ta barrier filaments are disposed in the wire material so that the Nb barrier filaments are concentrated in a filament region near a core formed from the Nb bulk dummy filaments and only the Ta barrier filaments are disposed or the Nb barrier filaments are dispersed in the Ta barrier filaments in an outer layer portion formed from a region outside the Nb barrier filaments, excluding the Nb or Ta covering.
摘要翻译：复合阻挡型Nb3Al超导复丝线材包括Nb阻挡丝，Ta阻挡丝，Nb体虚拟长丝，Nb或Ta覆盖物。在复合阻挡型Nb3Al超导复丝线材中，Nb阻挡丝和Ta阻挡丝被布置在线材中，使得Nb阻挡丝聚集在由Nb体虚拟长丝形成的芯附近的细丝区域中，并且仅在Nb阻挡丝之外的区域形成的外层部分中，除了Nb或Ta覆盖物之外，设置Ta阻挡丝，或者将Nb阻挡丝分散在Ta阻挡丝中。

7. 发明授权

US08434212B2 Stator coil production method using shaping press pairs 有权
标题翻译：定子线圈生产方法采用成型压力对
公开(公告)号：US08434212B2
公开(公告)日：2013-05-07
申请号：US13106985
申请日：2011-05-13
申请人： Daisuke Okushita , Yusuke Hara , Takao Takeuchi , Kiyokazu Futami , Satoshi Nakamura , Fumihiro Nakano
发明人： Daisuke Okushita , Yusuke Hara , Takao Takeuchi , Kiyokazu Futami , Satoshi Nakamura , Fumihiro Nakano
IPC分类号： H02K15/04
CPC分类号： H02K15/0478 , Y10T29/49009 , Y10T29/49011 , Y10T29/49012 , Y10T29/49071 , Y10T29/53143 , Y10T29/53161
摘要： A stator coil producing method and a stator coil production machine. The stator coil is used in an electric rotating machine. The stator coil production machine includes a rotary retainer which retains and moves shaping press pairs along a looped path to press or shape portions of a conductor wire into in-slot portions to be disposed in slots of a stator core and coil-end portions which extend outside the slots. The method comprises a coil-end portion shaping step of bringing press members of each of the shaping press pairs close to each other in sequence to shape the coil-end portions and an in-slot portion shaping step of advancing the shaping press pairs on the looped path in contact with the cam mechanism and also moving selected ones of the shaping press pairs in sequence in a direction perpendicular to the path to shape the in-slot portions.
摘要翻译：定子线圈生产方法和定子线圈生产机。定子线圈用于旋转电机。定子线圈生产机器包括一个旋转保持器，该旋转保持器沿着环形路径保持和移动成形压力机对，以将导体线的一部分压入或形成在槽内部分中以设置在定子芯的槽中，以及延伸在插槽外面该方法包括一个线圈端部形成步骤，使每个成型按压对的按压部件按顺序彼此靠近，以形成线圈端部;以及槽内部分成型步骤，使成型按压对环形路径与凸轮机构接触，并且还在垂直于路径的方向依次移动选定的成型按压对，以形成内槽部分。

8. 发明授权

US08387231B2 Stator coil production method including in-slot portion shaping step and coil-end portion shaping step 有权
标题翻译：定子线圈生产方法，包括槽内部分成形步骤和线圈端部分成形步骤
公开(公告)号：US08387231B2
公开(公告)日：2013-03-05
申请号：US13106145
申请日：2011-05-12
申请人： Daisuke Okushita , Yusuke Hara , Takao Takeuchi , Kiyokazu Futami , Satoshi Nakamura , Fumihiro Nakano
发明人： Daisuke Okushita , Yusuke Hara , Takao Takeuchi , Kiyokazu Futami , Satoshi Nakamura , Fumihiro Nakano
IPC分类号： H02K15/00
CPC分类号： H02K15/0478 , Y10T29/49009 , Y10T29/49071 , Y10T29/53143 , Y10T29/53161
摘要： A stator coil producing method and a stator coil production machine. The stator coil is used in an electric rotating machine. The stator coil production machine includes a rotary retainer which rotates to move shaping press pairs along a looped path. The rotary retainer has retaining holes through which the shaping press pairs are retained. The retaining holes are shaped to permit the shaping press pairs to move along the looped path, thereby pressing or shaping portions of a conductor wire into in-slot portions to be disposed in slots of a stator core and coil-end portions each of which is to extend between adjacent two of the in-slot portions outside the slots. The method comprises an in-slot portion shaping step of shaping portions of the insulator-coated conductor wire into the in-slot portions and a coil-end portion shaping step of shaping portions of the insulator-coated conductor wire into the coil-end portions.
摘要翻译：定子线圈生产方法和定子线圈生产机。定子线圈用于旋转电机。定子线圈生产机器包括旋转保持器，其旋转以沿着循环路径移动成形按压对。旋转保持器具有保持成形按压对的保持孔。保持孔被成形为允许成形按压对沿着环形路径移动，从而将导线的部分压入或成形到插槽部分中以设置在定子芯的槽中，每个线圈端部分是以在狭槽外部的相邻两个槽内部分之间延伸。该方法包括：将绝缘体涂覆的导体线的部分成形为槽内部分的槽内部分成型步骤和将绝缘体涂覆的导体线的部分成形为线圈端部的线圈端部成形步骤。

9. 发明授权

US07628903B1 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07628903B1
公开(公告)日：2009-12-08
申请号：US09563479
申请日：2000-05-02
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3′-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.
摘要翻译：银和银合金电镀浴包括（A）可溶性盐，其具有银盐或银盐和金属如锡，铋，铟，铅等的盐的混合物; 和（B）特定的脂族硫醚化合物，例如硫代双（二甘醇），二硫代双（三甘油），3,3'-硫代二丙醇，硫二甘油，3,6-二硫辛烷-1,8-二醇等，至少一个或多个醚氧原子，1-羟丙基，羟基亚丙基，或分子中的硫原子键中的两个或多个，并且不含碱性氮原子。与分子中含有不含醚氧原子，1-羟丙基，羟基亚丙基或两个或多个硫键的脂族单硫醚化合物如硫二甘醇或β-硫二甘醇相比，具有这些特定化合物，本发明的电镀浴在延长的时间内具有优异的稳定性，优异的银和各种金属的共沉积，以及优异的电沉积外观。

10. 发明申请

US20060147683A1 Flux for soldering and circuit board 审中-公开
标题翻译：用于焊接和电路板的焊剂
公开(公告)号：US20060147683A1
公开(公告)日：2006-07-06
申请号：US11024739
申请日：2004-12-30
申请人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B32B3/00 , C22B9/10
CPC分类号： H05K3/3489 , H05K3/244 , H05K2203/121 , Y10T428/24917
摘要： A flux contains resin having film forming ability, activator, solvent, and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
摘要翻译：助熔剂含有具有成膜能力的树脂，活化剂，溶剂和至少一种选自银络合物和铜络合物的络合物。当在具有化学镀镍的电路上进行焊接或在化学镀镍上进一步具有镀金时，使用焊剂。允许银或铜的阻挡层沉积在焊盘的表面上，抑制镍在焊接期间向熔化的焊料合金中扩散，并且还防止磷浓度。这提高了焊接的接合强度，并且抑制了银和/或铜对除了电路图案之外的部分的还原沉积。

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