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1. 发明授权

US5227041A Dry contact electroplating apparatus 失效
标题翻译：干式电镀设备
公开(公告)号：US5227041A
公开(公告)日：1993-07-13
申请号：US898038
申请日：1992-06-12
申请人： Bruce N. Brogden , Leon P. Brown , Syed A. Husain
发明人： Bruce N. Brogden , Leon P. Brown , Syed A. Husain
IPC分类号： C25D7/12 , H01L21/00 , H01L21/687
CPC分类号： H01L21/67126 , C25D17/001 , C25D7/12 , H01L21/68785
摘要： A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base member. A sealing ring is positioned adjacent to the aperture perimeter. The sealing ring forms a sealing connection with an object to be electroplated. A number of electrical contacts are positioned adjacent to the sealing ring. The electrical contacts form an electrical connection with one side of the object to be electroplated. A lid is positioned on the base member over one side of the central aperture. Thus, the lid protects the electrical contacts and one side of the object to be electroplated, while the other side of the object is exposed to the electroplating solution.
摘要翻译：公开了一种干接触电镀结构。该结构包括用于浸入电镀溶液中的基底构件。基部构件具有由形成在基部构件内的孔周边限定的中心孔。密封环邻近孔周边定位。密封环与要电镀的物体形成密封连接。多个电触点位于密封环附近。电触点与要电镀的物体的一侧形成电连接。盖子位于中心孔的一侧上的基座构件上。因此，盖子保护电触头和要被电镀的物体的一侧，而物体的另一侧暴露于电镀溶液。

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