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1. 发明申请

US20110279919A1 METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT, AND MICROMECHANICAL COMPONENT 有权
标题翻译：制造微电子元件和微机电元件的方法
公开(公告)号：US20110279919A1
公开(公告)日：2011-11-17
申请号：US13057411
申请日：2009-07-06
申请人： Stefan Finkbeiner , Tjalf Pirk , Christoph Friese
发明人： Stefan Finkbeiner , Tjalf Pirk , Christoph Friese
IPC分类号： G02B7/182 , B05D3/10
CPC分类号： B81C1/00166 , B81B2201/033 , B81C2201/014
摘要： A method for manufacturing a micromechanical component is described, including the steps of: forming a first etch stop layer on a base substrate, the first etch stop layer being formed in such a way that it has a first pattern of through-cutouts; forming a first electrode-material layer on the first etch stop layer; forming a second etch stop layer on the first electrode-material layer, the second etch stop layer being formed in such a way that it has a second pattern of through-cutouts differing from the first pattern; forming a second electrode-material layer on the second etch stop layer; forming a patterned mask on the second electrode-material layer; and carrying out a first etching step in a first direction and a second etching step in a second direction counter to the first direction in order to etch at least one first electrode unit out of the first electrode-material layer and to etch at least one second electrode unit out of the second electrode-material layer. Also described are micromechanical components.
摘要翻译：描述了一种用于制造微机械部件的方法，包括以下步骤：在基底基板上形成第一蚀刻停止层，第一蚀刻停止层以这样的方式形成：其具有第一图形的通孔; 在所述第一蚀刻停止层上形成第一电极材料层; 在所述第一电极材料层上形成第二蚀刻停止层，所述第二蚀刻停止层以这样的方式形成：其具有不同于所述第一图案的通孔的第二图案; 在所述第二蚀刻停止层上形成第二电极材料层; 在所述第二电极材料层上形成图案化掩模; 并且在与第一方向相反的第二方向上沿第一方向和第二蚀刻步骤进行第一蚀刻步骤，以便从第一电极材料层中蚀刻至少一个第一电极单元并蚀刻至少一个第二电极单元排出第二电极材料层。还描述了微机械部件。

2. 发明申请

US20060016995A1 Microstructured infrared sensor and method for its manufacture 审中-公开
标题翻译：微结构红外传感器及其制造方法
公开(公告)号：US20060016995A1
公开(公告)日：2006-01-26
申请号：US11150762
申请日：2005-06-10
申请人： Nils Kummer , Roland Mueller-Fiedler , Stefan Finkbeiner , Andre Mueller , Horst Muenzel , Dieter Maurer , Stefan Hiemer , Jurgen Perthold
发明人： Nils Kummer , Roland Mueller-Fiedler , Stefan Finkbeiner , Andre Mueller , Horst Muenzel , Dieter Maurer , Stefan Hiemer , Jurgen Perthold
IPC分类号： G01J5/00
CPC分类号： G01J1/04 , G01J1/0411 , G01J5/02 , G01J5/0215 , G01J5/024 , G01J5/04 , G01J5/045 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0853 , G01J5/0881 , G01J5/12 , G01N21/3504 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/0232 , H01L2924/0002 , H01L2924/00
摘要： A microstructured infrared sensor includes: a sensor chip having a diaphragm; a cavity formed underneath the diaphragm; a thermopile structure formed on the diaphragm and having bonded printed conductors; an absorber layer formed on the thermopile structure for absorbing infrared radiation; and a cap chip attached to the sensor chip. A sensor space is formed between the cap chip and the sensor chip, and the sensor space accommodates the thermopile structure. The infrared sensor also includes a convex lens area for focusing incident infrared radiation onto the absorber layer. The lens area may be formed on the top of the cap chip or on a lens chip attached to the cap chip. The lens area may be formed by drying a dispensed lacquer droplet, or by a softened, structured lacquer cylinder, or by subsequent etching of the dried lacquer droplet and the surrounding substrate material.
摘要翻译：微结构红外传感器包括：具有隔膜的传感器芯片; 形成在隔膜下方的空腔; 形成在隔膜上并具有粘合的印刷导体的热电堆结构; 形成在热电堆结构上用于吸收红外辐射的吸收层; 以及附接到传感器芯片的盖芯片。在盖芯片和传感器芯片之间形成传感器空间，传感器空间容纳热电堆结构。红外传感器还包括用于将入射的红外辐射聚焦到吸收层上的凸透镜区域。透镜区域可以形成在盖芯片的顶部上或附接到盖芯片的透镜芯片上。透镜区域可以通过干燥分配的漆液滴，或通过软化的结构化漆筒，或者通过随后蚀刻干燥的漆液滴和周围的基底材料来形成。

3. 发明申请

US20050022593A1 Fluid flow sensor 审中-公开
标题翻译：流体流量传感器
公开(公告)号：US20050022593A1
公开(公告)日：2005-02-03
申请号：US10900695
申请日：2004-07-27
申请人： Jochen Franz , Matthias Fuertsch , Stefan Finkbeiner , Stefan Weiss , Axel Kaschner
发明人： Jochen Franz , Matthias Fuertsch , Stefan Finkbeiner , Stefan Weiss , Axel Kaschner
IPC分类号： G01F1/684 , G01F1/68
CPC分类号： G01F1/6845
摘要： In a micromechanical sensor and/or a method for manufacturing a micromechanical sensor for detecting a state variable of a substance, the sensor includes at least one heating element, one temperature measuring element and optionally an inlet opening into and/or an outlet opening out of the cavity for this purpose. The sensor includes a cavity configured to at least partially receive the substance through one of the inlet openings and discharge it again at least partially through one of the outlets or outlet openings. The at least one state variable of the substance is detected here as a function of at least one variable representing the operation of the at least one heating element and/or the operation of the at least one temperature element.
摘要翻译：在微机械传感器和/或用于制造用于检测物质的状态变量的微机械传感器的方法中，传感器包括至少一个加热元件，一个温度测量元件和可选地入口和/或出口开口为此目的的腔。该传感器包括被配置成至少部分地通过其中一个入口开口接收物质的空腔，并再次至少部分地通过其中一个出口或出口排出。物质的至少一个状态变量在此被视为表示至少一个加热元件的操作和/或至少一个温度元件的操作的至少一个变量的函数。

4. 发明申请

US20100252939A1 CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE 有权
标题翻译：芯片模块和生产芯片模块的方法
公开(公告)号：US20100252939A1
公开(公告)日：2010-10-07
申请号：US12721785
申请日：2010-03-11
申请人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
发明人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
IPC分类号： H01L23/488 , H01L21/78 , H01L21/60
CPC分类号： H01L21/568 , B81B7/0074 , B81C2203/0154 , G01R33/0206 , H01L21/561 , H01L23/3107 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L2224/04105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/181 , H01L2924/00
摘要： A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.
摘要翻译：提供了一种具有基板和至少一个连接到该基板的芯片的芯片模块，该基板具有第一主平面延伸部分，该芯片具有第二主平面延伸部分，并且锐角设置在第一主平面延伸部分和第二主延伸平面，并且基板还包括模具壳体。

5. 发明授权

US07740459B2 Micropump having a pump diaphragm and a polysilicon layer 失效
标题翻译：微泵具有泵膜和多晶硅层
公开(公告)号：US07740459B2
公开(公告)日：2010-06-22
申请号：US10564370
申请日：2004-07-07
申请人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
发明人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
IPC分类号： F04B17/03
CPC分类号： F04B43/043
摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.
摘要翻译：用于制造微机械部件的方法，优选用于具有空腔的流体应用。该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。将具有第一图案的第一蚀刻停止层施加到基板。第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。具有第二图案的第二蚀刻停止层被施加到第一功能层。第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。将蚀刻掩模施加到第二功能层。通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

6. 发明授权

US07354786B2 Sensor element with trenched cavity 有权
标题翻译：带沟槽的传感器元件
公开(公告)号：US07354786B2
公开(公告)日：2008-04-08
申请号：US11223592
申请日：2005-09-08
申请人： Hubert Benzel , Stefan Finkbeiner , Matthias Illing , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
发明人： Hubert Benzel , Stefan Finkbeiner , Matthias Illing , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
IPC分类号： H01L21/00
CPC分类号： G01L9/0045 , B81B2203/0315 , B81C1/00182 , G01P15/0802
摘要： A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression. A passivation process is then carried out in that first phase, in which the concavity produced in the walls of the depression by the first trenching step is covered with a passivation material. The first trenching step and the first passivation process may be carried out repeatedly in alternating succession within the first phase, with the result that a typical corrugation is obtained on the walls of the depression so produced. In the second phase of the trench etching process, the cavity is produced through the at least one access hole produced by the depression, by carrying out a second trenching step of a predetermined second time period that is distinctly longer in comparison with the first time period.
摘要翻译：微机械传感器元件和用于生产微机械传感器元件的方法，其适用于例如微机械部件中，用于检测物理量。为传感器元件提供包括基板，进入孔和埋入空腔的设置，通过沟槽蚀刻和/或特别地，各向同性蚀刻工艺在基板中产生至少一个访问孔和空腔。沟槽蚀刻工艺包括可分为第一相和第二相的不同的开沟（沟槽蚀刻）步骤。因此，在第一阶段中，执行至少一个第一开沟步骤，其中在可预定的第一时间段内将材料从衬底中蚀刻出来并产生凹陷。在挖沟步骤中，在凹陷的壁上产生典型的凹陷。然后在第一阶段进行钝化处理，其中通过第一开挖步骤在凹陷的壁中产生的凹陷被钝化材料覆盖。第一开沟步骤和第一钝化工艺可以在第一阶段内连续交替重复进行，结果是在如此制造的凹陷的壁上获得典型的波纹。在沟槽蚀刻工艺的第二阶段，通过执行与第一时间段相比明显更长的预定第二时间段的第二开沟步骤，通过由凹陷产生的至少一个访问孔产生空腔。

7. 发明申请

US20060186085A1 Method for the production of a micromechanical part preferably used for fluidic applications, and micropump comprising a pump membrane made of a polysilicon layer 失效
标题翻译：用于生产优选用于流体应用的微机械部件的方法以及包括由多晶硅层制成的泵膜的微型泵
公开(公告)号：US20060186085A1
公开(公告)日：2006-08-24
申请号：US10564370
申请日：2004-07-07
申请人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
发明人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
IPC分类号： C23F1/00 , F04B17/00
CPC分类号： F04B43/043
摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.
摘要翻译：用于制造微机械部件的方法，优选用于具有空腔的流体应用。该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。将具有第一图案的第一蚀刻停止层施加到基板。第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。具有第二图案的第二蚀刻停止层被施加到第一功能层。第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。将蚀刻掩模施加到第二功能层。通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

8. 发明申请

US20060057816A1 Sensor element with trenched cavity 有权
标题翻译：带沟槽的传感器元件
公开(公告)号：US20060057816A1
公开(公告)日：2006-03-16
申请号：US11223592
申请日：2005-09-08
申请人： Hubert Benzel , Stefan Finkbeiner , Matthias Illing , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
发明人： Hubert Benzel , Stefan Finkbeiner , Matthias Illing , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
IPC分类号： H01L21/76
CPC分类号： G01L9/0045 , B81B2203/0315 , B81C1/00182 , G01P15/0802
摘要： A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression. A passivation process is then carried out in that first phase, in which the concavity produced in the walls of the depression by the first trenching step is covered with a passivation material. The first trenching step and the first passivation process may be carried out repeatedly in alternating succession within the first phase, with the result that a typical corrugation is obtained on the walls of the depression so produced. In the second phase of the trench etching process, the cavity is produced through the at least one access hole produced by the depression, by carrying out a second trenching step of a predetermined second time period that is distinctly longer in comparison with the first time period.
摘要翻译：微机械传感器元件和用于生产微机械传感器元件的方法，其适用于例如微机械部件中，用于检测物理量。为传感器元件提供包括基板，进入孔和埋入空腔的设置，通过沟槽蚀刻和/或特别地，各向同性蚀刻工艺在基板中产生至少一个访问孔和空腔。沟槽蚀刻工艺包括可分为第一相和第二相的不同的开沟（沟槽蚀刻）步骤。因此，在第一阶段中，执行至少一个第一开沟步骤，其中在可预定的第一时间段内将材料从衬底中蚀刻出来并产生凹陷。在挖沟步骤中，在凹陷的壁上产生典型的凹陷。然后在第一阶段进行钝化处理，其中通过第一开挖步骤在凹陷的壁中产生的凹陷被钝化材料覆盖。第一开沟步骤和第一钝化工艺可以在第一阶段内连续交替重复进行，结果是在如此制造的凹陷的壁上获得典型的波纹。在沟槽蚀刻工艺的第二阶段，通过执行与第一时间段相比明显更长的预定第二时间段的第二开沟步骤，通过由凹陷产生的至少一个访问孔产生空腔。

9. 发明申请

US20060037932A1 Method and micromechanical component 审中-公开
标题翻译：方法和微机械部件
公开(公告)号：US20060037932A1
公开(公告)日：2006-02-23
申请号：US10529425
申请日：2003-02-27
申请人： Gerhard Lammel , Frank Schaefer , Heribert Weber , Stefan Finkbeiner
发明人： Gerhard Lammel , Frank Schaefer , Heribert Weber , Stefan Finkbeiner
IPC分类号： C23F1/00
CPC分类号： B81C1/00476 , B81B2201/12 , B81B2203/0118 , B81C2201/0109 , B81C2201/0115
摘要： A manufacturing method and a micromechanical component are provided in which porous silicon is used as sacrificial layer and a functional layer is exposed by etching off the sacrificial layer.
摘要翻译：提供了制造方法和微机械部件，其中使用多孔硅作为牺牲层，并且通过蚀刻除去牺牲层而暴露功能层。

10. 发明申请

US20050133880A1 Electrical through-plating of semiconductor chips 失效
标题翻译：半导体芯片的电穿膜
公开(公告)号：US20050133880A1
公开(公告)日：2005-06-23
申请号：US11016617
申请日：2004-12-17
申请人： Hubert Benzel , Stefan Finkbeiner , Christoph Schelling , Julian Gonska
发明人： Hubert Benzel , Stefan Finkbeiner , Christoph Schelling , Julian Gonska
IPC分类号： B81B3/00 , B81B7/00 , B81C1/00 , G02B26/00 , G02B26/08
CPC分类号： B81B7/0006 , G02B26/0833
摘要： A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.
摘要翻译：描述了使用该方法制造微机械部件和微机械部件的方法，该微机械部件具有第一基板，该第一基板又具有至少一个空腔和一个印刷导体。印刷导体的至少一部分被施加到空腔的至少一部分壁。特别地，空腔的地板被认为是腔壁的一部分。

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