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1. 发明申请

US20110128004A1 APPARATUS FOR INSPECTING LIGHT EMITTING DIODE PACKAGE AND INSPECTING METHOD USING THE SAME 有权
标题翻译：用于检测发光二极管封装的装置和使用其的检查方法
公开(公告)号：US20110128004A1
公开(公告)日：2011-06-02
申请号：US12957931
申请日：2010-12-01
申请人： Ssang Gun LIM , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
发明人： Ssang Gun LIM , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
IPC分类号： G01R31/00
CPC分类号： H01L21/67271 , G09G3/14 , H01L21/67259 , H01L21/67282 , H01L21/67294 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.
摘要翻译：提供了用于检查发光二极管（LED）封装的装置以检查LED以确定其是否有缺陷，并且当LED发生故障时丢弃LED。用于检查LED封装的装置包括：检查单元，通过目视检查来检查LED，以确定LED是否有缺陷; 以及当从所述检查单元提供的LED中的所述检查单元的检查结果，当所述LED被确定为有缺陷时，丢弃所述LED的缺陷产品拒绝单元。由于检查LED和丢弃有缺陷的LED的操作是自动化的，并且可以作为顺序处理快速处理，因此可以提高生产率。

2. 发明授权

US07092105B2 Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object 有权
标题翻译：使用由对象反射的光的颜色信息来测量物体的三维表面形状的方法和装置
公开(公告)号：US07092105B2
公开(公告)日：2006-08-15
申请号：US10473089
申请日：2001-10-31
申请人： Ssang-Gun Lim , Gee-Hong Kim , Yi-Bae Choi , Sang-Yoon Lee
发明人： Ssang-Gun Lim , Gee-Hong Kim , Yi-Bae Choi , Sang-Yoon Lee
IPC分类号： G01B11/24
CPC分类号： G01B11/2509 , G01B2210/50
摘要： A method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object. The method and apparatus for measuring the three-dimensional surface shape of the object, in which a real-time measurement of the three-dimensional surface is performed by projecting a beam of light having color information onto the object and detecting color distribution information according to levels of the object, thereby obtaining level information of the object.
摘要翻译：一种使用由对象反射的光的颜色信息来测量对象的三维表面形状的方法和装置。用于测量物体的三维表面形状的方法和装置，其中通过将具有颜色信息的光束投射到物体上并且根据以下方式检测颜色分布信息来进行三维表面的实时测量对象的级别，从而获得对象的级别信息。

3. 发明授权

US08890533B2 Apparatus for inspecting light emitting diode package and inspecting method using the same 有权
标题翻译：用于检查发光二极管封装的装置和使用其的检查方法
公开(公告)号：US08890533B2
公开(公告)日：2014-11-18
申请号：US12957931
申请日：2010-12-01
申请人： Ssang Gun Lim , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
发明人： Ssang Gun Lim , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
IPC分类号： H01L21/00 , H01L21/67 , G09G3/14
CPC分类号： H01L21/67271 , G09G3/14 , H01L21/67259 , H01L21/67282 , H01L21/67294 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.
摘要翻译：提供了用于检查发光二极管（LED）封装的装置以检查LED以确定其是否有缺陷，并且当LED发生故障时丢弃LED。用于检查LED封装的装置包括：检查单元，通过目视检查来检查LED，以确定LED是否有缺陷; 以及当从所述检查单元提供的LED中的所述检查单元的检查结果，当所述LED被确定为有缺陷时，丢弃所述LED的缺陷产品拒绝单元。由于检查LED和丢弃有缺陷的LED的操作是自动化的，并且可以作为顺序处理快速处理，因此可以提高生产率。

4. 发明申请

US20100171963A1 APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE 审中-公开
标题翻译：三维形状测量装置
公开(公告)号：US20100171963A1
公开(公告)日：2010-07-08
申请号：US12601973
申请日：2008-05-28
申请人： Sang-yun Lee , Min-gu Kang , Ssang-gun Lim
发明人： Sang-yun Lee , Min-gu Kang , Ssang-gun Lim
IPC分类号： G01B11/25
CPC分类号： G01B11/2441 , G01B9/02028 , G01B9/0209 , G01B2290/35
摘要： A 3D shape measuring apparatus is disclosed, which is capable of simultaneously obtaining interference fringes of the lowest point and the highest point, by comprising a reflection path controller that generates a reference plane reflection path equal to a reflection path from a lowest point, and a reference plane reflection path equal to a reflection path from a highest point, the lowest and the highest points of a measured object having a height difference.
摘要翻译：公开了一种能够同时获得最低点和最高点的干涉条纹的3D形状测量装置，包括：反射路径控制器，其从最低点生成等于反射路径的参考平面反射路径;以及参考平面反射路径等于来自最高点的反射路径，测量对象的最低点和最高点具有高度差。

5. 发明授权

US08155483B2 Apparatus for and method of measuring image 有权
标题翻译：用于测量图像的装置和方法
公开(公告)号：US08155483B2
公开(公告)日：2012-04-10
申请号：US12090592
申请日：2006-10-18
申请人： Sang-yoon Lee , Min-gu Kang , Ssang-gun Lim
发明人： Sang-yoon Lee , Min-gu Kang , Ssang-gun Lim
IPC分类号： G06K9/20
CPC分类号： G01B9/04
摘要： An image measuring apparatus for enhancing an accuracy of an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating white light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a piezoelectric actuator for controlling a minute height of the optical system with respect to the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller and the piezoelectric actuator when an enable signal is generated from the CCD camera, and an image signal processor for estimating height information of the object from data transmitted from the image capturing unit.
摘要翻译：公开了一种用于提高由光学系统捕获的图像的精度的图像测量装置及其方法。该装置包括用于捕获物体并输出拍摄图像的CCD照相机，用于产生白光以照亮被摄体的拍摄区域的灯，用于控制被导通的灯的照明控制器，用于控制分钟的压电致动器相对于物体的光学系统的高度，用于获取由CCD照相机拍摄的图像的图像捕获装置，当从该照相机产生使能信号时，将驱动信号输出到照明控制器和压电致动器的驱动信号发生器 CCD摄像机和图像信号处理器，用于根据从图像捕获单元发送的数据来估计物体的高度信息。

6. 发明申请

US20100259765A1 SURFACE SHAPE MEASURING SYSTEM AND SURFACE SHAPE MEASURING METHOD USING THE SAME 有权
标题翻译：表面形状测量系统和表面形状测量方法
公开(公告)号：US20100259765A1
公开(公告)日：2010-10-14
申请号：US12747763
申请日：2008-12-10
申请人： Sang-yun Lee , MinGu Kang , Ssang-gun Lim
发明人： Sang-yun Lee , MinGu Kang , Ssang-gun Lim
IPC分类号： G01B11/24
CPC分类号： G01B11/2441
摘要： The surface shape measuring system includes an illumination unit including a main light source, a focusing lens, and a projection lens; a beam splitter to split illumination light emitted respectively irradiated onto a reference surface and a measurement surface; a light detecting element to capture an interference pattern; and a control computer to obtain surface shape data through white-light interference pattern analysis from an image captured and detect whether or not the measurement surface is defective from the obtained data, wherein a subsidiary light source to provide falling illumination to the target object; and two-dimensional data and three-dimensional data regarding the surface shape of the target object are obtained by selectively intermitting the turning-on of the main light source and the subsidiary light source and the irradiation of the illumination light onto the reference surface.
摘要翻译：所述表面形状测量系统包括：包括主光源，聚焦透镜和投影透镜的照明单元; 分光器，用于将分别照射到参考表面和测量表面上的照射光分离; 用于捕获干涉图案的光检测元件; 以及控制计算机，通过从所拍摄的图像通过白光干涉图案分析获得表面形状数据，并从所获得的数据检测测量表面是否有缺陷，其中辅助光源向目标物体提供落下的照明; 并且通过选择性地将主光源和辅助光源的接通以及照射光照射到参考表面上来获得关于目标物体的表面形状的二维数据和三维数据。

7. 发明申请

US20100141937A1 APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE 有权
标题翻译：执行半导体封装的非接触测试的设备
公开(公告)号：US20100141937A1
公开(公告)日：2010-06-10
申请号：US12632960
申请日：2009-12-08
申请人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
发明人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
IPC分类号： G01N21/00
CPC分类号： G01R31/2656 , G01N21/95684
摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
摘要翻译：测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于焊球的形状，尺寸或位置。倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息焊球与球地。倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。

8. 发明授权

US09218050B2 Method and device for transmitting/receiving image data at high speed 有权
标题翻译：用于高速发送/接收图像数据的方法和装置
公开(公告)号：US09218050B2
公开(公告)日：2015-12-22
申请号：US13824713
申请日：2011-09-28
申请人： Min-Gu Kang , Ja-Chul Ku , Sang-Yoon Lee , Ssang-Gun Lim
发明人： Min-Gu Kang , Ja-Chul Ku , Sang-Yoon Lee , Ssang-Gun Lim
IPC分类号： G06F3/00 , G06T1/60 , H04N5/765
CPC分类号： G06F3/005 , G06T1/60 , H04N5/765
摘要： Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.
摘要翻译：提供了一种以高速发送和接收图像数据的方法，其包括以与传输信道的带宽相对应的速度通过一个或多个传输信道顺序地发送从图像传感器输出的图像数据，并且顺序地记录通过帧存储器中的一个或多个传输信道具有对应于通过对相应的一个或多个传输信道的带宽求和而获得的总带宽的速度，以及用于实现该方法的装置。

9. 发明申请

US20130176443A1 METHOD AND DEVICE FOR TRANSMITTING/RECEIVING IMAGE DATA AT HIGH SPEED 有权
标题翻译：用于高速发送/接收图像数据的方法和装置
公开(公告)号：US20130176443A1
公开(公告)日：2013-07-11
申请号：US13824713
申请日：2011-09-28
申请人： Min-Gu Kang , Ja-Chul Ku , Sang-Yoon Lee , Ssang-Gun Lim
发明人： Min-Gu Kang , Ja-Chul Ku , Sang-Yoon Lee , Ssang-Gun Lim
IPC分类号： G06F3/00
CPC分类号： G06F3/005 , G06T1/60 , H04N5/765
摘要： Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.
摘要翻译：提供了一种以高速发送和接收图像数据的方法，其包括以与传输信道的带宽相对应的速度通过一个或多个传输信道顺序地发送从图像传感器输出的图像数据，并且顺序地记录通过帧存储器中的一个或多个传输信道具有对应于通过对相应的一个或多个传输信道的带宽求和而获得的总带宽的速度，以及用于实现该方法的装置。

10. 发明授权

US08319961B2 Apparatus to perform a non-contact test of a semiconductor package 有权
标题翻译：用于执行半导体封装的非接触测试的装置
公开(公告)号：US08319961B2
公开(公告)日：2012-11-27
申请号：US12632960
申请日：2009-12-08
申请人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
发明人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
IPC分类号： G01N21/00
CPC分类号： G01R31/2656 , G01N21/95684
摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
摘要翻译：测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于焊球的形状，尺寸或位置。倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息焊球与球地。倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。

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