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1. 发明申请

US20100141937A1 APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE 有权
标题翻译：执行半导体封装的非接触测试的设备
公开(公告)号：US20100141937A1
公开(公告)日：2010-06-10
申请号：US12632960
申请日：2009-12-08
申请人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
发明人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
IPC分类号： G01N21/00
CPC分类号： G01R31/2656 , G01N21/95684
摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
摘要翻译：测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于焊球的形状，尺寸或位置。倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息焊球与球地。倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。

2. 发明授权

US08319961B2 Apparatus to perform a non-contact test of a semiconductor package 有权
标题翻译：用于执行半导体封装的非接触测试的装置
公开(公告)号：US08319961B2
公开(公告)日：2012-11-27
申请号：US12632960
申请日：2009-12-08
申请人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
发明人： Chang-Hyun Ryu , Ssang-Gun Lim , Dong-Hae Son , Poom-Seong Park
IPC分类号： G01N21/00
CPC分类号： G01R31/2656 , G01N21/95684
摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
摘要翻译：测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于焊球的形状，尺寸或位置。倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息焊球与球地。倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。

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