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1. 发明授权

US08408747B2 Light emitting devices having heat-dissipating surface 有权
标题翻译：具有散热面的发光装置
公开(公告)号：US08408747B2
公开(公告)日：2013-04-02
申请号：US12575317
申请日：2009-10-07
申请人： Kung-Hsia Wang , Ra-Min Tain , Ping-Hsin Hsia , Hsien-Chang Lee , Shu-Jung Yang , Chao-Hsien Chang
发明人： Kung-Hsia Wang , Ra-Min Tain , Ping-Hsin Hsia , Hsien-Chang Lee , Shu-Jung Yang , Chao-Hsien Chang
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/004 , F21V29/89 , F21V31/005 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode.
摘要翻译：发光装置可以包括散热基座，发光单元，外壳以及第一导电触点和第二导电触点。散热基座具有顶部和底部。散热基座的底部可包括暴露的散热表面。发光单元在散热基座的顶部之上，并且布置成至少从发光单元向散热基底提供导热性。发光单元可以包括用于发光的至少一个发光二极管和第一电极和第二电极。可以在发光二极管发光时产生热量，并且至少一个发光二极管可以具有用于接收输入到至少一个发光二极管的功率的电力输入端子。电源输入可以包括交流输入和直流输入之一。第一电极和第二电极与至少一个发光二极管的输入端电耦合。壳体包围发光单元的至少一部分并且覆盖散热基座的顶部。第一导电接触和第二导电接触靠近或低于散热基部的一部分，并且被配置为接收外部电源。第一导电接触可以与第一电极电耦合，并且第二导电接触可以与第二电极电耦合。

2. 发明授权

US08283613B2 Heat-pipe electric-power generating device 有权
标题翻译：热管式发电装置
公开(公告)号：US08283613B2
公开(公告)日：2012-10-09
申请号：US11562420
申请日：2006-11-22
申请人： Ra-Min Tain , Shu-Jung Yang , Yu-Lin Chao , Yao-Shun Chen , Shyi-Ching Liau
发明人： Ra-Min Tain , Shu-Jung Yang , Yu-Lin Chao , Yao-Shun Chen , Shyi-Ching Liau
IPC分类号： H05B6/10 , F03C1/00 , F01K23/06 , H02K5/12 , H02K49/00
CPC分类号： F01K13/006 , F01K21/02
摘要： A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.
摘要翻译：提供了一种能够将热能转换成电能的热管式发电装置。该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。电极结构用于引出电力。热管保持密封状态。此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。

3. 发明授权

US07586126B2 Light emitting diode lighting module with improved heat dissipation structure 有权
标题翻译：发光二极管照明模块具有改进的散热结构
公开(公告)号：US07586126B2
公开(公告)日：2009-09-08
申请号：US11531234
申请日：2006-09-12
申请人： Shu Jung Yang , Ran Min Tain
发明人： Shu Jung Yang , Ran Min Tain
IPC分类号： H01L33/00 , H01L23/46
CPC分类号： H01L25/0753 , G02F1/133603 , G02F2001/133628 , H01L33/648 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) lighting module with an improved heat dissipative structure comprises a plurality of the LEDs and a heat pipe apparatus on which at least a circuit layer is provided. The circuit layer is directly formed on an electrical insulation layer with superior heat conductivity on a surface of the heat pipe apparatus. The LEDs are electrically connected to the circuit layer. Furthermore, the heat pipe apparatus can be a flat heat pipe or the combination of plate-shaped heat pipes, heat sinks and a fan. Because the LEDs are directly mounted on the surface of the heat pipe apparatus, the heat generated by the lighting LEDs is effectively delivered to the atmosphere due to the reaction of latent heat phase transformation in the heat pipe apparatus. Moreover, the heat is delivered to the heat sinks at far sides for heat exchange so that improved heat dissipation and a space saving result are achieved.
摘要翻译：具有改善的散热结构的发光二极管（LED）照明模块包括多个LED和至少设置有电路层的热管装置。电路层直接形成在热管装置的表面上具有优良导热性的电绝缘层上。 LED电连接到电路层。此外，热管装置可以是平坦的热管或板状热管，散热器和风扇的组合。由于LED直接安装在热管装置的表面上，所以由于在热管装置中的潜热相变的反应，照明用LED产生的热量被有效地输送到大气中。此外，热量被输送到远侧的散热器进行热交换，从而实现了改善的散热和节省空间的结果。

4. 发明授权

US07683522B2 Composite mode transducer and cooling device having the composite mode transducer 失效
标题翻译：复合模式换能器和具有复合模式换能器的冷却装置
公开(公告)号：US07683522B2
公开(公告)日：2010-03-23
申请号：US12068722
申请日：2008-02-11
申请人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
发明人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
IPC分类号： H01L41/08 , H01L41/09 , H02N2/00 , F28G13/00
CPC分类号： H01L41/0906
摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
摘要翻译：公开了一种用于散热由发热元件产生的热的复合模式换能器。复合模式换能器包括换能模块和连接元件。换能模块包括并联连接的第一和第二换能元件。连接元件连接到第一和第二换能元件的共振节点。第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。因此，克服了现有技术的缺点。本发明还提供一种具有复合模式换能器的冷却装置。

5. 发明申请

US20090294947A1 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装结构及其制造方法
公开(公告)号：US20090294947A1
公开(公告)日：2009-12-03
申请号：US12464873
申请日：2009-05-13
申请人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
发明人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
IPC分类号： H01L23/34 , H01L21/50 , H01L25/11
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.
摘要翻译：芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。此外，导热层具有暴露信号通孔的第一开口。信号触点分别设置在第一开口中并连接到信号通路。模塑料封装芯片。

6. 发明授权

US07567015B2 Composite mode transducer and cooling device having the composite mode transducer 失效
标题翻译：复合模式换能器和具有复合模式换能器的冷却装置
公开(公告)号：US07567015B2
公开(公告)日：2009-07-28
申请号：US11594832
申请日：2006-11-09
申请人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
发明人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
IPC分类号： H01L41/08
CPC分类号： H01L41/0906
摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
摘要翻译：公开了一种用于散热由发热元件产生的热的复合模式换能器。复合模式换能器包括换能模块和连接元件。换能模块包括并联连接的第一和第二换能元件。连接元件连接到第一和第二换能元件的共振节点。第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。因此，克服了现有技术的缺点。本发明还提供一种具有复合模式换能器的冷却装置。

7. 发明申请

US20070151969A1 HEAT-PIPE ELECTRIC-POWER GENERATING DEVICE 有权
标题翻译：热管式发电装置
公开(公告)号：US20070151969A1
公开(公告)日：2007-07-05
申请号：US11562420
申请日：2006-11-22
申请人： Ra-Min Tain , Shu-Jung Yang , Yu-Lin Chao , Yao-Shun Chen , Shyi-Ching Liau
发明人： Ra-Min Tain , Shu-Jung Yang , Yu-Lin Chao , Yao-Shun Chen , Shyi-Ching Liau
IPC分类号： H05B6/10
CPC分类号： F01K13/006 , F01K21/02
摘要： A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.
摘要翻译：提供了一种能够将热能转换成电能的热管式发电装置。该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。电极结构用于引出电力。热管保持密封状态。此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。

8. 发明申请

US20060130506A1 Ultrasonic atomizing cooling apparatus 失效
公开(公告)号：US20060130506A1
公开(公告)日：2006-06-22
申请号：US11128349
申请日：2005-05-13
申请人： Ra-Min Tain , Shu-Jung Yang
发明人： Ra-Min Tain , Shu-Jung Yang
IPC分类号： F25D17/02 , F25D23/12 , F28D5/00
CPC分类号： F25B39/02 , B05B17/0615 , F25B19/02 , F25B2339/021 , F28F13/02 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： An ultrasonic atomizing cooling apparatus is provided. The ultrasonic atomizing cooling apparatus includes a container having working fluid contained therein, an ultrasonic vibration device, a heat-exchange chamber and an atomized droplet passage and a vapor passage made of flexible tubes. By ultrasonically vibrating the working fluid in the container, atomized droplets are generated. The atomized droplets, driven by a fan or a propeller, cause a pressure difference between the atomized droplet passage and the container. The pressure difference propels the atomized droplets to the atomized droplet passage, and sprays the droplets onto a wall surface of the heat-exchange chamber that is in contact with a heat-producing body. The heat-producing body is cooled down. Depending on the position orientation of the heat-producing body, the spraying direction of the present apparatus can be changed. The flexibility of use of the present apparatus is increased.

9. 发明申请

US20100085754A1 LIGHT EMITTING DEVICES HAVING HEAT-DISSIPATING SURFACE 有权
标题翻译：具有散热表面的发光装置
公开(公告)号：US20100085754A1
公开(公告)日：2010-04-08
申请号：US12575317
申请日：2009-10-07
申请人： Kung-Hsia Wang , Ra-Min Tain , Ping-Hsin Hsia , Hsien-Chang Lee , Shu-Jung Yang , Chao-Hsien Chang
发明人： Kung-Hsia Wang , Ra-Min Tain , Ping-Hsin Hsia , Hsien-Chang Lee , Shu-Jung Yang , Chao-Hsien Chang
IPC分类号： F21S4/00
CPC分类号： F21V29/74 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/004 , F21V29/89 , F21V31/005 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode.
摘要翻译：发光装置可以包括散热基座，发光单元，外壳以及第一导电触点和第二导电触点。散热基座具有顶部和底部。散热基座的底部可包括暴露的散热表面。发光单元在散热基座的顶部之上，并且布置成至少从发光单元向散热基底提供导热性。发光单元可以包括用于发光的至少一个发光二极管和第一电极和第二电极。可以在发光二极管发光时产生热量，并且至少一个发光二极管可以具有用于接收输入到至少一个发光二极管的功率的电力输入端子。电源输入可以包括交流输入和直流输入之一。第一电极和第二电极与至少一个发光二极管的输入端电耦合。壳体包围发光单元的至少一部分并且覆盖散热基座的顶部。第一导电接触和第二导电接触靠近或低于散热基部的一部分，并且被配置为接收外部电源。第一导电接触可以与第一电极电耦合，并且第二导电接触可以与第二电极电耦合。

10. 发明授权

US07610769B2 Ultrasonic atomizing cooling apparatus 失效
标题翻译：超声波雾化冷却装置
公开(公告)号：US07610769B2
公开(公告)日：2009-11-03
申请号：US11128349
申请日：2005-05-13
申请人： Ra Min Tain , Shu Jung Yang
发明人： Ra Min Tain , Shu Jung Yang
IPC分类号： F25D23/12
CPC分类号： F25B39/02 , B05B17/0615 , F25B19/02 , F25B2339/021 , F28F13/02 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： An ultrasonic atomizing cooling apparatus is provided. The ultrasonic atomizing cooling apparatus includes a container having working fluid contained therein, an ultrasonic vibration device, a heat-exchange chamber and an atomized droplet passage and a vapor passage made of flexible tubes. By ultrasonically vibrating the working fluid in the container, atomized droplets are generated. The atomized droplets, driven by a fan or a propeller, cause a pressure difference between the atomized droplet passage and the container. The pressure difference propels the atomized droplets to the atomized droplet passage, and sprays the droplets onto a wall surface of the heat-exchange chamber that is in contact with a heat-producing body. The heat-producing body is cooled down. Depending on the position orientation of the heat-producing body, the spraying direction of the present apparatus can be changed. The flexibility of use of the present apparatus is increased.
摘要翻译：提供超声波雾化冷却装置。超声波雾化冷却装置包括容纳有工作流体的容器，超声波振动装置，热交换室和雾化液滴通道以及由柔性管构成的蒸气通路。通过对容器中的工作流体进行超声波振动，产生雾化液滴。由风扇或螺旋桨驱动的雾化液滴在雾化液滴通道和容器之间产生压力差。压力差将雾化液滴推到雾化液滴通道，并将液滴喷射到与发热体接触的热交换室的壁面上。发热体被冷却。根据制热体的位置取向，能够改变本装置的喷射方向。本装置的灵活性增加。

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