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1. 发明授权

US07205719B2 Light source with LED and optical protrusions 有权
标题翻译：光源与LED和光学突起
公开(公告)号：US07205719B2
公开(公告)日：2007-04-17
申请号：US11023692
申请日：2004-12-27
申请人： Ra-Min Tain , Hei-Tong Ching , Chin-Lung Chen , Rong-Chang Fang
发明人： Ra-Min Tain , Hei-Tong Ching , Chin-Lung Chen , Rong-Chang Fang
IPC分类号： H05B33/00
CPC分类号： G02F1/133603 , F21K9/00 , G02F1/133606 , G02F2001/133628
摘要： A light source with LED and optical protrusions is provided. It comprises an optical panel and at least one optical plate. The light source can be used together with a heat sink or an optical element to enhance its performance. The optical panel forms an optical surface having plural optical protrusions to reflect and mix lights emitted from the LEDs. The optical plate is inserted into at least one slot on the optical panel, and it comprises a heat dissipation core plate and at least one electric circuit layer. The electric circuit layer comprises LEDs and at least one control circuitry. The electric circuit layer can be attached to either single side or both sides of the heat dissipation core plate. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.
摘要翻译：提供具有LED和光学突起的光源。它包括光学面板和至少一个光学板。光源可以与散热器或光学元件一起使用以增强其性能。光学面板形成具有多个光学突起的光学表面，以反射和混合从LED发出的光。光学板被插入到光学面板上的至少一个槽中，并且其包括散热芯板和至少一个电路层。电路层包括LED和至少一个控制电路。电路层可以安装在散热芯板的单侧或两侧。本发明实现了具有所需色度的组合光的均匀性和高强度。

2. 发明申请

US20060138951A1 Light source with LED and optical protrusions 有权
标题翻译：光源与LED和光学突起
公开(公告)号：US20060138951A1
公开(公告)日：2006-06-29
申请号：US11023692
申请日：2004-12-27
申请人： Ra-Min Tain , Hei-Tong Ching , Chin-Lung Chen , Rong-Chang Fang
发明人： Ra-Min Tain , Hei-Tong Ching , Chin-Lung Chen , Rong-Chang Fang
IPC分类号： H05B37/02 , H01L33/00
CPC分类号： G02F1/133603 , F21K9/00 , G02F1/133606 , G02F2001/133628
摘要： A light source with LED and optical protrusions is provided. It comprises an optical panel and at least one optical plate. The light source can be used together with a heat sink or an optical element to enhance its performance. The optical panel forms an optical surface having plural optical protrusions to reflect and mix lights emitted from the LEDs. The optical plate is inserted into at least one slot on the optical panel, and it comprises a heat dissipation core plate and at least one electric circuit layer. The electric circuit layer comprises LEDs and at least one control circuitry. The electric circuit layer can be attached to either single side or both sides of the heat dissipation core plate. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.
摘要翻译：提供具有LED和光学突起的光源。它包括光学面板和至少一个光学板。光源可以与散热器或光学元件一起使用以增强其性能。光学面板形成具有多个光学突起的光学表面，以反射和混合从LED发出的光。光学板被插入到光学面板上的至少一个槽中，并且其包括散热芯板和至少一个电路层。电路层包括LED和至少一个控制电路。电路层可以安装在散热芯板的单侧或两侧。本发明实现了具有所需色度的组合光的均匀性和高强度。

3. 发明申请

US20090294947A1 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装结构及其制造方法
公开(公告)号：US20090294947A1
公开(公告)日：2009-12-03
申请号：US12464873
申请日：2009-05-13
申请人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
发明人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
IPC分类号： H01L23/34 , H01L21/50 , H01L25/11
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.
摘要翻译：芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。此外，导热层具有暴露信号通孔的第一开口。信号触点分别设置在第一开口中并连接到信号通路。模塑料封装芯片。

4. 发明授权

US08004079B2 Chip package structure and manufacturing method thereof 有权
标题翻译：芯片封装结构及其制造方法
公开(公告)号：US08004079B2
公开(公告)日：2011-08-23
申请号：US12464873
申请日：2009-05-13
申请人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
发明人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.
摘要翻译：芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。此外，导热层具有暴露信号通孔的第一开口。信号触点分别设置在第一开口中并连接到信号通路。模塑料封装芯片。

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