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1. 发明授权

US08296947B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US08296947B2
公开(公告)日：2012-10-30
申请号：US12506213
申请日：2009-07-20
申请人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

2. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

3. 发明授权

US07493940B2 Heat dissipation device having mounting brackets 失效
标题翻译：具有安装支架的散热装置
公开(公告)号：US07493940B2
公开(公告)日：2009-02-24
申请号：US11309841
申请日：2006-10-10
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
IPC分类号： F24H3/02 , F28F9/00 , H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
摘要翻译：散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。挡板终止于保持板（28）。多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

4. 发明授权

US08341842B2 Method of manufacturing heat sink 有权
标题翻译：制造散热片的方法
公开(公告)号：US08341842B2
公开(公告)日：2013-01-01
申请号：US12537267
申请日：2009-08-07
申请人： Guo Chen , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/00
CPC分类号： H01L21/4882 , H01L23/3672 , H01L23/3677 , H01L2924/0002 , Y10T29/4935 , Y10T29/49368 , H01L2924/00
摘要： A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.
摘要翻译：一种制造散热片的方法，首先是提供多个翅片，每个翅片均具有从头部延伸的头部和主体，提供具有从其顶表面突出的多个螺柱的基座，以及提供限定多个的底部中的凹部用于接收翅片的头部和用于接收螺栓的多个凸起部。接下来，按压盖和基座以将翅片的头部夹在其间。然后冲压底座的螺栓以扩展螺柱，并使螺柱与盖子紧密接合。

5. 发明授权

US07589967B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07589967B2
公开(公告)日：2009-09-15
申请号：US11566025
申请日：2006-12-01
申请人： Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.
摘要翻译：散热装置包括用于接触发热部件的散热器（10）和安装在散热器上的风扇（20）。风扇包括框架（22）和接收在框架中的电动机（24）。风扇有摄入量。框架具有顶层和底层。风扇产生气流并流过散热器。防回流板（30）安装在风扇的顶部和底部水平面之间。防回流板向外延伸超过散热器的末端，以防止流过散热器的气流进入风扇的入口。

6. 发明申请

US20080024986A1 CLIP FOR HEAT DISSIPATION DEVICE 失效
标题翻译：用于散热装置的夹子
公开(公告)号：US20080024986A1
公开(公告)日：2008-01-31
申请号：US11309345
申请日：2006-07-28
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.
摘要翻译：夹具包括主体，致动构件，第一钩板和第二钩板。主体包括支撑部分和从支撑部分的相对侧延伸的一对间隔开的臂。致动构件包括支撑在支撑部上的凸轮。第一钩板可拆卸地联接到主体的臂的远端。第二钩板延伸穿过支撑部分并且枢转地联接到致动构件的凸轮。致动构件可相对于第二钩板在锁定位置和解锁位置之间转动。

7. 发明授权

US08579017B2 Heat dissipation device with multiple heat sinks 有权
标题翻译：具有多个散热片的散热装置
公开(公告)号：US08579017B2
公开(公告)日：2013-11-12
申请号：US12620500
申请日：2009-11-17
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
摘要翻译：示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。散热器接合连接板。热管将第一散热器的基板和第二散热器的第二散热器热连接。

8. 发明授权

US08579016B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US08579016B2
公开(公告)日：2013-11-12
申请号：US12688794
申请日：2010-01-15
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
摘要翻译：散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。导热基座牢固地附接到支撑件的底侧并与电子元件热接触。第一翅片组件牢固地附接到支撑件的顶侧。热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

9. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

10. 发明授权

US08430153B2 Heat dissipation device having heat sink enclosing conductive member therein 失效
标题翻译：具有散热器的散热装置，其中包含导电部件
公开(公告)号：US08430153B2
公开(公告)日：2013-04-30
申请号：US12643931
申请日：2009-12-21
申请人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
摘要翻译：散热装置包括基座，安装在基座上并经由两个第一热管连接到基座的第一散热器和位于第一散热器的侧面的第二散热器，并经由第二热管。第一个散热片包括两个散热片组。其中一个翅片组堆叠在另一个翅片组上。每个翅片组包括从翅片组的中心沿着水平方向沿翅片组的周边径向扩散的多个翅片。

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