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    • 1. 发明授权
    • Dummy pattern design for reducing device performance drift
    • 用于减少设备性能漂移的虚拟模式设计
    • US07958465B2
    • 2011-06-07
    • US12211503
    • 2008-09-16
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • G06F17/50G06F19/00
    • H01L27/0207G06F2217/12Y02P90/265
    • A method of forming an integrated circuit structure on a chip includes extracting an active pattern including a diffusion region; enlarging the active pattern to form a dummy-forbidden region having a first edge and a second edge perpendicular to each other; and adding stress-blocking dummy diffusion regions throughout the chip, which includes adding a first stress-blocking dummy diffusion region adjacent and substantially parallel to the first edge of the dummy-forbidden region; and adding a second stress-blocking dummy diffusion region adjacent and substantially parallel to the second edge of the dummy-forbidden region. The method further includes, after the step of adding the stress-blocking dummy diffusion regions throughout the chip, adding general dummy diffusion regions into remaining spacings of the chip.
    • 在芯片上形成集成电路结构的方法包括:提取包括扩散区域的有源图案; 扩大有源图案以形成具有彼此垂直的第一边缘和第二边缘的虚拟禁止区域; 并且在整个芯片上增加应力阻挡虚拟扩散区域,其包括在虚拟禁止区域的第一边缘附近并基本平行地添加第一应力阻挡虚拟扩散区域; 以及添加与所述伪禁区的所述第二边缘相邻并且基本上平行的第二应力阻挡虚设扩散区。 该方法还包括:在整个芯片上添加应力阻挡虚拟扩散区域的步骤之后,将一般的虚拟扩散区域添加到芯片的剩余间隔中。
    • 6. 发明申请
    • Dummy Pattern Design for Reducing Device Performance Drift
    • 用于减少设备性能漂移的虚拟模式设计
    • US20090282374A1
    • 2009-11-12
    • US12211503
    • 2008-09-16
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • G06F17/50
    • H01L27/0207G06F2217/12Y02P90/265
    • A method of forming an integrated circuit structure on a chip includes extracting an active pattern including a diffusion region; enlarging the active pattern to form a dummy-forbidden region having a first edge and a second edge perpendicular to each other; and adding stress-blocking dummy diffusion regions throughout the chip, which includes adding a first stress-blocking dummy diffusion region adjacent and substantially parallel to the first edge of the dummy-forbidden region; and adding a second stress-blocking dummy diffusion region adjacent and substantially parallel to the second edge of the dummy-forbidden region. The method further includes, after the step of adding the stress-blocking dummy diffusion regions throughout the chip, adding general dummy diffusion regions into remaining spacings of the chip.
    • 在芯片上形成集成电路结构的方法包括:提取包括扩散区域的有源图案; 扩大有源图案以形成具有彼此垂直的第一边缘和第二边缘的虚拟禁止区域; 并且在整个芯片上增加应力阻挡虚拟扩散区域,其包括在虚拟禁止区域的第一边缘附近并基本平行地添加第一应力阻挡虚拟扩散区域; 以及添加与所述伪禁区的所述第二边缘相邻并且基本上平行的第二应力阻挡虚设扩散区。 该方法还包括:在整个芯片上添加应力阻挡虚拟扩散区域的步骤之后,将一般的虚拟扩散区域添加到芯片的剩余间隔中。
    • 10. 发明授权
    • Dummy pattern design for reducing device performance drift
    • 用于减少设备性能漂移的虚拟模式设计
    • US08350330B2
    • 2013-01-08
    • US13099150
    • 2011-05-02
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • Lee-Chung LuChien-Chih KuoJian-Yi LiSheng-Jier Yang
    • H01L29/78
    • B44C1/227B44F1/045C03C17/38C03C17/42C03C2218/33C09D9/005C25D5/48C25D7/08
    • A method of forming an integrated circuit structure on a chip includes extracting an active pattern including a diffusion region; enlarging the active pattern to form a dummy-forbidden region having a first edge and a second edge perpendicular to each other; and adding stress-blocking dummy diffusion regions throughout the chip, which includes adding a first stress-blocking dummy diffusion region adjacent and substantially parallel to the first edge of the dummy-forbidden region; and adding a second stress-blocking dummy diffusion region adjacent and substantially parallel to the second edge of the dummy-forbidden region. The method further includes, after the step of adding the stress-blocking dummy diffusion regions throughout the chip, adding general dummy diffusion regions into remaining spacings of the chip. A structure includes a target diffusion region including a first edge with a first length and a second edge with a second edge perpendicular to the first length. A first stress-blocking dummy diffusion region is adjacent to the first edge, with no dummy diffusions regions therebetween. A second stress-blocking dummy diffusion region is adjacent to the second edge, with no dummy diffusion regions therebetween.
    • 在芯片上形成集成电路结构的方法包括:提取包括扩散区域的有源图案; 扩大有源图案以形成具有彼此垂直的第一边缘和第二边缘的虚拟禁止区域; 并且在整个芯片上增加应力阻挡虚拟扩散区域,其包括在虚拟禁止区域的第一边缘附近并基本平行地添加第一应力阻挡虚拟扩散区域; 以及添加与所述伪禁区的所述第二边缘相邻并且基本上平行的第二应力阻挡虚设扩散区。 该方法还包括:在整个芯片上添加应力阻挡虚拟扩散区域的步骤之后,将一般的虚拟扩散区域添加到芯片的剩余间隔中。 一种结构包括目标扩散区域,包括具有第一长度的第一边缘和具有垂直于第一长度的第二边缘的第二边缘。 第一应力阻挡虚拟扩散区域与第一边缘相邻,其间没有虚拟扩散区域。 第二应力阻挡虚拟扩散区域与第二边缘相邻,其间没有虚拟扩散区域。