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1. 发明授权

US08587946B2 Semiconductor module socket apparatus 有权
标题翻译：半导体模块插座设备
公开(公告)号：US08587946B2
公开(公告)日：2013-11-19
申请号：US12987552
申请日：2011-01-10
申请人： Joo-Han Lee , Jung-Hoon Kim , Seong-Chan Han
发明人： Joo-Han Lee , Jung-Hoon Kim , Seong-Chan Han
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , H05K7/1431
摘要： A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.
摘要翻译：一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且实现半导体模块插座装置的无噪声和无振动。

2. 发明申请

US20120207561A1 ROUTER APPARATUS 有权
标题翻译：路由器设备
公开(公告)号：US20120207561A1
公开(公告)日：2012-08-16
申请号：US13241339
申请日：2011-09-23
申请人： Chan-Hyung YUN , Hyun-Jong OH , Seong-Chan HAN , Hun HAN
发明人： Chan-Hyung YUN , Hyun-Jong OH , Seong-Chan HAN , Hun HAN
IPC分类号： B23Q1/01
CPC分类号： B23Q9/0042 , B23C1/08 , B23C3/00 , H05K3/0052 , Y10T409/307728 , Y10T409/308568 , Y10T409/30924
摘要： A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.
摘要翻译：提供路由器设备。路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。在第二支撑单元中形成导轨，以引导路线钻头的移动。

3. 发明申请

US20110216516A1 Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly 有权
标题翻译：半导体模块，插座和半导体模块/插座组件
公开(公告)号：US20110216516A1
公开(公告)日：2011-09-08
申请号：US13006692
申请日：2011-01-14
申请人： Jung-hoon Kim , Seong-chan Han , Dong-chun Lee , Jae-hoon Choi , Sun-kyu Hwang
发明人： Jung-hoon Kim , Seong-chan Han , Dong-chun Lee , Jae-hoon Choi , Sun-kyu Hwang
IPC分类号： H05K7/00
CPC分类号： H05K7/00
摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.
摘要翻译：公开了半导体模块，用于其的插座和半导体模块/插座组件。半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。第一端和第二端位于印刷电路板的相对端。

4. 发明申请

US20110170264A1 Semiconductor Module Socket Apparatus 有权
标题翻译：半导体模块插座设备
公开(公告)号：US20110170264A1
公开(公告)日：2011-07-14
申请号：US12987552
申请日：2011-01-10
申请人： Joo-han Lee , Jung-hoon Kim , Seong-chan Han
发明人： Joo-han Lee , Jung-hoon Kim , Seong-chan Han
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , H05K7/1431
摘要： A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.
摘要翻译：一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且实现半导体模块插座装置的无噪声和无振动。

5. 发明授权

US07960655B2 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module 有权
标题翻译：印刷电路板，制造印刷电路板的方法，具有印刷电路板的存储模块和制造存储器模块的方法
公开(公告)号：US07960655B2
公开(公告)日：2011-06-14
申请号：US12231196
申请日：2008-08-29
申请人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
发明人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
IPC分类号： H05K1/00
CPC分类号： H05K1/0272 , H05K1/0203 , H05K2201/064 , Y10T29/49124
摘要： A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
摘要翻译： PCB可以包括绝缘构件，冷却构件和电路图案。冷却构件可以内置在绝缘构件中。冷却部件可以具有冷却流体可以流过的冷却通道。电路图案可以形成在绝缘构件上。因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

6. 发明申请

US20110079872A1 PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE 审中-公开
标题翻译：被动装置，半导体模块，电子电路板和具有被动装置的电子系统，以及制造和检查半导体模块的方法
公开(公告)号：US20110079872A1
公开(公告)日：2011-04-07
申请号：US12772351
申请日：2010-05-03
申请人： Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
发明人： Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
IPC分类号： H01L29/86
CPC分类号： H05K1/023 , H01L24/16 , H01L29/86 , H01L2224/16 , H01L2924/01077 , H01L2924/04941 , H01L2924/14 , H01L2924/19015 , H05K1/0269 , H05K3/3442 , H05K3/3484 , H05K2201/09181 , H05K2201/09781 , H05K2201/10515 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.
摘要翻译：提供半导体模块的无源器件，具有无源器件的半导体模块，具有无源器件或半导体模块的电子电路板和电子系统以及制造和检查半导体模块的方法。半导体模块的无源器件包括主体和设置在主体的一个侧表面上的至少两个实际电极。

7. 发明授权

US07900349B2 Method of fabricating an electronic device 失效
标题翻译：制造电子装置的方法
公开(公告)号：US07900349B2
公开(公告)日：2011-03-08
申请号：US11950280
申请日：2007-12-04
申请人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
发明人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
IPC分类号： H05K3/34
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/98 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24227 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/225 , H05K3/3442 , H05K2201/10636 , H05K2201/10674 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/53274 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
摘要翻译：公开了一种具有可再加工电子部件的电子装置，电子装置的制造方法以及电子部件的再加工方法。电子设备包括设置在板体中的第一腔。第一金属图案设置在板体上并与第一腔相邻。第一电子部件设置在第一腔中。第一连接图案被设置成与第一电子部件的上边缘部分相邻并且延伸到第一金属图案，使得第一金属图案电连接到第一电子部件。

8. 发明申请

US20100210042A1 METHOD OF MANUFACTURING SEMICONDUCTOR MODULE 审中-公开
标题翻译：制造半导体模块的方法
公开(公告)号：US20100210042A1
公开(公告)日：2010-08-19
申请号：US12705729
申请日：2010-02-15
申请人： Hyun-Jong OH , Seong-Chan HAN , Jae-Hoon CHOI , Chan-Hyung YUN
发明人： Hyun-Jong OH , Seong-Chan HAN , Jae-Hoon CHOI , Chan-Hyung YUN
IPC分类号： H01L21/66 , H01L21/50
CPC分类号： H05K3/303 , H01L23/3128 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3511 , H05K1/141 , H05K3/3436 , H05K2201/0379 , H05K2201/068 , H05K2201/09063 , H05K2201/09781 , H05K2203/302 , H05K2203/306 , Y02P70/613 , H01L2224/0401
摘要： A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.
摘要翻译：提供一种制造半导体模块的方法。形成具有一个或多个通过加热弯曲的板单元的半导体封装。半导体封装在模块衬底上对准，并且连接构件设置在半导体封装和模块衬底之间。对板单元和连接构件施加热量以在模块基板和半导体封装之间延伸一定距离，并且形成连接图案。连接图案的高度大于连接构件的高度。

9. 发明申请

US20100015362A1 METHOD OF ELECTROLESS PLATING 审中-公开
标题翻译：电镀镀层的方法
公开(公告)号：US20100015362A1
公开(公告)日：2010-01-21
申请号：US12505560
申请日：2009-07-20
申请人： Joo-Han LEE , Dong-Chun LEE , Yong-Hyun KIM , Seong-Chan Han
发明人： Joo-Han LEE , Dong-Chun LEE , Yong-Hyun KIM , Seong-Chan Han
IPC分类号： B05D1/18
CPC分类号： H05K3/244 , C23C18/1673 , C23C18/32 , C23C18/42 , H05K2203/072 , H05K2203/104
摘要： An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.
摘要翻译：无电镀装置包括含有金属盐水溶液的电镀液和用于产生磁场的磁场发生器。将待镀物体浸入溶液中。由磁场发生器产生的磁场增加金属离子被吸引到物体表面的水平。因此，可以以快速的速度形成质量好的电镀层。

10. 发明申请

US20090257209A1 Semiconductor package and associated methods 审中-公开
标题翻译：半导体封装及相关方法
公开(公告)号：US20090257209A1
公开(公告)日：2009-10-15
申请号：US12385575
申请日：2009-04-13
申请人： Seong-Chan Han , Jin-Kyu Yang , Dong-Chun Lee , Kwang-Ho Chun
发明人： Seong-Chan Han , Jin-Kyu Yang , Dong-Chun Lee , Kwang-Ho Chun
IPC分类号： H01R9/00 , H01R12/04
CPC分类号： H05K1/112 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K3/3436 , H05K3/429 , H05K2201/09472 , H05K2201/09509 , H05K2201/09572 , H05K2201/10666 , H05K2203/0455 , Y02P70/613
摘要： A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.
摘要翻译：一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

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