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1. 发明授权

US07900349B2 Method of fabricating an electronic device 失效
标题翻译：制造电子装置的方法
公开(公告)号：US07900349B2
公开(公告)日：2011-03-08
申请号：US11950280
申请日：2007-12-04
申请人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
发明人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
IPC分类号： H05K3/34
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/98 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24227 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/225 , H05K3/3442 , H05K2201/10636 , H05K2201/10674 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/53274 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
摘要翻译：公开了一种具有可再加工电子部件的电子装置，电子装置的制造方法以及电子部件的再加工方法。电子设备包括设置在板体中的第一腔。第一金属图案设置在板体上并与第一腔相邻。第一电子部件设置在第一腔中。第一连接图案被设置成与第一电子部件的上边缘部分相邻并且延伸到第一金属图案，使得第一金属图案电连接到第一电子部件。

2. 发明申请

US20070072467A1 Method of testing a substrate and apparatus for performing the same 审中-公开
标题翻译：测试基板的方法及其执行装置
公开(公告)号：US20070072467A1
公开(公告)日：2007-03-29
申请号：US11525971
申请日：2006-09-25
申请人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han , Hyo-Jae Bang
发明人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han , Hyo-Jae Bang
IPC分类号： H01R29/00
CPC分类号： G01R31/046
摘要： A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.
摘要翻译：测试衬底的方法可以涉及拍摄衬底的第一面上的第一芯片以获得第一芯片的第一图像，并且在与第一面相对的基板的第二面上拍摄第二芯片而不使基板反转以获得第二芯片的第二图像。可以基于第一和第二图像来确定第一和第二码片的正常性。

3. 发明申请

US20070189451A1 Apparatus for inspecting a semiconductor device 审中-公开
标题翻译：用于检查半导体器件的装置
公开(公告)号：US20070189451A1
公开(公告)日：2007-08-16
申请号：US11703249
申请日：2007-02-07
申请人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han
发明人： Young-Soo Lee , Dong-Chun Lee , Seong-Chan Han
IPC分类号： G01N23/06 , G01F1/66
CPC分类号： G01N21/95607 , H01L2224/16225
摘要： An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.
摘要翻译：用于检查半导体器件的装置可以包括：外部图像检测器，用于获取半导体器件的外部图像;内部图像检测器，用于获取半导体器件的内部图像;以及控制器，用于将获取的图像与各自的参考值进行比较。该装置可以检查半导体器件的外部和内部。

4. 发明授权

US07960655B2 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module 有权
标题翻译：印刷电路板，制造印刷电路板的方法，具有印刷电路板的存储模块和制造存储器模块的方法
公开(公告)号：US07960655B2
公开(公告)日：2011-06-14
申请号：US12231196
申请日：2008-08-29
申请人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
发明人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
IPC分类号： H05K1/00
CPC分类号： H05K1/0272 , H05K1/0203 , H05K2201/064 , Y10T29/49124
摘要： A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
摘要翻译： PCB可以包括绝缘构件，冷却构件和电路图案。冷却构件可以内置在绝缘构件中。冷却部件可以具有冷却流体可以流过的冷却通道。电路图案可以形成在绝缘构件上。因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

5. 发明申请

US20090056979A1 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module 有权
标题翻译：印刷电路板，制造印刷电路板的方法，具有印刷电路板的存储模块和制造存储器模块的方法
公开(公告)号：US20090056979A1
公开(公告)日：2009-03-05
申请号：US12231196
申请日：2008-08-29
申请人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
发明人： Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/0272 , H05K1/0203 , H05K2201/064 , Y10T29/49124
摘要： A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
摘要翻译： PCB可以包括绝缘构件，冷却构件和电路图案。冷却构件可以内置在绝缘构件中。冷却部件可以具有冷却流体可以流过的冷却通道。电路图案可以形成在绝缘构件上。因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

6. 发明授权

US07061768B2 Open socket 失效
标题翻译：打开插座
公开(公告)号：US07061768B2
公开(公告)日：2006-06-13
申请号：US10868976
申请日：2004-06-17
申请人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
发明人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
IPC分类号： H05K5/03
CPC分类号： H01R13/2471 , H01R13/111
摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
摘要翻译：可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

7. 发明申请

US20050118878A1 Open socket 失效
标题翻译：打开插座
公开(公告)号：US20050118878A1
公开(公告)日：2005-06-02
申请号：US10868976
申请日：2004-06-17
申请人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
发明人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
IPC分类号： H01R33/76 , H01R13/24 , H01R24/00
CPC分类号： H01R13/2471 , H01R13/111
摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
摘要翻译：可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

8. 发明授权

US09617664B2 Polyester fiber for airbag and preparation method thereof 有权
公开(公告)号：US09617664B2
公开(公告)日：2017-04-11
申请号：US13516500
申请日：2010-12-17
申请人： Young-Jo Kim , Ki-Jeong Kim , Sang-Mok Lee , Young-Soo Lee
发明人： Young-Jo Kim , Ki-Jeong Kim , Sang-Mok Lee , Young-Soo Lee
IPC分类号： D03D1/02 , D01F6/62 , D01D10/02 , B60R21/235
CPC分类号： D03D1/02 , B60R2021/23504 , D01D10/02 , D01F6/62 , Y10T428/298 , Y10T442/3008
摘要： The present invention relates to a polyester fiber that can be applied to a fabric for airbag, particularly, to a polyester fiber having an elongation of 0.4% or less at the stress of 1.0 g/d, an enlongation of 4.0% or less at the stress of 4.0 g/d, and an enlongation of 7.0% or less at the stress of 7.0 g/d, and an initial modulus of 105 to 130 g/d; a method of preparing the same; and a fabric for airbag prepared therefrom. Since the polyester fiber of the present invention decreases stiffness remarkably and secures superior mechanical properties by having a high strength, high elongation, and high shrinkage, it is possible to provide superior packing property, dimensional stability, and air-tight effect, and to protect passengers safely by minimizing the impact applied to the passengers, when it is used for the fabric for airbag.

9. 发明申请

US20140041406A1 BROADBAND HEAT PUMP SYSTEM 有权
标题翻译：宽带热泵系统
公开(公告)号：US20140041406A1
公开(公告)日：2014-02-13
申请号：US13980699
申请日：2012-08-08
申请人： Minsung Kim , Young-Jin Baik , Seong-Ryong Park , Ho-Sang Ra , Young-Soo Lee , Ki-Chang Chang
发明人： Minsung Kim , Young-Jin Baik , Seong-Ryong Park , Ho-Sang Ra , Young-Soo Lee , Ki-Chang Chang
IPC分类号： F25B49/00
CPC分类号： F25B49/00 , F24D3/18 , F24D12/02 , F24D19/1039 , F25B30/00 , F25B2400/06 , Y02B30/14
摘要： Provided is a broadband heat pump system including: a heat pump module including a plurality of heat pumps that supply hot water with different levels of temperature; a heat source supply module that introduces a heat source from one heat source or selectively introduces a heat source from one or a plurality of heat sources among heat sources with different levels of temperature so as to produce a heat source with a desired temperature; and a controller that controls the heat pump module and the heat source supply module to select one from the plurality of heat pumps to be appropriate to a temperature of hot water requested by a demand source and to receive a heat source with a necessary temperature from the heat source supply module so that the selected heat pump is able to supply hot water with the requested temperature.
摘要翻译：提供一种宽带热泵系统，包括：热泵模块，包括供给不同温度的热水的多个热泵; 热源供应模块，其从一个热源引入热源或者选择性地从具有不同温度的热源的一个或多个热源引入热源，以产生具有期望温度的热源; 以及控制器，其控制所述热泵模块和所述热源供应模块，以从所述多个热泵中选择适合于需求源所要求的热水温度并且从所述热泵模块和所述热源供应模块接收具有必要温度的热源热源供应模块，使选定的热泵能够提供所需温度的热水。

10. 发明申请

US20120040167A1 POLYESTER FIBER FOR AIRBAG AND PREPARATION METHOD THEREOF 有权
标题翻译：用于安全气囊的聚酯纤维及其制备方法
公开(公告)号：US20120040167A1
公开(公告)日：2012-02-16
申请号：US13264317
申请日：2010-04-14
申请人： Young-Jo Kim , Gi-Woong Kim , Sang-Mok Lee , Young-Soo Lee
发明人： Young-Jo Kim , Gi-Woong Kim , Sang-Mok Lee , Young-Soo Lee
IPC分类号： D01F6/62 , D03D1/02 , C08G63/127 , D01D5/12
CPC分类号： D01F6/62 , B60R21/235 , B60R2021/23509 , D03D1/02 , D10B2331/04 , Y10T428/249921 , Y10T428/2913 , Y10T428/298
摘要： The present invention relates to a polyester fiber that can be applied to a fabric for an airbag, and particularly, to a polyester fiber having elongation of 0.5% or more at a stress of 1.0 g/d, elongation of 4.3% or more at a stress of 4.0 g/d, and elongation of 7.5% or more at a stress of 7.0 g/d, and an initial modulus of 40 to 100 g/d, a method of preparing the same, and a fabric for an airbag prepared therefrom. Since the polyester fiber of the present invention remarkably decreases stiffness and secures superior mechanical properties, it is possible to provide superior packing properties, dimensional stability, and gas barrier effect, and to protect occupants safely by minimizing the impact applied to the occupants, when it is used for the fabric for an airbag.
摘要翻译：本发明涉及一种可应用于气囊用织物的聚酯纤维，特别涉及在1.0g / d的应力下伸长率为0.5％以上的聚酯纤维，延伸率为4.3％以上应力为4.0g / d，应力为7.0g / d时的伸长率为7.5％以上，初期模量为40〜100g / d，其制备方法以及由其制备的气囊织物。由于本发明的聚酯纤维显着降低刚度并且确保了优异的机械性能，因此可以提供优异的包装性能，尺寸稳定性和阻气效果，并且通过最小化施加到乘客的冲击来安全地保护乘客，当它用于安全气囊的织物。

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