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1. 发明专利

JP2012061926A Sunshade device 审中-公开
标题翻译： SUNSHADE设备
公开(公告)号：JP2012061926A
公开(公告)日：2012-03-29
申请号：JP2010206669
申请日：2010-09-15
申请人： Satoru Hara , 悟原
发明人： HARA SATORU
IPC分类号： B60J3/00
摘要： PROBLEM TO BE SOLVED: To provide a sun shade device for a vehicle which is easily mounted in the outdoor side.SOLUTION: A shielding material comprises a polygonal columnar cross-section having a hollow cross-section and shields direct sunlight as required without providing a thin curtain. The sunshade device is obtained by arranging the plurality of polygonal columns, is easily extended and contracted and is installed in the outdoor side.
摘要翻译：要解决的问题：提供一种易于安装在室外侧的用于车辆的遮阳装置。解决方案：屏蔽材料包括具有中空横截面的多边形柱状横截面，并且根据需要屏蔽直射阳光，而不需要提供薄的窗帘。遮阳装置通过布置多个多边形柱而被容易地伸展和收缩并安装在室外侧。版权所有（C）2012，JPO＆INPIT

2. 发明申请

US20090147970A1 MOBILE TERMINAL AND SOUND INPUT/OUTPUT CONTROL METHOD FOR MOBILE TERMINAL 审中-公开
标题翻译：移动终端的移动终端和声音输入/输出控制方法
公开(公告)号：US20090147970A1
公开(公告)日：2009-06-11
申请号：US12327083
申请日：2008-12-03
申请人： Hiroshi SHIMASAKI , Satoshi MIZOGUCHI , Naoto ITO , Takahiro SOGOU , Taizo TOMIOKA , Satoru HARA
发明人： Hiroshi SHIMASAKI , Satoshi MIZOGUCHI , Naoto ITO , Takahiro SOGOU , Taizo TOMIOKA , Satoru HARA
IPC分类号： H03G3/20 , H04M1/02
CPC分类号： H04M1/0279 , H04M1/03 , H04M2250/74
摘要： According to one aspect of the invention, a mobile terminal includes: a case having two flat faces opposite to each other and side faces having a first side face and a second side face opposed to each other; a first sound input/output unit provided on the first side faces; and a second sound input/output unit provided on the second side face.
摘要翻译：根据本发明的一个方面，移动终端包括：具有彼此相对的两个平面的壳体和具有彼此相对的第一侧面和第二侧面的侧面; 设置在所述第一侧面上的第一声音输入/输出单元; 以及设置在第二侧面上的第二声音输入/输出单元。

3. 发明申请

US20080148551A1 Method of joining a plurality of conductor segments to form stator winding 有权
标题翻译：连接多个导体段以形成定子绕组的方法
公开(公告)号：US20080148551A1
公开(公告)日：2008-06-26
申请号：US12003017
申请日：2007-12-19
申请人： Satoru Hara
发明人： Satoru Hara
IPC分类号： H02K15/04 , B23K9/12
CPC分类号： H02K15/0081 , H02K15/064 , Y10T29/49009 , Y10T29/49012 , Y10T29/49071 , Y10T29/53143
摘要： In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.
摘要翻译：在一种方法中，使第一电极移动以与第一成对导体段的第一配对端接触。接下来，第二电极相对于第一成对端移动。经由第一成对导体段的第一配对端在第一电极和第二电极之间建立电传导，以基于第一配对导体段的第一配对端焊接第一配对导体段的第一配对端其间导电。接下来，当第一电极与第一配对端保持接触时，第二电极相对于第二成对导体段的第二配对端移动。通过焊接的第一成对端和第二成对端，在第一电极和第二电极之间建立导电，从而基于它们之间的导电焊接第二成对导体段的第二配对端。

4. 发明申请

US20070159204A1 SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME 失效
标题翻译：半导体器件和使用该器件的电子元件模块
公开(公告)号：US20070159204A1
公开(公告)日：2007-07-12
申请号：US11620799
申请日：2007-01-08
申请人： Satoru Hara , Shuzo Akejima
发明人： Satoru Hara , Shuzo Akejima
IPC分类号： G01R31/26
CPC分类号： H05K3/325 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/4046 , H05K7/142 , H05K2201/10416 , H05K2201/10704 , H05K2201/2036 , H05K2201/209 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.
摘要翻译：半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

5. 发明授权

US6079900A Pavement composite material with elastic surface layer and production method thereof 失效
标题翻译：具有弹性表面层的路面复合材料及其制造方法
公开(公告)号：US6079900A
公开(公告)日：2000-06-27
申请号：US97736
申请日：1998-06-16
申请人： Yutaka Kumagawa , Masakazu Io , Satoru Hara , Seiko Himeno
发明人： Yutaka Kumagawa , Masakazu Io , Satoru Hara , Seiko Himeno
IPC分类号： B28B11/04 , E01C5/22 , E01C19/02
CPC分类号： B28B11/04 , E01C5/226
摘要： A pavement composite material having elasticity and permeability can be obtained by accommodating a permeable concrete block after the solidification molding applied with an adhesive having a 50 to 100 centipoise viscosity on the surface to be bonded in a heat press mold, injecting a mixture of 50 to 90% by weight of rubber or plastic chips having a 1.0 to 10.0 mm particle size and 50 to 10% by weight of a thermosetting resin thereon, and a heat compression molding.
摘要翻译：具有弹性和渗透性的路面复合材料可以通过在凝固成型之后容纳可渗透的混凝土块，通过在热压模具中将待粘合的表面上具有50至100厘泊粘度的粘合剂，将50的混合物注入 90重量％的具有1.0至10.0mm粒度的橡胶或塑料碎片和50至10重量％的热固性树脂，以及热压缩成型。

6. 发明申请

US20120080801A1 SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME 审中-公开
标题翻译：半导体器件和使用该器件的电子元件模块
公开(公告)号：US20120080801A1
公开(公告)日：2012-04-05
申请号：US13315350
申请日：2011-12-09
申请人： Satoru HARA , Shuzo AKEJIMA
发明人： Satoru HARA , Shuzo AKEJIMA
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/4046 , H05K7/142 , H05K2201/10416 , H05K2201/10704 , H05K2201/2036 , H05K2201/209 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.
摘要翻译：半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

7. 发明授权

US08097950B2 Semiconductor device and electronic component module using the same 失效
标题翻译：半导体器件和使用其的电子元件模块
公开(公告)号：US08097950B2
公开(公告)日：2012-01-17
申请号：US11620799
申请日：2007-01-08
申请人： Satoru Hara , Shuzo Akejima
发明人： Satoru Hara , Shuzo Akejima
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/4046 , H05K7/142 , H05K2201/10416 , H05K2201/10704 , H05K2201/2036 , H05K2201/209 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.
摘要翻译：半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

8. 发明授权

US07788791B2 Method of joining a plurality of conductor segments to form stator winding 有权
标题翻译：连接多个导体段以形成定子绕组的方法
公开(公告)号：US07788791B2
公开(公告)日：2010-09-07
申请号：US12003017
申请日：2007-12-19
申请人： Satoru Hara
发明人： Satoru Hara
IPC分类号： H02K15/00 , H02K15/14
CPC分类号： H02K15/0081 , H02K15/064 , Y10T29/49009 , Y10T29/49012 , Y10T29/49071 , Y10T29/53143
摘要： In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.
摘要翻译：在一种方法中，使第一电极移动以与第一成对导体段的第一配对端接触。接下来，第二电极相对于第一成对端移动。经由第一成对导体段的第一配对端在第一电极和第二电极之间建立电传导，以基于第一配对导体段的第一配对端焊接第一配对导体段的第一配对端其间导电。接下来，当第一电极与第一配对端保持接触时，第二电极相对于第二成对导体段的第二配对端移动。通过焊接的第一成对端和第二成对端，在第一电极和第二电极之间建立导电，从而基于它们之间的导电焊接第二成对导体段的第二配对端。

9. 发明申请

US20090197653A1 MOBILE APPARATUS 审中-公开
标题翻译：手机设备
公开(公告)号：US20090197653A1
公开(公告)日：2009-08-06
申请号：US12269399
申请日：2008-11-12
申请人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
发明人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
IPC分类号： H04M1/02 , A45F5/00
CPC分类号： H01Q1/273
摘要： According one aspect of the invention, there is provided a mobile apparatus including: a main face; a back face opposite to the main face, the back face being printed with visible user information; a thickness from the main face to the back face; an antenna disposed at a position nearer the back face than the main face; and an attachment portion attachable with a wearing tool, the wearing tool allowing a user to wear the mobile apparatus.
摘要翻译：根据本发明的一个方面，提供了一种移动装置，包括：主面; 与主面相对的背面，背面印有可见的用户信息; 从主面到背面的厚度; 设置在比所述主面更靠近所述背面的位置的天线; 以及可与佩戴工具相连的附接部分，所述佩戴工具允许使用者佩戴移动装置。

10. 发明授权

US08752276B2 Method of manufacturing rotating electrical machine 有权
标题翻译：旋转电机制造方法
公开(公告)号：US08752276B2
公开(公告)日：2014-06-17
申请号：US13355861
申请日：2012-01-23
申请人： Toshiyuki Yoshikawa , Satoru Hara
发明人： Toshiyuki Yoshikawa , Satoru Hara
IPC分类号： H02K15/00
CPC分类号： H02K15/00 , H02K7/1004
摘要： A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.
摘要翻译：旋转电机的制造方法具有如下步骤：在使夹具和滑轮沿上下方向接触的同时将盖容纳在夹具空间中，使得操作空间被密封，并且主体将操作空间减压到低于大气压的压力，将盖移动到减压操作空间中的上侧，并将盖压配合到滑轮中。由此，与在大气压下配合的情况相比，可以抑制由反作用力作用而在盖的轴向上的倾斜和偏移。压力。因此，盖的压配合状态可以稳定。

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