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1. 发明申请

US20090197653A1 MOBILE APPARATUS 审中-公开
标题翻译：手机设备
公开(公告)号：US20090197653A1
公开(公告)日：2009-08-06
申请号：US12269399
申请日：2008-11-12
申请人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
发明人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
IPC分类号： H04M1/02 , A45F5/00
CPC分类号： H01Q1/273
摘要： According one aspect of the invention, there is provided a mobile apparatus including: a main face; a back face opposite to the main face, the back face being printed with visible user information; a thickness from the main face to the back face; an antenna disposed at a position nearer the back face than the main face; and an attachment portion attachable with a wearing tool, the wearing tool allowing a user to wear the mobile apparatus.
摘要翻译：根据本发明的一个方面，提供了一种移动装置，包括：主面; 与主面相对的背面，背面印有可见的用户信息; 从主面到背面的厚度; 设置在比所述主面更靠近所述背面的位置的天线; 以及可与佩戴工具相连的附接部分，所述佩戴工具允许使用者佩戴移动装置。

2. 发明授权

US08110736B2 Thermoelectric element device and thermoelectric module 有权
标题翻译：热电元件和热电模块
公开(公告)号：US08110736B2
公开(公告)日：2012-02-07
申请号：US11466975
申请日：2006-08-24
申请人： Naokazu Iwanade , Naruhito Kondo , Osamu Tsuneoka , Kazuki Tateyama , Takahiro Sogou
发明人： Naokazu Iwanade , Naruhito Kondo , Osamu Tsuneoka , Kazuki Tateyama , Takahiro Sogou
IPC分类号： H01L35/02
CPC分类号： H01L35/32
摘要： The present invention according to one preferred embodiment provides a thermoelectric element device comprising a first electrode including an electrode member, an elastic member that has electrically conductive and is provided on the electrode member, and a heat uniforming member that has electrically conductive and is provided on the elastic member; a thermoelectric element that is made of a thermoelectric material having thermoelectric effect and arranged on the first electrode so as to contact the heat uniforming member; and a second electrode arranged on the thermoelectric element.
摘要翻译：根据一个优选实施例的本发明提供了一种热电元件装置，包括：第一电极，包括电极部件，具有导电性并设置在电极部件上的弹性部件;以及热均匀化部件，其具有导电性并设置在弹性构件; 热电元件，其由具有热电效应的热电材料制成，并布置在第一电极上以与热均匀化构件接触; 以及布置在所述热电元件上的第二电极。

3. 发明授权

US08476741B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

4. 发明授权

US07278199B2 Method of making a thermoelectric device 有权
标题翻译：制造热电装置的方法
公开(公告)号：US07278199B2
公开(公告)日：2007-10-09
申请号：US11344118
申请日：2006-02-01
申请人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
发明人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
IPC分类号： H01S4/00
CPC分类号： H01L35/06 , H01L35/30 , H01L35/32 , H01L35/34 , H05K1/0204 , H05K2201/10219 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144
摘要： In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.
摘要翻译：为了提供高度可靠的热电装置，在热电装置中，按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的散热侧板。多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。吸热侧电极与这些热电元件的吸热侧端面滑动接触。

5. 发明申请

US20070028955A1 Thermoelectric device and method of manufacturing the same 审中-公开
标题翻译：热电装置及其制造方法
公开(公告)号：US20070028955A1
公开(公告)日：2007-02-08
申请号：US11494529
申请日：2006-07-28
申请人： Takahiro Sogou , Kazuki Tateyama , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Naokazu Iwanade
发明人： Takahiro Sogou , Kazuki Tateyama , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Naokazu Iwanade
IPC分类号： H01L35/00
CPC分类号： H01L35/32 , H01L35/10 , H05K1/0204 , H05K1/0373 , H05K1/056 , H05K2201/066 , H05K2201/10219
摘要： There is provided a thermoelectric device capable of improving a power generation performance while keeping a hermetic sealing after a heat cycle is applied, and also achieving simplification of a structure and improvement in productivity and reliability of a device by reducing the number of articles, and a method of manufacturing the same. A thermoelectric device, includes a metal substrate 2, a thermoelectric element 3 mounted on a center portion of a surface of the metal substrate 2, a metal lid 4 for covering an upper surface and side surfaces of the thermoelectric element 3, and a joining metal member 5 provided to a peripheral portion of a surface of the metal substrate 2 to hermetically seal a space between the metal substrate 2 and the lid 4.
摘要翻译：提供了一种能够在施加热循环之后保持气密密封的同时提高发电性能的热电装置，并且通过减少物品的数量也实现了结构的简化和设备的生产率和可靠性的提高，并且制造方法热电装置包括金属基板2，安装在金属基板2的表面的中心部分的热电元件3，用于覆盖热电元件3的上表面和侧面的金属盖4和接合金属构件5设置在金属基板2的表面的周边部分，以密封金属基板2和盖4之间的空间。

6. 发明申请

US20050211288A1 Thermoelectric device 审中-公开
标题翻译：热电装置
公开(公告)号：US20050211288A1
公开(公告)日：2005-09-29
申请号：US11069952
申请日：2005-03-03
申请人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka
发明人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka
IPC分类号： H01L35/06 , H01L35/04 , H01L35/32 , H02N11/00 , H01L35/28 , H01L35/34 , H01L37/00
CPC分类号： H01L35/32 , H01L35/04
摘要： In a thermoelectric device, metal fiber nets as conductive members having elasticity are placed between first electrodes and thermoelectric elements, in order to increase productivity and make it possible to reduce variations in performance without impairing the reliability of a slidable structure even if each component is heated to be thermally deformed. This placement prevents the temperature of the metal fiber nets from becoming high in the operation of the thermoelectric device and prevents the elasticity of the metal fiber nets from being lost. Further, this constitution eliminates the necessity for bonding the first electrodes to the thermoelectric elements using solder. Moreover, the elasticity of the metal fiber nets makes it possible to accommodate variations in height among the respective thermoelectric elements when the thermoelectric device is assembled.
摘要翻译：在热电装置中，作为具有弹性的导电构件的金属纤维网设置在第一电极和热电元件之间，以便提高生产率，并且即使各组件被加热，也可能降低可滑动结构的可靠性而降低性能的变化被热变形。该布置防止金属纤维网的温度在热电装置的操作中变高，并且防止金属纤维网的弹性损失。此外，该结构消除了使用焊料将第一电极与热电元件接合的必要性。此外，当组装热电装置时，金属纤维网的弹性使得可以适应各热电元件之间的高度变化。

7. 发明申请

US20110215427A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20110215427A1
公开(公告)日：2011-09-08
申请号：US13009212
申请日：2011-01-19
申请人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L29/84
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

8. 发明申请

US20080163916A1 THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION APPARATUS 审中-公开
标题翻译：热电转换模块和热电转换装置
公开(公告)号：US20080163916A1
公开(公告)日：2008-07-10
申请号：US11876399
申请日：2007-10-22
申请人： Osamu Tsuneoka , Naruhito Kondo , Akihiro Hara , Kazuki Tateyama , Takahiro Sogou , Yasuhito Saito , Masayuki Arakawa
发明人： Osamu Tsuneoka , Naruhito Kondo , Akihiro Hara , Kazuki Tateyama , Takahiro Sogou , Yasuhito Saito , Masayuki Arakawa
IPC分类号： H01L35/28 , H01L35/02 , F25B21/02
CPC分类号： H01L35/32
摘要： According to one embodiment, a thermoelectric conversion module includes a thermoelectric conversion portion, a first external electrode, and a second external electrode. The thermoelectric conversion portion includes a single thermoelectric conversion portion element, or electrically connected thermoelectric conversion portion elements. The thermoelectric conversion portion element includes a high temperature electrode, low temperature electrodes, and an n-type and a p-type thermoelectric conversion semiconductor layer disposed between the high temperature electrode and the low temperature electrodes. The first and the second external electrode are electrically connected to one of the low temperature electrode and another one of the low temperature electrode respectively. The first external electrode and the second external electrode are disposed opposite each other with the thermoelectric conversion portion therebetween in such a manner that the centerlines of the first and second external electrodes are aligned substantially in line with each other.
摘要翻译：根据一个实施例，热电转换模块包括热电转换部分，第一外部电极和第二外部电极。热电转换部包括单个热电转换部元件或电连接的热电转换部元件。热电转换部元件包括高温电极，低温电极以及设置在高温电极和低温电极之间的n型和p型热电转换半导体层。第一外部电极和第二外部电极分别电连接到低温电极和低温电极中的一个。第一外部电极和第二外部电极以其中的热电转换部分彼此相对设置，使得第一和第二外部电极的中心线基本上彼此对齐。

9. 发明申请

US20070256427A1 THERMOELECTRIC DEVICE 审中-公开
标题翻译：热电装置
公开(公告)号：US20070256427A1
公开(公告)日：2007-11-08
申请号：US11694073
申请日：2007-03-30
申请人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
发明人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
IPC分类号： F25B21/02
CPC分类号： H01L35/06 , H01L35/30 , H01L35/32 , H01L35/34 , H05K1/0204 , H05K2201/10219 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144
摘要： In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.
摘要翻译：为了提供高度可靠的热电装置，在热电装置中，按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的散热侧板。多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。吸热侧电极与这些热电元件的吸热侧端面滑动接触。

10. 发明申请

US20060123799A1 Thermoelectric device 有权
公开(公告)号：US20060123799A1
公开(公告)日：2006-06-15
申请号：US11344118
申请日：2006-02-01
申请人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
发明人： Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
IPC分类号： F25B21/02 , H01L35/28
CPC分类号： H01L35/06 , H01L35/30 , H01L35/32 , H01L35/34 , H05K1/0204 , H05K2201/10219 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144
摘要： In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

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