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1. 发明授权

US08752276B2 Method of manufacturing rotating electrical machine 有权
标题翻译：旋转电机制造方法
公开(公告)号：US08752276B2
公开(公告)日：2014-06-17
申请号：US13355861
申请日：2012-01-23
申请人： Toshiyuki Yoshikawa , Satoru Hara
发明人： Toshiyuki Yoshikawa , Satoru Hara
IPC分类号： H02K15/00
CPC分类号： H02K15/00 , H02K7/1004
摘要： A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.
摘要翻译：旋转电机的制造方法具有如下步骤：在使夹具和滑轮沿上下方向接触的同时将盖容纳在夹具空间中，使得操作空间被密封，并且主体将操作空间减压到低于大气压的压力，将盖移动到减压操作空间中的上侧，并将盖压配合到滑轮中。由此，与在大气压下配合的情况相比，可以抑制由反作用力作用而在盖的轴向上的倾斜和偏移。压力。因此，盖的压配合状态可以稳定。

2. 发明授权

US08097950B2 Semiconductor device and electronic component module using the same 失效
标题翻译：半导体器件和使用其的电子元件模块
公开(公告)号：US08097950B2
公开(公告)日：2012-01-17
申请号：US11620799
申请日：2007-01-08
申请人： Satoru Hara , Shuzo Akejima
发明人： Satoru Hara , Shuzo Akejima
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/4046 , H05K7/142 , H05K2201/10416 , H05K2201/10704 , H05K2201/2036 , H05K2201/209 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.
摘要翻译：半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

3. 发明授权

US07788791B2 Method of joining a plurality of conductor segments to form stator winding 有权
标题翻译：连接多个导体段以形成定子绕组的方法
公开(公告)号：US07788791B2
公开(公告)日：2010-09-07
申请号：US12003017
申请日：2007-12-19
申请人： Satoru Hara
发明人： Satoru Hara
IPC分类号： H02K15/00 , H02K15/14
CPC分类号： H02K15/0081 , H02K15/064 , Y10T29/49009 , Y10T29/49012 , Y10T29/49071 , Y10T29/53143
摘要： In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.
摘要翻译：在一种方法中，使第一电极移动以与第一成对导体段的第一配对端接触。接下来，第二电极相对于第一成对端移动。经由第一成对导体段的第一配对端在第一电极和第二电极之间建立电传导，以基于第一配对导体段的第一配对端焊接第一配对导体段的第一配对端其间导电。接下来，当第一电极与第一配对端保持接触时，第二电极相对于第二成对导体段的第二配对端移动。通过焊接的第一成对端和第二成对端，在第一电极和第二电极之间建立导电，从而基于它们之间的导电焊接第二成对导体段的第二配对端。

4. 发明申请

US20090197653A1 MOBILE APPARATUS 审中-公开
标题翻译：手机设备
公开(公告)号：US20090197653A1
公开(公告)日：2009-08-06
申请号：US12269399
申请日：2008-11-12
申请人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
发明人： Satoshi Mizoguch , Naoto Ito , Hiroshi Shimasaki , Satoru Hara , Takahiro Sogou , Taizo Tomioka
IPC分类号： H04M1/02 , A45F5/00
CPC分类号： H01Q1/273
摘要： According one aspect of the invention, there is provided a mobile apparatus including: a main face; a back face opposite to the main face, the back face being printed with visible user information; a thickness from the main face to the back face; an antenna disposed at a position nearer the back face than the main face; and an attachment portion attachable with a wearing tool, the wearing tool allowing a user to wear the mobile apparatus.
摘要翻译：根据本发明的一个方面，提供了一种移动装置，包括：主面; 与主面相对的背面，背面印有可见的用户信息; 从主面到背面的厚度; 设置在比所述主面更靠近所述背面的位置的天线; 以及可与佩戴工具相连的附接部分，所述佩戴工具允许使用者佩戴移动装置。

5. 发明授权

US08653651B2 Semiconductor apparatus and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08653651B2
公开(公告)日：2014-02-18
申请号：US13405665
申请日：2012-02-27
申请人： Masayuki Uchida , Takashi Togasaki , Satoru Hara , Kentaro Suga
发明人： Masayuki Uchida , Takashi Togasaki , Satoru Hara , Kentaro Suga
IPC分类号： H01L23/34
CPC分类号： H01L23/367 , H01L23/42 , H01L23/492 , H01L24/26 , H01L24/29 , H01L24/83 , H01L2224/26165 , H01L2224/26175 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/8314 , H01L2224/83815 , H01L2924/00013 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/351 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.
摘要翻译：根据一个实施例，半导体装置包括半导体器件，散热器，调节单元，容纳单元和保持单元。散热器通过插入的焊料层与半导体器件接合。调节单元构造成调节半导体器件和散热器之间的尺寸。容纳单元构造成在容纳单元的内部容纳熔融的焊料。保持单元被配置为允许保持在保持单元的内部的熔融焊料。保持单元构造为在容纳单元中所含的熔融焊料的量不足的情况下补充熔融的焊料。保持单元被配置为在容纳单元中包含的熔融焊料的量过多的情况下回收熔融的焊料。

6. 发明授权

US08459201B2 Droplet applying device, droplet applying method, liquid crystal display panel manufacturing apparatus, and liquid crystal display panel manufacturing method 有权
标题翻译：液滴施加装置，液滴施加方法，液晶显示面板制造装置和液晶显示面板的制造方法
公开(公告)号：US08459201B2
公开(公告)日：2013-06-11
申请号：US12741211
申请日：2008-11-06
申请人： Satoru Hara , Takahiro Yamazaki , Akihiro Shigeyama , Hideyuki Suzuki , Makoto Kanbe , Tadashi Shiozaki
发明人： Satoru Hara , Takahiro Yamazaki , Akihiro Shigeyama , Hideyuki Suzuki , Makoto Kanbe , Tadashi Shiozaki
IPC分类号： B05C11/00 , B05B7/06 , B05B13/02
CPC分类号： G02F1/1341 , G02F1/1303 , G02F2001/13415
摘要： A droplet applying device (2) includes: application heads (2d) configured to eject an application liquid as multiple droplets toward to-be-coated subjects (K1, K2); a moving mechanism (2c) configured to move each of the to-be-coated subjects (K1, K2) and the application heads (2d) relative to each other; and a rotating mechanism (2b) configured to rotate the to-be-coated subjects (K1, K2) in a plane intersecting with an ejecting direction in which the multiple droplets are ejected.
摘要翻译：液滴施加装置（2）包括：施加头（2d），构造成将多个液滴喷射到待涂覆的对象（K1，K2）上; 移动机构（2c），其构造成相对于彼此移动被涂覆物体（K1，K2）和施加头（2d）中的每一个; 以及旋转机构（2b），其配置成在与喷射多个液滴的喷射方向相交的平面中旋转被涂覆物体（K1，K2）。

7. 发明申请

US20110263133A1 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：半导体器件制造设备和半导体器件制造方法
公开(公告)号：US20110263133A1
公开(公告)日：2011-10-27
申请号：US13092523
申请日：2011-04-22
申请人： Satoru Hara , Shingo Tamai , Akihiro Shigeyama , Michio Ogawa , Hitoshi Aoyagi , Hiroyuki Tanaka , Yasuo Tane , Yukio Katamura
发明人： Satoru Hara , Shingo Tamai , Akihiro Shigeyama , Michio Ogawa , Hitoshi Aoyagi , Hiroyuki Tanaka , Yasuo Tane , Yukio Katamura
IPC分类号： H01L21/30 , B05C5/00
CPC分类号： H01L21/6715 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/67115 , H01L21/67207 , H01L21/67766 , H01L21/67778 , H01L21/6838 , H01L21/68742
摘要： A semiconductor device manufacturing apparatus includes: an accommodation section accommodating an application object; an irradiation section irradiating the application object taken out from the accommodation section with ultraviolet light; an application section including a stage allowing the application object to be placed thereon and an application head discharging a plurality of droplets of an adhesive to the application object placed on the stage, the application section applying the adhesive through the application head to the application object which is irradiated by ultraviolet light through the irradiation section and is placed on the stage; a drying section drying the adhesive applied on the application object with heat; and a transport section including a hand supporting the application object, the transport section which is capable of transporting the application object accommodated in the accommodation section to the irradiation section, the application section, and the drying section.
摘要翻译：一种半导体器件制造设备，包括：容纳应用对象的容纳部; 照射部，用紫外线照射从所述收纳部取出的所述应用物体; 应用部分，包括允许将应用对象放置在其上的阶段以及将多个粘合剂液滴排放到放置在舞台上的应用对象的应用头，所述应用部分通过应用头将粘合剂施加到应用对象，通过紫外线照射通过照射部分并放置在舞台上; 干燥部分，用热干燥涂布在涂敷物上的粘合剂; 以及运送部，其包括支撑所述应用对象的手，所述运送部能够将容纳在所述收容部中的所述应用物体运送到所述照射部，所述应用部和所述干燥部。

8. 发明申请

US20100255208A1 DROPLET APPLYING DEVICE, DROPLET APPLYING METHOD, LIQUID CRYSTAL DISPLAY PANEL MANUFACTURING APPARATUS, AND LIQUID CRYSTAL DISPLAY PANEL MANUFACTURING METHOD 有权
标题翻译：液体涂布装置，液体涂布方法，液晶显示面板制造装置和液晶显示面板制造方法
公开(公告)号：US20100255208A1
公开(公告)日：2010-10-07
申请号：US12741211
申请日：2008-11-06
申请人： Satoru Hara , Takahiro Yamazaki , Akihiro Shigeyama , Hideyuki Suzuki , Makoto Kanbe , Tadashi Shiozaki
发明人： Satoru Hara , Takahiro Yamazaki , Akihiro Shigeyama , Hideyuki Suzuki , Makoto Kanbe , Tadashi Shiozaki
IPC分类号： B05D1/30 , B05B13/02
CPC分类号： G02F1/1341 , G02F1/1303 , G02F2001/13415
摘要： A droplet applying device (2) includes: application heads (2d) configured to eject an application liquid as multiple droplets toward to-be-coated subjects (K1, K2); a moving mechanism (2c) configured to move each of the to-be-coated subjects (K1, K2) and the application heads (2d) relative to each other; and a rotating mechanism (2b) configured to rotate the to-be-coated subjects (K1, K2) in a plane intersecting with an ejecting direction in which the multiple droplets are ejected.
摘要翻译：液滴施加装置（2）包括：施加头（2d），构造成将多个液滴喷射到待涂覆的对象（K1，K2）上; 移动机构（2c），其构造成相对于彼此移动被涂覆物体（K1，K2）和施加头（2d）中的每一个; 以及旋转机构（2b），其配置成在与喷射多个液滴的喷射方向相交的平面中旋转被涂覆物体（K1，K2）。

9. 发明申请

US20080148551A1 Method of joining a plurality of conductor segments to form stator winding 有权
标题翻译：连接多个导体段以形成定子绕组的方法
公开(公告)号：US20080148551A1
公开(公告)日：2008-06-26
申请号：US12003017
申请日：2007-12-19
申请人： Satoru Hara
发明人： Satoru Hara
IPC分类号： H02K15/04 , B23K9/12
CPC分类号： H02K15/0081 , H02K15/064 , Y10T29/49009 , Y10T29/49012 , Y10T29/49071 , Y10T29/53143
摘要： In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.
摘要翻译：在一种方法中，使第一电极移动以与第一成对导体段的第一配对端接触。接下来，第二电极相对于第一成对端移动。经由第一成对导体段的第一配对端在第一电极和第二电极之间建立电传导，以基于第一配对导体段的第一配对端焊接第一配对导体段的第一配对端其间导电。接下来，当第一电极与第一配对端保持接触时，第二电极相对于第二成对导体段的第二配对端移动。通过焊接的第一成对端和第二成对端，在第一电极和第二电极之间建立导电，从而基于它们之间的导电焊接第二成对导体段的第二配对端。

10. 发明申请

US20070159204A1 SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME 失效
标题翻译：半导体器件和使用该器件的电子元件模块
公开(公告)号：US20070159204A1
公开(公告)日：2007-07-12
申请号：US11620799
申请日：2007-01-08
申请人： Satoru Hara , Shuzo Akejima
发明人： Satoru Hara , Shuzo Akejima
IPC分类号： G01R31/26
CPC分类号： H05K3/325 , H01L23/32 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/4046 , H05K7/142 , H05K2201/10416 , H05K2201/10704 , H05K2201/2036 , H05K2201/209 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.
摘要翻译：半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

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