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1. 发明授权

US6093894A Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer 失效
标题翻译：多导体接合连接组件，通过基层直接热压接合
公开(公告)号：US6093894A
公开(公告)日：2000-07-25
申请号：US883167
申请日：1997-06-26
申请人： Richard Lee Carlson , Bruce Dale King , Rudolph Manuel Lopez , Alex Irwin Panasiuk , George G. Zamora
发明人： Richard Lee Carlson , Bruce Dale King , Rudolph Manuel Lopez , Alex Irwin Panasiuk , George G. Zamora
IPC分类号： H01L23/495 , H05K1/00 , H05K3/36 , H01B11/02 , H05K1/02
CPC分类号： H01L23/49572 , H01L24/24 , H01L24/82 , H05K3/361 , H01L2224/16 , H01L2224/2402 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2224/45144 , H01L2224/73267 , H01L24/45 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H01L2924/351 , H05K1/0298 , H05K2203/0195 , H05K2203/1189 , Y10T29/49149 , Y10T29/49151 , Y10T29/49179 , Y10T29/49181
摘要： A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.
摘要翻译：描述了通过多导体扁平电缆或电气部件的盖子的导体的接合开口，以允许其直接接合。多导体扁平电缆或电气部件具有设置在其上的导体的基底层和在接合位置处优选通过模切而在其中设置有开口的平坦盖。具有开口的平坦盖层叠到基层上，覆盖导体，使得导体在通过接合开口暴露的同时由基底层进行机械稳定化。本发明的多导体扁平电缆或电气部件的形状可以是高度变化的。在一个实施例中，扁平多导体电气部件围绕中心区域周向地延伸，例如完全包含在IC芯片中，IC芯片可以在结合位置连接到其导体。导体从IC芯片扇出到外周的连接处，顶盖完全消除。

2. 发明授权

US06446335B1 Direct thermal compression bonding through a multiconductor base layer 失效
标题翻译：通过多导体基底层进行直接热压接
公开(公告)号：US06446335B1
公开(公告)日：2002-09-10
申请号：US09542918
申请日：2000-04-04
申请人： Richard Lee Carlson , Bruce Dale King , Rudolph Manuel Lopez , Alex Irwin Panasiuk , George G. Zamora
发明人： Richard Lee Carlson , Bruce Dale King , Rudolph Manuel Lopez , Alex Irwin Panasiuk , George G. Zamora
IPC分类号： H01R4304
CPC分类号： H01L23/49572 , H01L24/24 , H01L24/45 , H01L24/82 , H01L2224/16 , H01L2224/2402 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2224/45144 , H01L2224/73267 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H01L2924/351 , H05K1/0298 , H05K3/361 , H05K2203/0195 , H05K2203/1189 , Y10T29/49149 , Y10T29/49151 , Y10T29/49179 , Y10T29/49181 , H01L2224/48 , H01L2924/00
摘要： A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.
摘要翻译：通过从支撑导体的基底层的背面通过基底层熔化而导致多导体扁平电缆或电气部件的热压接的方法。多导体扁平电缆或电气部件包括其上布置有导体的基底层和优选通过模切而在接合位置处设置有开口的平坦盖。具有开口的平坦盖层叠到基层上，覆盖导体，使得导体在通过接合开口暴露的同时由基底层进行机械稳定化。本发明的多导体扁平电缆或电气部件的形状可以是高度变化的。在一个实施例中，扁平多导体电气部件围绕中心区域周向地延伸，例如完全包含在IC芯片中，IC芯片可以在结合位置连接到其导体。导体从IC芯片扇出到外周的连接处，顶盖完全消除。

3. 发明授权

US5961343A Strain relief clamp for supporting flexible ribbon cables 失效
标题翻译：用于支撑柔性带状电缆的应力消除夹
公开(公告)号：US5961343A
公开(公告)日：1999-10-05
申请号：US13489
申请日：1998-01-26
申请人： Paul Yu-Fei Hu , Rudolph Manuel Lopez
发明人： Paul Yu-Fei Hu , Rudolph Manuel Lopez
IPC分类号： G11B5/48 , H01R12/70 , H01R13/58
CPC分类号： G11B5/486 , H01R23/661
摘要： Disclosed is a strain relief clamp for supporting one or more flexible ribbon cables. A first stiff member has an indentation wider than a flexible ribbon cable, and a height less than the thickness of a flexible ribbon cable. Stacked pliant members are stacked on the first stiff member. Each pliant member has an indentation on the side facing away from the first stiff member. The indentations are substantially equal in width and height to the indentation of the first stiff member. A second stiff member is located on the end of the stack opposite the first stiff member and has a protrusion at least as wide as a flexible ribbon cable facing the indentation of the adjacent pliant member. The protrusion height is such that the sum of its height and the thicknesses of the flexible ribbon cables is greater than the sum of the heights of the indentations of the first stiff member and of the stacked pliant members. Thus, upon clamping the members together, the flexible ribbon cables are compressed when placed in the indentations of the first stiff member and the stacked pliant member adjacent the second stiff member protrusion, providing strain relief of the flexible ribbon cables. The surfaces of the members engaging the flexible ribbon cables each may be textured to improve the friction characteristics.
摘要翻译：公开了用于支撑一个或多个柔性带状电缆的应变消除夹。第一刚性构件具有比柔性带状电缆更宽的凹陷，并且高度小于柔性带状电缆的厚度。堆叠的扁平构件堆叠在第一刚性构件上。每个柔顺构件在远离第一刚性构件的一侧具有凹陷。压痕的宽度和高度与第一刚性构件的压痕基本相等。第二刚性构件位于与第一刚性构件相对的堆叠的端部上，并且具有至少与面向相邻柔性构件的凹陷的柔性带状电缆一样宽的突起。突出高度使得其柔性带状电缆的高度和厚度的总和大于第一刚性构件和堆叠的柔性构件的凹陷的高度之和。因此，当将构件夹紧在一起时，柔性带状电缆在被放置在与第二刚性构件突起部分相邻的第一刚性构件和堆叠的柔性构件的凹陷中时被压缩，从而提供柔性带状电缆的应变消除。与柔性带状电缆接合的构件的表面可以被纹理化以改善摩擦特性。

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