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    • 3. 发明授权
    • High quality factor capacitor
    • 高品质因素电容器
    • US06208500B1
    • 2001-03-27
    • US09200542
    • 1998-11-25
    • Sam E. AlexanderRandy L. YachRoger St. Amand
    • Sam E. AlexanderRandy L. YachRoger St. Amand
    • H01G4005
    • H01L28/40H01L27/0805
    • An improved high quality factor capacitive device is implemented on a single, monolithic integrated circuit. The new layout techniques improve the quality factor (Q) of the capacitor by reducing intrinsic resistance of the capacitor by reducing the distance between the metal contacts of the top and bottom conductive plates. The layout techniques require laying out the top conductive plate of the capacitor in strips such that metal contacts from the bottom conductive plate pass in between the strips and through the dielectric layer. Alternatively, the apertures may be etched into the top conductive plate so that metal contacts pass through the apertures and connect to the bottom conductive plate.
    • 改进的高品质因素电容器件在单个单片集成电路上实现。 新的布局技术通过减小顶部和底部导电板的金属触点之间的距离来降低电容器的固有电阻,从而提高了电容器的品质因数(Q)。 布局技术需要将带状电容器的顶部导电板布置成使得来自底部导电板的金属接触通过条带之间并通过介电层。 或者,孔可以被蚀刻到顶部导电板中,使得金属触点穿过孔并连接到底部导电板。
    • 7. 发明授权
    • Radio frequency identification tag on a single layer substrate
    • 单层基板上的射频识别标签
    • US06424263B1
    • 2002-07-23
    • US09728217
    • 2000-12-01
    • Youbok LeeLee FureyRoger St. Amand
    • Youbok LeeLee FureyRoger St. Amand
    • G08B1314
    • G06K19/0775G06K19/0726G06K19/07749H01L2224/48091H01L2924/01079H01L2924/19041H01L2924/00014
    • A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.” The encapsulation may be epoxy, plastic or any protective material known to one of ordinary skill in the art of electronic circuit encapsulation. The insulated coating may be of any type suitable for the application of use of the RFID tag.
    • 单层基板上的射频识别(RFID)标签包括半导体集成电路RFID标签装置和天线电路。 连接跳线可用于桥接天线电路线圈匝数。 RFID标签装置位于与形成并联谐振天线电路的电感线圈和电容器相同的一侧。 电感线圈具有内端和外端。 内端或外端可以直接连接到RFID标签装置,并且外端或内端可以通过电感线圈匝上的跳线连接到RFID标签装置,或者当RFID标签装置在 连接到内端和外端。 可以使用封装(glop顶部)来密封RFID标签装置和跳线,并且可以使用绝缘涂层来覆盖基板的整个表面以创建便宜的“芯片上的标签”。 封装可以是环氧树脂,塑料或电子电路封装领域的普通技术人员已知的任何保护材料。 绝缘涂层可以是适合于使用RFID标签的任何类型。