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1. 发明授权

US09941245B2 Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate 有权
公开(公告)号：US09941245B2
公开(公告)日：2018-04-10
申请号：US11860922
申请日：2007-09-25
申请人： Oswald Skeete , Ravi Mahajan , John Guzek
发明人： Oswald Skeete , Ravi Mahajan , John Guzek
IPC分类号： H01L25/065 , H01L23/538 , H01L25/10 , H01L25/16 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L25/0652 , H01L21/563 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L25/105 , H01L25/16 , H01L2224/05548 , H01L2224/05573 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05599
摘要： In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one side, an encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes at least one surface substantially planar to said microelectronic die active surface, a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface, a plurality of build-up layers disposed on said first dielectric material layer, and a plurality of conductive traces disposed on said first dielectric material layer and said build-up layers and in electrical contact with said microelectronic die active surface; and a second element coupled to the first element, the second element including a substrate having a plurality of dielectric material layers and conductive traces to conductively couple conductive contacts on a top surface with conductive contacts on a bottom surface, said conductive contacts on said top surface conductively coupled with said conductive traces of said first element. Other embodiments are also disclosed and claimed.

2. 发明申请

US20110281375A1 MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT 有权
标题翻译：磁性微电子器件附件
公开(公告)号：US20110281375A1
公开(公告)日：2011-11-17
申请号：US12778335
申请日：2010-05-12
申请人： Rajasekaran Swaminathan , Ravindranath Ravi Mahajan , John S. Guzek
发明人： Rajasekaran Swaminathan , Ravindranath Ravi Mahajan , John S. Guzek
IPC分类号： H01L21/50
CPC分类号： H01L24/11 , H01L21/563 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/95 , H01L2224/0401 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11902 , H01L2224/13082 , H01L2224/13083 , H01L2224/13099 , H01L2224/13111 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/1401 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/81121 , H01L2224/81122 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81411 , H01L2224/81457 , H01L2224/8146 , H01L2224/81815 , H01L2224/83102 , H01L2224/94 , H01L2224/95 , H01L2224/95133 , H01L2224/95136 , H01L2924/00011 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2224/11 , H01L2924/00014 , H01L2924/01027 , H01L2924/01028 , H01L2924/0105 , H01L2224/81 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2224/81805
摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic devices of the microelectronic packages may have magnetic attachment structures comprising a magnetic material formed on an attachment structure. The microelectronic device may be aligned on a substrate with a magnetic field and then held in place therewith while being attached to the substrate. The microelectronic device may also be aligned with an alignment plate which magnetically aligns and holds the component in place while being packaged.
摘要翻译：本公开涉及制造微电子封装的领域，其中微电子封装的微电子器件可具有包括形成在附接结构上的磁性材料的磁性附着结构。微电子器件可以在具有磁场的衬底上对准，然后在附着于衬底的同时保持在其上。微电子器件还可与对准板对齐，该对准板在包装时磁性对准和保持部件就位。

3. 发明申请

US20110101491A1 INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD UP LAYERS AND A LESSER DENSITY CORE OR CORELESS SUBSTRATE 有权
标题翻译：集成电路封装，包括高密度BUX-LESS BUILD UP层和较低密度芯或无损基板
公开(公告)号：US20110101491A1
公开(公告)日：2011-05-05
申请号：US11860922
申请日：2007-09-25
申请人： OSWALD SKEETE , RAVI MAHAJAN , JOHN GUZEK
发明人： OSWALD SKEETE , RAVI MAHAJAN , JOHN GUZEK
IPC分类号： H01L27/06 , H01L23/498
CPC分类号： H01L25/0652 , H01L21/563 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L25/105 , H01L25/16 , H01L2224/05548 , H01L2224/05573 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05599
摘要： In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one side, an encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes at least one surface substantially planar to said microelectronic die active surface, a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface, a plurality of build-up layers disposed on said first dielectric material layer, and a plurality of conductive traces disposed on said first dielectric material layer and said build-up layers and in electrical contact with said microelectronic die active surface; and a second element coupled to the first element, the second element including a substrate having a plurality of dielectric material layers and conductive traces to conductively couple conductive contacts on a top surface with conductive contacts on a bottom surface, said conductive contacts on said top surface conductively coupled with said conductive traces of said first element. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，提出了包括高密度无凸起构建层和较小密度芯或无芯衬底的集成电路封装。在这方面，引入了具有第一元件的装置，该第一元件包括具有活性表面和至少一个侧面的微电子管芯，邻近所述至少一个微电子管芯侧的封装材料，其中所述封装材料包括至少一个表面，所述微电子管芯有源表面，设置在所述微电子管芯有源表面和所述封装材料表面的至少一部分上的第一介电材料层，设置在所述第一介电材料层上的多个堆积层，以及多个导电迹线设置在所述第一介电材料层和所述堆积层上并与所述微电子管芯有源表面电接触; 以及耦合到所述第一元件的第二元件，所述第二元件包括具有多个电介质材料层和导电迹线的衬底，所述导电迹线导电地将顶表面上的导电触点与底表面上的导电触点导电，所述顶表面上的所述导电触点与所述第一元件的所述导电迹线导电耦合。还公开并要求保护其他实施例。

4. 发明申请

US20090237884A1 Electromagnetically-actuated micropump for liquid metal alloy 有权
标题翻译：用于液态金属合金的电磁致动微型泵
公开(公告)号：US20090237884A1
公开(公告)日：2009-09-24
申请号：US12454413
申请日：2009-05-18
申请人： loan Sauciuc , Ravi Mahajan
发明人： loan Sauciuc , Ravi Mahajan
IPC分类号： H05K7/20 , F04B43/02
CPC分类号： H01L23/427 , F28D15/00 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.
摘要翻译：本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起所述液态金属合金的第三部分离开所述腔到所述管的出口端。

5. 发明申请

US20060127672A1 Method of providing a heat spreader 审中-公开
标题翻译：提供散热器的方法
公开(公告)号：US20060127672A1
公开(公告)日：2006-06-15
申请号：US11355698
申请日：2006-02-15
申请人： Gregory Chrysler , Abhay Watwe , Ravi Mahajan
发明人： Gregory Chrysler , Abhay Watwe , Ravi Mahajan
IPC分类号： B32B9/00
CPC分类号： B32B15/04 , C23C16/56 , H01L23/36 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , Y10T428/30 , Y10T428/31678 , H01L2924/00
摘要： A method of preparing a diamond body, and a diamond body thus prepared. A covering layer is provided on at least one surface of the diamond body such that the covering layer adheres to the at least one surface. The covering layer is in turn provided with a predetermined configuration.
摘要翻译：一种制备金刚石体的方法，以及如此制备的金刚石体。覆盖层设置在金刚石主体的至少一个表面上，使得覆盖层粘附到至少一个表面。覆盖层依次具有预定的构造。

6. 发明申请

US20060055030A1 Using external radiators with electroosmotic pumps for cooling integrated circuits 有权
公开(公告)号：US20060055030A1
公开(公告)日：2006-03-16
申请号：US11270071
申请日：2005-11-09
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2224/82
摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

7. 发明授权

US06934154B2 Micro-channel heat exchangers and spreaders 有权
标题翻译：微通道换热器和吊具
公开(公告)号：US06934154B2
公开(公告)日：2005-08-23
申请号：US10404215
申请日：2003-03-31
申请人： Ravi Prasher , Ravi Mahajan
发明人： Ravi Prasher , Ravi Mahajan
IPC分类号： F28D15/02 , F28F7/02 , H01L21/56 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0266 , F28D2021/0029 , F28F7/02 , F28F2260/02 , H01L21/563 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass having a plurality of open microchannels such that a hermetic seal is formed between the die and the bases of the microchannel walls, thus forming a plurality of closed microchannels. In another set of configurations, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. The microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The microchannels are configured to support two-phase heat transfer using a working fluid such as water.
摘要翻译：公开了用于冷却集成电路（IC）模具的两相微通道热交换器及其采用的冷却系统。热交换器包括其中形成有多个微通道的热质量。在一组构造中，IC管芯耦合到具有多个开放微通道的热质量，使得在管芯和微通道壁的基部之间形成气密密封，从而形成多个封闭的微通道。在另一组配置中，单独的微通道热交换器热耦合到IC管芯，并通过耦合到IC芯片上安装有IC管芯的基板而可操作地耦合到IC管芯。微通道热交换器可以用于包括泵和排热器的闭环冷却系统中。微通道被配置为支持使用诸如水的工作流体的两相热传递。

8. 发明申请

US20050117301A1 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling 审中-公开
公开(公告)号：US20050117301A1
公开(公告)日：2005-06-02
申请号：US11029136
申请日：2005-01-03
申请人： Ravi Prasher , Ravi Mahajan
发明人： Ravi Prasher , Ravi Mahajan
IPC分类号： F28D15/02 , G06F1/20 , H01L23/40 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0233 , F28F3/12 , F28F2215/06 , G06F1/203 , G06F2200/201 , H01L23/4006 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20809 , H01L2224/0401
摘要： A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defines an internal channel having walls configured to condense a working fluid from a vapor phase upon entering the channel into a liquid phase upon exiting the channel. The chassis comprises a shell formed from a base coupled to a plurality of walls. At least one condensing volume is formed in the base and/or the walls of the chassis. The condensing volume is configured to condense a working fluid from a vapor phase to a liquid phase as the working fluid is passed through it.

9. 发明申请

US20050117300A1 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling 审中-公开
标题翻译：通道散热器和底盘，集成散热器，用于两相冷却
公开(公告)号：US20050117300A1
公开(公告)日：2005-06-02
申请号：US11029001
申请日：2005-01-03
申请人： Ravi Prasher , Ravi Mahajan
发明人： Ravi Prasher , Ravi Mahajan
IPC分类号： F28D15/02 , G06F1/20 , H01L23/40 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0233 , F28F3/12 , F28F2215/06 , G06F1/203 , G06F2200/201 , H01L23/4006 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20809 , H01L2224/0401
摘要： A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defines an internal channel having walls configured to condense a working fluid from a vapor phase upon entering the channel into a liquid phase upon exiting the channel. The chassis comprises a shell formed from a base coupled to a plurality of walls. At least one condensing volume is formed in the base and/or the walls of the chassis. The condensing volume is configured to condense a working fluid from a vapor phase to a liquid phase as the working fluid is passed through it.
摘要翻译：一个通道散热器和一个具有一个或多个积分冷凝体积的装置底盘，适用于与两相冷却回路导通的散热器。通道散热器包括多个中空翅片从该基座延伸的基座。每个中空的翅片限定了内部通道，其具有被配置为在离开通道时进入通道进入液相时从气相冷凝工作流体的壁。底盘包括由联接到多个壁的基座形成的壳体。在底座和/或底盘的壁中形成至少一个冷凝体积。冷凝体积被配置为当工作流体通过工作流体时将工作流体从气相冷凝到液相。

10. 发明申请

US20070164427A1 Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls 失效
标题翻译：用于液态金属合金的电磁致动微型泵封装在具有柔性侧壁的空腔中
公开(公告)号：US20070164427A1
公开(公告)日：2007-07-19
申请号：US11322495
申请日：2005-12-30
申请人： Ioan Sauciuc , Ravi Mahajan
发明人： Ioan Sauciuc , Ravi Mahajan
IPC分类号： H01L23/34
CPC分类号： H01L23/427 , F28D15/00 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a heat pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the heat pipe.
摘要翻译：本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的热管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起液态金属合金的第三部分将空腔排出到热管的出口端。

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