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1. 发明申请

US20070138623A1 Carbon nanotube micro-chimney and thermo siphon die-level cooling 有权
标题翻译：碳纳米管微型烟囱和热虹吸管模具级冷却
公开(公告)号：US20070138623A1
公开(公告)日：2007-06-21
申请号：US11305464
申请日：2005-12-16
申请人： James Maveety , Gregory Chrysler , Unnikrishnan Vadakkanmaruveedu
发明人： James Maveety , Gregory Chrysler , Unnikrishnan Vadakkanmaruveedu
IPC分类号： H01L23/34
CPC分类号： H01L23/427 , H01L23/3677 , H01L23/373 , H01L2924/0002 , Y10S977/72 , Y10S977/742 , H01L2924/00
摘要： A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die.
摘要翻译：一种具有半导体封装的方法，装置和系统，包括使用碳纳米管的微型烟囱或热虹吸管，以改善集成电路管芯的有效热导率。

2. 发明申请

US20060226541A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks 失效
公开(公告)号：US20060226541A1
公开(公告)日：2006-10-12
申请号：US11448232
申请日：2006-06-07
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
IPC分类号： H01L23/34
CPC分类号： F04B17/00 , F04B19/006 , H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2225/06589 , H01L2924/01322
摘要： A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.

3. 发明申请

US20050074953A1 Integrated re-combiner for electroosmotic pumps using porous frits 有权
标题翻译：使用多孔玻璃料的电渗泵的集成再组合器
公开(公告)号：US20050074953A1
公开(公告)日：2005-04-07
申请号：US10669205
申请日：2003-09-24
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
IPC分类号： F04B19/00 , H01L21/30 , H01L21/44 , H01L21/46 , H01L23/473
CPC分类号： F04B19/006 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/01078 , H01L2924/10253 , H01L2924/00
摘要： Trenches may be formed in the upper surfaces of a pair of wafers. Each trench may be coated with a catalyst that is capable of removing oxygen or hydrogen from a fluid used for cooling in a system making use of the electroosmotic effect for pumping. Channels may be formed to communicate fluid to and from the trench coated with the catalyst. The substrates may be combined in face-to-face abutment, for example using copper-to-copper bonding to form a re-combiner.
摘要翻译：沟槽可以形成在一对晶片的上表面中。每个沟槽可以涂覆有能够在利用用于泵送的电渗效应的系统中用于冷却的流体中除去氧气或氢气的催化剂。可以形成通道以将流体与涂覆有催化剂的沟槽连通。基板可以以面对面邻接方式组合，例如使用铜 - 铜键合来形成再组合器。

4. 发明申请

US20050062150A1 Packaged electroosmotic pumps using porous frits for cooling integrated circuits 有权
标题翻译：包装电渗泵使用多孔玻璃料冷却集成电路
公开(公告)号：US20050062150A1
公开(公告)日：2005-03-24
申请号：US10669212
申请日：2003-09-24
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu
IPC分类号： H01L23/34 , H01L23/473 , H01L27/14
CPC分类号： H01L23/473 , H01L23/34 , H01L2224/16 , H01L2224/73253 , H01L2224/82
摘要： An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump.
摘要翻译：集成电渗泵可以结合在具有再组合器的相同的集成电路封装中，以及通过由电渗泵泵送的流体冷却的集成电路芯片。

5. 发明申请

US20060055030A1 Using external radiators with electroosmotic pumps for cooling integrated circuits 有权
公开(公告)号：US20060055030A1
公开(公告)日：2006-03-16
申请号：US11270071
申请日：2005-11-09
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2224/82
摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

6. 发明授权

US06981849B2 Electro-osmotic pumps and micro-channels 失效
标题翻译：电渗泵和微通道
公开(公告)号：US06981849B2
公开(公告)日：2006-01-03
申请号：US10323084
申请日：2002-12-18
申请人： Sarah E. Kim , R. Scott List , James Maveety , Alan Myers , Quat T. Vu , Ravi Prasher , Ravindranath V. Mahajan
发明人： Sarah E. Kim , R. Scott List , James Maveety , Alan Myers , Quat T. Vu , Ravi Prasher , Ravindranath V. Mahajan
IPC分类号： F04B44/08
CPC分类号： F04B19/006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing electro-osmotic pumps and micro-channels.
摘要翻译：本公开一般涉及微电子技术，更具体地，涉及使用电渗透泵和微通道来冷却有源电子器件的装置。

7. 发明申请

US20050179126A1 Diamond-silicon hybrid integrated heat spreader 有权
标题翻译：金刚石混合综合散热器
公开(公告)号：US20050179126A1
公开(公告)日：2005-08-18
申请号：US11104346
申请日：2005-04-12
申请人： Kramadhati Ravi , James Maveety
发明人： Kramadhati Ravi , James Maveety
IPC分类号： H01L23/373 , H01L23/495
CPC分类号： H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H01L2924/00 , H01L2224/0401
摘要： An electronic device includes a die further having a first major surface, and a second major surface. The electronic device also includes a plurality of connectors associated with the first major surface of the die, and an integrated heat spreader in thermally conductive relation with the second major surface of the die. The integrated heat spreader also has a layer of silicon, and a layer of diamond attached to the layer of silicon. The first major surface of the die attached to a printed circuit board. A method for forming a heat dissipating device includes placing a layer of diamond on a silicon substrate, and thinning the silicon substrate. The substrate is diced to form a plurality of heat dissipating devices sized to form a thermally conductive connection to a die. A surface of the silicon substrate is placed in thermal communication with a source of heat.
摘要翻译：电子设备包括还具有第一主表面的模具和第二主表面。电子设备还包括与管芯的第一主表面相关联的多个连接器，以及与管芯的第二主表面具有导热关系的集成散热器。集成的散热器还具有一层硅层和一层附着在硅层上的金刚石。芯片的第一个主表面附着在印刷电路板上。一种用于形成散热装置的方法包括将金刚石层放置在硅衬底上，并使硅衬底变薄。切割基板以形成多个散热装置，其大小以形成与管芯的导热连接。硅衬底的表面被放置成与热源热连通。

8. 发明申请

US20070242417A1 Forming carbon nanotube capacitors 有权
标题翻译：形成碳纳米管电容器
公开(公告)号：US20070242417A1
公开(公告)日：2007-10-18
申请号：US11244540
申请日：2005-10-06
申请人： Larry Mosley , James Maveety , Edward Prack
发明人： Larry Mosley , James Maveety , Edward Prack
IPC分类号： H01G9/04
CPC分类号： H01G4/008 , H01G4/30 , H01G4/33 , H01G4/35
摘要： A capacitor may be formed of carbon nanotubes. Carbon nanotubes, grown on substrates, may be formed in a desired pattern. The pattern may be defined by placing catalyst in appropriate locations for carbon nanotube growth from a substrate. Then, intermeshing arrays of carbon nanotubes may be formed by juxtaposing the carbon nanotubes formed on opposed substrates. In some embodiments, the carbon nanotubes may be covered by a dielectric which may be adhered by functionalizing the carbon nanotubes.
摘要翻译：电容器可以由碳纳米管形成。生长在基底上的碳纳米管可以以期望的图案形成。可以通过将催化剂置于适当的位置以从碳纳米管生长从衬底来限定图案。然后，可以通过并置形成在相对的基板上的碳纳米管来形成碳纳米管的相互啮合的阵列。在一些实施方案中，碳纳米管可以被电介质覆盖，电介质可以通过官能化碳纳米管而被粘附。

9. 发明申请

US20070155136A1 Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same 有权
标题翻译：碳纳米管和金属热界面材料，其制备方法，包含其的包装和含有其的体系
公开(公告)号：US20070155136A1
公开(公告)日：2007-07-05
申请号：US11323205
申请日：2005-12-30
申请人： Gregory Chrysler , Thomas Dory , James Maveety , Edward Prack , Unnikrishnan Vadakkanmaruveedu
发明人： Gregory Chrysler , Thomas Dory , James Maveety , Edward Prack , Unnikrishnan Vadakkanmaruveedu
IPC分类号： H01L21/20
CPC分类号： H01L23/373 , H01L51/529 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/16152 , Y10S977/742 , Y10S977/748 , Y10S977/847 , Y10T29/49126 , H01L2224/05599
摘要： A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.
摘要翻译：碳纳米管（CNT）阵列在衬底上图案化。衬底可以是微电子管芯或用于管芯的散热器。通过在衬底上使用图案化的催化剂来图案化图案化的CNT阵列，以通过生长形成CNT阵列。图案化的CNT阵列也可以通过使用衬底上的图案化掩模进行图案化，以通过生长形成CNT阵列。还使用使用CNT阵列从模具进行热传递的计算系统。

10. 发明申请

US20050093138A1 Using external radiators with electroosmotic pumps for cooling integrated circuits 失效
标题翻译：使用带有电渗泵的外部散热器来冷却集成电路
公开(公告)号：US20050093138A1
公开(公告)日：2005-05-05
申请号：US10698749
申请日：2003-10-31
申请人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
发明人： Sarah Kim , R. List , James Maveety , Alan Myers , Quat Vu , Ravi Prasher , Ravi Mahajan , Gilroy Vandentop
IPC分类号： H01L23/473 , H01L23/34
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2224/82
摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.
摘要翻译：要冷却的集成电路可以与冷却集成电路面对面邻接。冷却集成电路可以包括电渗泵，以通过微通道将冷却流体泵送通过冷却集成电路，从而冷却发热集成电路。电渗泵可以流体耦合到从包括集成电路的包装向上延伸的外部散热器。特别地，外部散热器可以安装在使散热器远离封装的管上。

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