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1. 发明申请

WO1997015077A1 POLYMER STUD-MATRIX HOUSING FOR MICROWAVE CIRCUIT ARRANGEMENTS 审中-公开
标题翻译：聚合物HÖCKERMATRIX住房微波电路
公开(公告)号：WO1997015077A1
公开(公告)日：1997-04-24
申请号：PCT/EP1996004404
申请日：1996-10-10
申请人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA-CENTRUM VZW , DUMOULIN, Ann , HEERMAN, Marcel , ROGGEN, Jean , BEYNE, Eric , VAN HOOF, Rita
发明人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA-CENTRUM VZW
IPC分类号： H01L23/13
CPC分类号： H01L23/66 , H01L23/13 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A polymer stud grid array for microwave circuit systems is proposed with the following elements: an injection-moulded three-dimensional substrate (S) made from an electrically insulating polymer; polymer studs (PS) arranged in one plane on the underside of the substrate (S) and formed during the injection moulding process; signal connections formed on several polymer studs (PS) by an end surface suitable for soldering; a potential connection (PA) formed on at least one polymer stud by an end surface suitable for soldering; strip conductors (SL) formed on the underside of the substrate (S) by a first structured metal layer (MS1), a dielectric layer (DE1) and a second structured metal layer (MS2), the first structured metal layer (MS1) having an electrically conducting connection to the potential connection (PA) and the second structured metal layer (MS2) of the strip conductors (SL) connecting the signal connections (SA) to dedicated internal connections (IA); and at least one microwave switching circuit (MIC) whose connections have electrically conducting connections with the internal connections (IA).
摘要翻译：它提出了一种用于微波电路装置的聚合物螺柱栅阵列，用注射模制，由电绝缘聚合物的，在基片（S）的下侧立体基板（S），其布置在注射模制聚合物螺柱（PS）平面和共同模制，在多个聚合物螺柱由第一结构化金属层上形成由可软焊端面（SA）在所述基板（S）形成的带状线（SL）的下侧形成，在至少一种聚合物螺柱（PS）用可焊接的端部表面（PA）形成电势端子，信号端子（PS）（MS1），介电层（DE1）和第二结构的金属层（MS2）被形成，其中所述第一结构化金属层（MS1）到电位连接（PA）导电地连接，并且其中，所述带状线的第二结构化金属层（MS2）（SL），所述信号连接（SA）具有相关联的附件的 nanschlüssen（IA）连接，并布置成与基片（S）上的至少一个，具有其端子连接到内部连接（IA）的微波集成电路（MIC）是导电连接。

2. 发明申请

WO1994028449A1 PROCESS FOR PRODUCING GUIDING ELEMENTS FOR OPTICAL WAVEGUIDE FIBRES 审中-公开
标题翻译：用于生产指导要点光纤光纤
公开(公告)号：WO1994028449A1
公开(公告)日：1994-12-08
申请号：PCT/DE1994000594
申请日：1994-05-24
申请人： SIEMENS AKTIENGESELLSCHAFT , INTERUNIVERSITY MICROELECTRONIC CENTER VZW , BAERT, Christiaan , DUMOULIN, Ann , ROGGEN, Jean
发明人： SIEMENS AKTIENGESELLSCHAFT , INTERUNIVERSITY MICROELECTRONIC CENTER VZW
IPC分类号： G02B06/36
CPC分类号： G02B6/3696 , G02B6/3652 , G02B6/3839 , G03F7/0005
摘要： In order to produce guiding elements provided with guiding grooves for optical waveguide fibres, first an original template of a guiding element is produced, then a metallic mould (FT) which represents a negative model of the guiding element is produced by galvanoplastically duplicating the original template. Guiding elements made of plastics are then produced with said mould (FT) by injection moulding or stamping in an injection moulding tool (SW) or injection stamping tool. The original template is preferably produced from a silicon plate into which the guiding grooves are anisotropically etched. The injection moulding or stamping process allows high precision guiding elements to be economically mass produced.
摘要翻译：用于制造具有导向槽的导向元件为光纤光波导的导向元件中的一个的金属成形部分（FT）中，首先制备的原始形式，然后通过所产生的母模，这是一个负的指南要素的电铸模。使用在注射模具中（SW）或注射压缩工具此模制品（FT），塑性材料的引导元件，然后通过注射成型或通过压缩模塑制备。母模优选由在其中，引导凹槽通过各向异性蚀刻并入硅板的。的注塑成型或注射压缩成型使经济大量生产具有高尺寸精度的导向元件。

3. 发明申请

WO1990013042A1 METHOD AND DEVICE FOR ACCELERATED DETERMINING OF AGEING OF ONE OR MORE ELEMENTS WITH AN ELECTROMAGNETIC AGEING PARAMETER 审中-公开
标题翻译：用于加速测定一个或多个元件老化与电磁衰老参数的方法和装置
公开(公告)号：WO1990013042A1
公开(公告)日：1990-11-01
申请号：PCT/EP1990000291
申请日：1990-04-19
申请人： INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW , LIMBURGS UNIVERSITAIR CENTRUM , STALS, Lambert, Mathias, Maria , DE SCHEPPER, Luc, Irena , DE CEUNINCK, Ward, Aimé, Stefan , ROGGEN, Jean, Joseph, Marie
发明人： INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW , LIMBURGS UNIVERSITAIR CENTRUM
IPC分类号： G01R31/26
CPC分类号： G01R31/2862 , G01R31/2642 , G01R31/2874 , G01R31/2881
摘要： A method for determining the impedance change of an electromagnetic ageing parameter on one or more elements having such a parameter, wherein the element is placed in an oven at a predetermined temperature and wherein a measurement of the resistance at this temperature is performed.

4. 发明申请

WO1996009646A1 POLYMER STUD GRID ARRAY 审中-公开
标题翻译：聚合物螺柱GRID ARRAY
公开(公告)号：WO1996009646A1
公开(公告)日：1996-03-28
申请号：PCT/EP1995003763
申请日：1995-09-22
申请人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW , HEERMAN, Marcel , WILLE, Joost , VAN PUYMBROECK, Jozef , ROGGEN, Jean , BEYNE, Eric , VAN HOOF, Rita
发明人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
IPC分类号： H01L23/13
CPC分类号： H01L24/81 , B29L2031/3493 , H01L23/13 , H01L23/49816 , H01L24/48 , H01L2224/1319 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H05K3/027 , H05K3/3431 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H01L2224/45099 , H01L2924/00
摘要： The new structure comprises: an injection moulded three-dimensional substrate (S) made from an electrically insulating polymer; two-dimensionally configured polymer bumps (PS) formed during the injection-moulding process on the underside of the substrate (S); external connections (AA) formed on the polymer bumps (PS) by solderable end surfaces; conducting paths (LZ) at least on the underside of the substrate (S) to connect the external connections (AA) to inner connections (IA1); and at least one chip (C1) mounted on the substrate (S) with connections (CA1) which are electro-conductively linked to the inner connections. The novel structure, which is suitable for single-, few- or multi-chip modules, combines the advantages of a Ball Grid Array with those of MID ( M oulded I nterconnection D evices) technology, and the manufacture and metallization of the polymer bumps (PS) can be done within the framework of the process steps needed for MID technology and at minimal additional cost.
摘要翻译：新的设计包括一个注塑成型的，由电绝缘聚合物的，在基片（S）的表面的下侧立体基板（S），其布置和在注射成型共同模制的聚合物柱（PS），由可焊接的端部表面形成的聚合物柱（PS）的外部连接（ AA），至少在所述基板（S）形成的导体轨迹（LZ），它的外部连接（AA）连接到内部连接（IA1）和基板（S）上的至少一个的下侧排列的芯片（C1），其连接（CA1 ）电传导地连接到内部连接。新用于单，Few-芯片或多芯片模块的适当设计结合了MID技术（中号 oulded的优点的球栅阵列的优点我 nterconnection ð evices）。聚合物螺柱（PS）的制备和金属化然后可以作为与最小的额外努力无论如何在MID技术所需步骤的一部分来执行。

5. 发明申请

WO1997015078A1 POLYMER STUD GRID ARRAY 审中-公开
标题翻译：聚合物螺柱GRID ARRAY
公开(公告)号：WO1997015078A1
公开(公告)日：1997-04-24
申请号：PCT/EP1996004407
申请日：1996-10-10
申请人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW , DUMOULIN, Ann , HEERMAN, Marcel , ROGGEN, Jean , BEYNE, Eric , VAN HOOF, Rita
发明人： SIEMENS N.V. , INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
IPC分类号： H01L23/13
CPC分类号： H01L23/13 , H01L23/4334 , H01L24/48 , H01L2224/48227 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15157 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： To improve the removal of waste heat, a polymer stud grid array is proposed with the following elements: an injection-moulded three-dimensional substrate (S) made from an electrically insulating polymer; polymer studs (PS) arranged in one plane on the underside of the substrate (S) and formed during the injection moulding process; external connections formed on the polymer studs (PS) by an end surface suitable for soldering; strip conductors formed at least on the underside of the substrate (S) and connecting the external connections to internal connections; at least one heat-conducting element (WL) partially coated by the injection moulding process; and at least one chip or wiring element (VE) mounted on the heat-conducting element and with connections which have electrically conducting links with the internal connections. The novel structure is suitable for power components or power blocks in a polymer stud grid array package.
摘要翻译：为了实现热损失的改进的耗散，聚合物螺柱栅阵列提出，用注射成型，电绝缘聚合物的三维基板（S）; 在基板的下侧（S），其布置在注射模制聚合物螺柱（PS）和扁平共同模制; 在聚合物螺柱（PS）用可焊接的端部表面形成的外部端子; 至少在基板（S），其连接到内部连接的外部连接形成导体轨道的下侧上; 基板（S）的注射模制中的至少一个被部分地模制的导热体（WL）; 和布置成与至少一个所述导热体（WL）芯片或布线元件（VE）上，它的连接是导电地连接到内部连接。新的设计特别适合于在聚合物螺柱栅阵列封装的功率器件或功率模块。

6. 发明申请

WO1992005432A1 INTEGRATED SENSOR 审中-公开
标题翻译：集成传感器
公开(公告)号：WO1992005432A1
公开(公告)日：1992-04-02
申请号：PCT/EP1991001845
申请日：1991-09-23
申请人： INTERUNIVERSITAIR MICRO ELEKTRONICA CENTRUM VZW , ENGICOM N.V. , VAISALA OY , KEMIRA OY , VAN GELOVEN, Peter, Maria , ROGGEN, Jean, Joseph, Marie
发明人： INTERUNIVERSITAIR MICRO ELEKTRONICA CENTRUM VZW , ENGICOM N.V. , VAISALA OY , KEMIRA OY
IPC分类号： G01N27/12
CPC分类号： G01N27/12
摘要： A sensor (1) comprising: an insulating substrate (2) provided with a protruding portion; a heating element, arranged on said insulating substrate near the tip end of said protruding portion; first conductor paths (9) connected on one end to said heating element and extending over the protruding portion; first terminals (8) for supplying electric current to the heating element, which are located opposite the protruding portion of the substrate and which are connected to the other ends of the first conductor paths extending over said protruding portion; a sheet of insulating material provided over said heating element; a sensing element (3) arranged over said heating element near the tip end of said protruding portion; second conductor paths (4) connected on one end to the sensor element (3) and extending over said protruding portion; and second terminals (7) located opposite of said protruding portion of the substrate, and which are connected to the other ends of said second conductor paths and which are adapted for connecting one or more electronic circuits, which might be placed as a hybrid circuit in the same substrate.
摘要翻译： 1.一种传感器（1），包括：绝缘基板（2），设置有突出部分; 加热元件，布置在所述绝缘基板上，靠近所述突出部分的末端; 第一导体路径（9），其一端连接到所述加热元件并在所述突出部分上延伸; 用于向加热元件提供电流的第一端子（8），它们位于与衬底的突出部分相对的位置，并且连接到延伸在所述突出部分上的第一导体路径的另一端; 设置在所述加热元件上的绝缘材料片; 布置在所述加热元件的靠近所述突出部分的末端的感测元件（3）; 第二导体路径（4），其一端连接到所述传感器元件（3）并在所述突出部分上延伸; 以及与所述基板的所述突出部分相对的第二端子（7），并且连接到所述第二导体路径的另一端，并且适于连接可以作为混合电路放置的一个或多个电子电路相同的底物。

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