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1. 发明申请

US20130087132A1 Systems and Methods For Connecting An Ingot To A Wire Saw 有权
标题翻译：将锭子连接到线锯的系统和方法
公开(公告)号：US20130087132A1
公开(公告)日：2013-04-11
申请号：US13253509
申请日：2011-10-05
申请人： Peter D. Albrecht
发明人： Peter D. Albrecht
IPC分类号： B28D7/04 , B28D1/02 , B28D5/00
CPC分类号： B28D5/0082 , B23D57/0046 , F16B37/045 , Y10T29/49966
摘要： Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.
摘要翻译：公开的系统和方法用于将锭连接到具有锭保持器，粘结梁和杆的线锯。杆具有与形成在接合梁的槽中的凹陷表面接合的成角度的配合表面。机械紧固件用于将三通杆连接到锭架。配合表面相对于槽的凹入表面的角度防止粘合梁的变形，并且防止损害铸锭和粘合梁之间的粘合剂粘结的完整性。

2. 发明授权

US08192822B2 Edge etched silicon wafers 有权
标题翻译：边缘蚀刻硅片
公开(公告)号：US08192822B2
公开(公告)日：2012-06-05
申请号：US12415555
申请日：2009-03-31
申请人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
发明人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
IPC分类号： B32B3/02
CPC分类号： H01L21/02021 , H01L21/02019 , H01L21/30608 , H01L21/67086 , H01L21/67313 , Y10T428/21 , Y10T428/219
摘要： The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
摘要翻译：本公开一般涉及硅晶片的制造，更具体地涉及用于蚀刻硅晶片边缘的边缘蚀刻装置和方法。

3. 发明申请

US20120028555A1 Grinding Tool For Trapezoid Grinding Of A Wafer 审中-公开
标题翻译：研磨工具用于梯形磨削的晶圆
公开(公告)号：US20120028555A1
公开(公告)日：2012-02-02
申请号：US12847015
申请日：2010-07-30
申请人： Guoqiang David Zhang , Roland Vandamme , Peter D. Albrecht
发明人： Guoqiang David Zhang , Roland Vandamme , Peter D. Albrecht
IPC分类号： B24B27/00
CPC分类号： B24D5/14 , B24B9/065
摘要： A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer.
摘要翻译：用于在成形机上梯形磨削晶片的研磨工具包括环形轮，其包括适于将轮安装在心轴上的中心孔。车轮包括设置在车轮的外边缘处的至少两个槽，并且槽的尺寸适于接收晶片的外边缘。至少一个凹槽适于对晶片进行粗磨。至少另一个凹槽适用于晶片的细磨。

4. 发明申请

US20090246444A1 EDGE ETCHED SILICON WAFERS 有权
标题翻译：边缘蚀刻硅胶
公开(公告)号：US20090246444A1
公开(公告)日：2009-10-01
申请号：US12415555
申请日：2009-03-31
申请人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
发明人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
IPC分类号： B32B3/02
CPC分类号： H01L21/02021 , H01L21/02019 , H01L21/30608 , H01L21/67086 , H01L21/67313 , Y10T428/21 , Y10T428/219
摘要： The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
摘要翻译：本公开一般涉及硅晶片的制造，更具体地涉及用于蚀刻硅晶片边缘的边缘蚀刻装置和方法。

5. 发明授权

US08192248B2 Semiconductor wafer polishing apparatus and method of polishing 有权
标题翻译：半导体晶片抛光装置及抛光方法
公开(公告)号：US08192248B2
公开(公告)日：2012-06-05
申请号：US12130190
申请日：2008-05-30
申请人： Peter D. Albrecht , Guoqiang Zhang
发明人： Peter D. Albrecht , Guoqiang Zhang
IPC分类号： B24B1/00
CPC分类号： B24B37/30
摘要： A wafer polishing apparatus has a base and a turntable having a polishing pad thereon and mounted on the base for rotation of the turntable and polishing pad relative to the base about an axis perpendicular to the turntable and polishing pad. The polishing pad includes a work surface engageable with a front surface of a wafer for polishing the front surface of the wafer. A drive mechanism is mounted on the base for imparting rotational motion about an axis substantially parallel to the axis of the turntable. A polishing head is connected to the drive mechanism for driving rotation of the polishing head. The polishing head has a pressure plate adapted to hold the wafer for engaging the front surface of the wafer with the work surface of the polishing pad. The pressure plate has a generally planar position and is selectively movable from the planar position to a convex position and to a concave position.
摘要翻译：晶片抛光装置具有基座和转盘，其上具有抛光垫，并且安装在基座上，用于使旋转台和抛光垫相对于垂直于转盘和抛光垫的轴线相对于基座旋转。抛光垫包括可与晶片的前表面接合的工作表面，用于抛光晶片的前表面。驱动机构安装在基座上，用于绕基本上平行于转台的轴线的轴线进行旋转运动。抛光头连接到用于驱动抛光头旋转的驱动机构。抛光头具有适于保持晶片的压板，用于与晶片的前表面接合抛光垫的工作表面。压板具有大致平面的位置，并且可以从平面位置选择性地移动到凸形位置和凹入位置。

6. 发明申请

US20090298399A1 SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD OF POLISHING 有权
标题翻译：半导体波长抛光装置和抛光方法
公开(公告)号：US20090298399A1
公开(公告)日：2009-12-03
申请号：US12130190
申请日：2008-05-30
申请人： Peter D. Albrecht , Guoqiang Zhang
发明人： Peter D. Albrecht , Guoqiang Zhang
IPC分类号： B24B9/00
CPC分类号： B24B37/30
摘要： A wafer polishing apparatus has a base and a turntable having a polishing pad thereon and mounted on the base for rotation of the turntable and polishing pad relative to the base about an axis perpendicular to the turntable and polishing pad. The polishing pad includes a work surface engageable with a front surface of a wafer for polishing the front surface of the wafer. A drive mechanism is mounted on the base for imparting rotational motion about an axis substantially parallel to the axis of the turntable. A polishing head is connected to the drive mechanism for driving rotation of the polishing head. The polishing head has a pressure plate adapted to hold the wafer for engaging the front surface of the wafer with the work surface of the polishing pad. The pressure plate has a generally planar position and is selectively movable from the planar position to a convex position and to a concave position.
摘要翻译：晶片抛光装置具有基座和转盘，其上具有抛光垫，并且安装在基座上，用于使旋转台和抛光垫相对于垂直于转盘和抛光垫的轴线相对于基座旋转。抛光垫包括可与晶片的前表面接合的工作表面，用于抛光晶片的前表面。驱动机构安装在基座上，用于绕基本上平行于转台的轴线的轴线进行旋转运动。抛光头连接到用于驱动抛光头旋转的驱动机构。抛光头具有适于保持晶片的压板，用于与晶片的前表面接合抛光垫的工作表面。压板具有大致平面的位置，并且可以从平面位置选择性地移动到凸形位置和凹入位置。

7. 发明申请

US20090242126A1 EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER 审中-公开
标题翻译：蚀刻硅片边缘的边缘蚀刻装置
公开(公告)号：US20090242126A1
公开(公告)日：2009-10-01
申请号：US12415274
申请日：2009-03-31
申请人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland Vandamme , Guoqiang (David) Zhang
发明人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland Vandamme , Guoqiang (David) Zhang
IPC分类号： C23F1/08
CPC分类号： H01L21/02021 , H01L21/02019 , H01L21/30608 , H01L21/67086 , H01L21/67313 , Y10T428/21 , Y10T428/219
摘要： The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
摘要翻译：本公开一般涉及硅晶片的制造，更具体地涉及用于蚀刻硅晶片边缘的边缘蚀刻装置和方法。

8. 发明授权

US5679055A Automated wafer lapping system 失效
标题翻译：自动晶圆研磨系统
公开(公告)号：US5679055A
公开(公告)日：1997-10-21
申请号：US653666
申请日：1996-05-31
申请人： George W. Greene , Peter D. Albrecht , Kenneth D. Strittmatter , Rafael Hidalgo
发明人： George W. Greene , Peter D. Albrecht , Kenneth D. Strittmatter , Rafael Hidalgo
IPC分类号： H01L21/677 , B24B37/08 , B24B37/34 , B24B47/22 , B24B49/04 , H01L21/304 , B24B37/02
CPC分类号： B24B37/08 , B24B37/345 , B24B47/22 , B24B49/04
摘要： An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.
摘要翻译：一种自动化晶片研磨系统，包括一个机器人，该机器人一次一个接一个地将晶片从盒子装载到研磨机上的晶片载体上。机器人能够将重叠的晶片传送到厚度测量装置，用于测量晶片厚度，并在每次运行之间重新校准研磨机。用于接收晶片的晶片载体中的开口尺寸与晶片的尺寸紧密相关，用于晶片和载体之间的最小相对运动。用于机器人的定心夹具和搜索程序便于晶片在开口中的快速定位。研磨系统还检查晶圆是否有缺陷，并在研磨后相应地进行分选。

9. 发明授权

US08309464B2 Methods for etching the edge of a silicon wafer 有权
标题翻译：蚀刻硅晶片边缘的方法
公开(公告)号：US08309464B2
公开(公告)日：2012-11-13
申请号：US12415551
申请日：2009-03-31
申请人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
发明人： Henry F. Erk , Peter D. Albrecht , Eugene R. Hollander , Thomas E. Doane , Judith A. Schmidt , Roland R. Vandamme , Guoqiang (David) Zhang
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02021 , H01L21/02019 , H01L21/30608 , H01L21/67086 , H01L21/67313 , Y10T428/21 , Y10T428/219
摘要： The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
摘要翻译：本公开一般涉及硅晶片的制造，更具体地涉及用于蚀刻硅晶片边缘的边缘蚀刻装置和方法。

10. 发明授权

US08960657B2 Systems and methods for connecting an ingot to a wire saw 有权
标题翻译：将锭子连接到线锯的系统和方法
公开(公告)号：US08960657B2
公开(公告)日：2015-02-24
申请号：US13253509
申请日：2011-10-05
申请人： Peter D. Albrecht
发明人： Peter D. Albrecht
IPC分类号： B28D7/04 , B28D5/00 , B23D57/00 , F16B37/04
CPC分类号： B28D5/0082 , B23D57/0046 , F16B37/045 , Y10T29/49966
摘要： Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.
摘要翻译：公开的系统和方法用于将锭连接到具有锭保持器，粘结梁和杆的线锯。杆具有与形成在接合梁的槽中的凹陷表面接合的成角度的配合表面。机械紧固件用于将三通杆连接到锭架。配合表面相对于槽的凹入表面的角度防止粘合梁的变形，并且防止损害铸锭和粘合梁之间的粘合剂粘结的完整性。

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