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1. 发明专利

JP2021535812A 口腔咽頭障害処置用のシステム、デバイスおよび方法审中-公开
公开(公告)号：JP2021535812A
公开(公告)日：2021-12-23
申请号：JP2021517083
申请日：2019-05-29
申请人：リン・ビルストン , Lynne BILSTON , ピーター・バーク , Peter BURKE
发明人：リン・ビルストン , ピーター・バーク
IPC分类号： A61B17/24 , A61N1/36 , A61N5/06
摘要：本明細書において、咽頭筋の刺激を介する口腔咽頭障害の処置用のシステム、デバイスおよび方法が提供される。咽頭筋細胞(9)の収縮は、筋細胞および神経細胞の少なくとも一方に形成された、少なくとも1つのイオンチャネル(1)の活性化によって誘発される。刺激(3)によって活性化される場合、(4)イオンチャネルを開く。これは、イオンが(5)細胞内へおよび(6)細胞外に流れ、筋収縮を引き起こすことを可能にする。この筋収縮は処置される状態に依存して、特定の筋肉に向けることができる。

2. 发明专利

CA85718A HORSESHOE 未知
公开(公告)号：CA85718A
公开(公告)日：1904-03-01
申请号：CA85718D
申请日：1903-12-24
申请人： WOOD PETER BURKE , STEVENS GEORGE
发明人： WOOD PETER BURKE , STEVENS GEORGE

3. 发明专利

FR376533A 未知
公开(公告)号：FR376533A
公开(公告)日：1907-08-12
申请号：FR376533D
申请日：1907-04-08
申请人： WILLIAM PETER BURKE
发明人： BURKE WILLIAM PETER
IPC分类号： B62D25/00

4. 发明专利

GB861445A Improvements in plastic bearings 未知
公开(公告)号：GB861445A
公开(公告)日：1961-02-22
申请号：GB849657
申请日：1957-03-14
申请人： PETER BURKE
IPC分类号： F16C33/20 , F16C33/74
摘要： 861,445. Bearings. BURKE, P. Jan. 3, 1958 [March 14, 1957], No. 8496/57. Class 12 (1). A bearing bush 1, Fig. 2, is moulded from thermo-plastic material, with or without the addition of powdered metal, and has tapered end portions 2 of internal diameter slightly less than that of the shaft 6 so that they will grip the shaft lightly and retain lubricant. A central lubricant reservoir 3 is provided. In a modification, separate mouldings 2, Fig. 4, which may be of pure plastic, are moulded on to the ends of a cylindrical bush 1 which may be composed of a mixture of powdered metal and plastic. In a further modification, a cylindrical bush 1, Fig. 3, has ends 4 of reduced internal diameter. The bearing bush may have one or more integral radial projections which engage corresponding recesses in the support. Alternatively, projections on the support may engage recesses in the bush. The bearing may take the form of a thrust washer of disc shape having one or more resilient annular lips which enclose the bearing surface.

5. 发明申请

US20140007893A1 Smoke Filters for Smoking Devices with Porous Masses Having a Carbon Particle Loading and an Encapsulated Pressure Drop 审中-公开
标题翻译：具有碳粒子载荷和封装压降的多孔质量吸烟装置的烟雾过滤器
公开(公告)号：US20140007893A1
公开(公告)日：2014-01-09
申请号：US13878041
申请日：2011-07-15
申请人： Peter Burke , Meinhard Gusik , Julia Hufen , Luis Jiminez , Raymond Robertson , Ramesh Srinivasan
发明人： Peter Burke , Meinhard Gusik , Julia Hufen , Luis Jiminez , Raymond Robertson , Ramesh Srinivasan
IPC分类号： A24D3/06
CPC分类号： A24D3/066 , A24D3/062 , A24D3/08 , A24D3/12 , A24D3/163 , D04H1/407
摘要： Disclosed are filters, smoking devices, related articles and apparatus, and related methods. The filters include porous masses that have an active particle and a binder particle, wherein the active particle comprises carbon and the porous mass has a carbon loading of at least about 6 mg/mm and an encapsulated pressure drop of about 20 mm of water or less per mm of porous mass.
摘要翻译：披露过滤器，吸烟装置，相关物品和装置以及相关方法。过滤器包括具有活性颗粒和粘合剂颗粒的多孔质量块，其中活性颗粒包含碳，多孔质量具有至少约6mg / mm 2的碳负荷和约20mm水或更少的封装压降每毫米多孔质量。

6. 发明授权

US08076779B2 Reduction of macro level stresses in copper/low-K wafers 有权
标题翻译：降低铜/低K晶片的宏观水平应力
公开(公告)号：US08076779B2
公开(公告)日：2011-12-13
申请号：US11269275
申请日：2005-11-08
申请人： Sey-Shing Sun , Jayanthi Pallinti , Dilip Vijay , Hemanshu Bhatt , Hong Ying , Chiyi Kao , Peter Burke
发明人： Sey-Shing Sun , Jayanthi Pallinti , Dilip Vijay , Hemanshu Bhatt , Hong Ying , Chiyi Kao , Peter Burke
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05124 , H01L2224/05147 , H01L2224/05624 , H01L2224/05644 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48624 , H01L2224/48644 , H01L2224/48699 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/04953 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： A pad structure and passivation scheme which reduces or eliminates IMC cracking in post wire bonded dies during Cu/Low-k BEOL processing. A thick 120 nm barrier layer can be provided between a 1.2 μm aluminum layer and copper. Another possibility is to effectively split up the barrier layer, where the aluminum layer is disposed between the two barrier layers. The barrier layers may be 60 nm while the aluminum layer which is disposed between the barrier layers may be 0.6 μm. Another possibility is provide an extra 0.6 μm aluminum layer on the top barrier layer. Still another possibility is to provide an extra barrier layer on the top-most aluminum layer, such that a top barrier layer of 60 nm is provided on a 0.6 μm aluminum layer, followed by another harrier layer of 60 nm, another aluminum layer of 0.6 μm and another barrier layer of 60 nm.
摘要翻译：一种衬垫结构和钝化方案，可在Cu / Low-k BEOL处理期间减少或消除后引线键合模具中的IMC裂纹。可以在1.2μm的铝层和铜之间设置厚120nm的阻挡层。另一种可能性是有效地分离阻挡层，其中铝层设置在两个阻挡层之间。阻挡层可以是60nm，而设置在阻挡层之间的铝层可以是0.6μm。另一种可能性是在顶部阻挡层上提供额外的0.6μm的铝层。另一种可能性是在最顶层的铝层上提供额外的阻挡层，使得在0.6μm的铝层上设置60nm的顶部阻挡层，接着是60nm的另一个阻挡层，另一个为0.6的铝层 μm，另一个阻挡层为60nm。

7. 发明申请

US20090233905A1 COMBINATIONS COMPRISING BCR-ABL/C-KIT/PDGF-R TK INHIBITORS FOR TREATING CANCER 审中-公开
标题翻译：包含BCR-ABL / C-KIT / PDGF-R TK抑制剂治疗癌症的组合
公开(公告)号：US20090233905A1
公开(公告)日：2009-09-17
申请号：US12294208
申请日：2007-04-04
申请人： Gregory Peter Burke , Ronald Richard Linnartz , Paul W. Manley , Richard William Versace
发明人： Gregory Peter Burke , Ronald Richard Linnartz , Paul W. Manley , Richard William Versace
IPC分类号： A61K31/553 , A61K31/506 , A61P35/00
CPC分类号： A61K45/06 , A61K31/454 , A61K31/4709 , A61K31/473 , A61K31/506 , A61K31/553 , A61K31/573 , A61K31/704 , A61K2300/00
摘要： The invention relates to a combination comprising a Bcr-Abl, c-Kit and PDGF-R tyrosine kinase inhibitor; and one or more pharmaceutically active agents; pharmaceutical compositions comprising said combination; methods of treatment comprising said combination; processes for making said combination; and a commercial package comprising said combination.
摘要翻译：本发明涉及包含Bcr-Abl，c-Kit和PDGF-R酪氨酸激酶抑制剂的组合; 和一种或多种药物活性剂; 包含所述组合的药物组合物; 包括所述组合的治疗方法; 制作所述组合的方法; 以及包括所述组合的商业包装。

8. 发明申请

US20090195401A1 Apparatus and method for surveillance system using sensor arrays 审中-公开
标题翻译：使用传感器阵列的监视系统的装置和方法
公开(公告)号：US20090195401A1
公开(公告)日：2009-08-06
申请号：US12010941
申请日：2008-01-31
申请人： Andrew Maroney , Peter Burke , Richard French
发明人： Andrew Maroney , Peter Burke , Richard French
IPC分类号： G08B21/00
CPC分类号： G06K9/00771 , G06K9/00335
摘要： Embodiments of the invention may include a sensor system and a method used to track the behaviors of targets in an area under surveillance. The invention may include a sensor array located in the area that is capable of sending messages to a user when behavior of a tracked target is determined to be anomalous. In making the determination of anomalous behavior, the sensor system and method may generate and continuously refine a pattern of life model that may examine, for example, the paths a target may take within the sensor array and the end points of the paths taken. The sensor system and method may also incorporate any user defined conditions for anomalous behavior.
摘要翻译：本发明的实施例可以包括传感器系统和用于跟踪在监视区域内的目标的行为的方法。本发明可以包括位于该区域中的传感器阵列，其能够在被跟踪的目标的行为被确定为异常时向用户发送消息。在确定异常行为时，传感器系统和方法可以生成并持续地改进生命模式模式，其可以检查例如目标可能在传感器阵列内的路径和所采取的路径的端点。传感器系统和方法还可以包括用于异常行为的任何用户定义的条件。

9. 发明申请

US20080020130A1 Method to make and use long single-walled carbon nanotubes as electrical conductors 有权
标题翻译：制造和使用长单壁碳纳米管作为电导体的方法
公开(公告)号：US20080020130A1
公开(公告)日：2008-01-24
申请号：US11224917
申请日：2005-09-12
申请人： Peter Burke , Zhen Yu , Shengdong Li
发明人： Peter Burke , Zhen Yu , Shengdong Li
IPC分类号： B05D5/12 , C23C16/00
CPC分类号： B01J23/862 , B01J23/8993 , B01J37/0211 , B01J37/0215 , B01J37/024 , B82Y30/00 , B82Y40/00 , C01B32/162 , C01B2202/02 , C01B2202/34 , C01B2202/36 , D01F9/127 , D01F9/133 , Y10S427/102
摘要： Systems and methods for synthesizing long carbon nanotubes and using the nanotube as an electrical conductor. A substrate is provided with one or more metal underlayer platforms that allow the nanotube to grow freely suspended from the substrate. A modified gas-flow injector is used to reduce the gas flow turbulence during nanotube growth. Nanotube electrodes are formed by growing arrays of aligned nanotubes between two metal underlayer platforms.
摘要翻译：用于合成长碳纳米管并使用纳米管作为电导体的系统和方法。衬底设置有一个或多个金属底层平台，其允许纳米管从衬底自由地生长悬浮。改进的气流注入器用于减少纳米管生长期间的气流湍流。纳米管电极通过在两个金属底层平台之间生长排列的纳米管阵列而形成。

10. 发明申请

US20070123024A1 Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing 失效
标题翻译：消除后引线键合芯片中的IMC裂纹：在Cu / Low-K处理期间通过改变介电层/金属膜堆叠层的宏观级应力降低
公开(公告)号：US20070123024A1
公开(公告)日：2007-05-31
申请号：US11290087
申请日：2005-11-30
申请人： Jayanthi Pallinti , Dilip Vijay , Hemanshu Bhatt , Sey-Shing Sun , Hong Ying , Chiyi Kao , Peter Burke , Ramaswamy Ranganathan , Qwai Low
发明人： Jayanthi Pallinti , Dilip Vijay , Hemanshu Bhatt , Sey-Shing Sun , Hong Ying , Chiyi Kao , Peter Burke , Ramaswamy Ranganathan , Qwai Low
IPC分类号： H01L21/4763
CPC分类号： H01L21/76801 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48624 , H01L2224/48724 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/04953 , H01L2924/05042 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： Different ways to reduce or eliminate the IMC cracking issues in wire bonded parts, including: changing to more compressive dielectric films for top, R1, and R2; changing the top passivation film stacks to more compressive films; changing the low k film to a higher compressive film; reducing the R layer thickness and pattern density to reduce tensile stress; and minimizing anneal and dielectric deposition temperatures. Each of the methods can be used individually or in combination with each other to reduce overall tensile stresses in the Cu/low-k wafer thus reducing or eliminating the IMC cracking issue currently seen in the post wire bonded parts.
摘要翻译：减少或消除引线接合部件中的IMC裂纹问题的不同方法，包括：改变为顶部R 1和R 2的更多的压电绝缘膜; 将顶部钝化膜堆叠更改为更多的压缩膜; 将低k膜改为较高的压缩膜; 降低R层厚度和图案密度以降低拉伸应力; 并最小化退火和介电沉积温度。每个方法可以单独使用或彼此组合使用以减少Cu / low-k晶片中的总拉伸应力，从而减少或消除了现在在后引线接合部件中看到的IMC裂纹问题。

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