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    • 3. 发明申请
    • CHEMICAL-MECHANICAL POLISHING SLURRY COMPOSITION COMPRISING NONIONIZED HEAT-ACTIVATED NANOCATALYST, AND POLISHING METHOD USING SAME
    • 化学机械抛光浆料组合物,其包含非活化的活化纳米催化剂和使用其的抛光方法
    • WO2010140788A3
    • 2011-03-31
    • PCT/KR2010003349
    • 2010-05-27
    • DONGJIN SEMICHEM CO LTDPARK JONG DAILIM JIN HYUKCHOI JUNG MINKONG HYUN GOOKIM JAE HYUNPARK HYE JUNG
    • PARK JONG DAILIM JIN HYUKCHOI JUNG MINKONG HYUN GOOKIM JAE HYUNPARK HYE JUNG
    • C09K3/14H01L21/304
    • H01L21/3212C09G1/02
    • The invention relates to a polishing slurry composition which comprises a nonionized heat-activated nanocatalyst, and which is useful for a chemical-mechanical planarization process, and to a polishing method using the composition. The chemical-mechanical polishing slurry composition comprises: a nonionized heat-activated nanocatalyst which discharges electrons and holes by the energy generated during a chemical-mechanical polishing process; an abrasive; and an oxidizing agent. The nonionized heat-activated nanocatalyst and the abrasive are different from each other. Preferably, the nonionized heat-activated nanocatalyst is a semiconductor substance which discharges, in an aqueous solution state, electrons and holes at a temperature of 10 to 100°C. Preferably, transition metal silicide selected from a group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi) and a mixture thereof can be used as the nonionized heat-activated nanocatalyst. More preferably, a semiconductor substance such as nanoferrosilicon can be used as the nonionized heat-activated nanocatalyst. The content of the nonionized heat-activated nanocatalyst is 0.00001 to 0.1 wt % with respect to the total slurry composition.
    • 本发明涉及一种抛光浆料组合物,其包含非离子热活化纳米催化剂,并且其可用于化学机械平面化工艺,以及使用该组合物的抛光方法。 化学机械抛光浆料组合物包括:非化学热活化纳米催化剂,其通过在化学机械抛光过程中产生的能量而排出电子和空穴; 研磨剂 和氧化剂。 非活性热活化纳米催化剂和研磨剂彼此不同。 优选地,非离子化热活化纳米催化剂是在10〜100℃的温度下以水溶液状态排出电子和空穴的半导体物质。 优选地,可以使用选自CrSi,MnSi,CoSi,硅铁(FeSi)及其混合物的过渡金属硅化物作为非离子化热活化纳米催化剂。 更优选地,可以使用诸如纳米铁的半导体物质作为非离子化热活化纳米催化剂。 非离子化热活化纳米催化剂的含量相对于总淤浆组成为0.00001〜0.1重量%。