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    • 2. 发明申请
    • PHOTONIC CRYSTAL DEVICE PRODUCED BY A WET PROCESS, AND A PRODUCTION METHOD THEREOF
    • 由湿法生产的光子晶体装置及其生产方法
    • WO2010011036A3
    • 2010-04-15
    • PCT/KR2009003703
    • 2009-07-07
    • KOREA ELECTRO TECH RES INSTKIM JUNG-ILJEON SEOK-GYJIN YUN-SIKKIM GEUN-JUSON CHAE-HWAPARK SI-HYUNHAN SEONG TAEKIM JONG UK
    • KIM JUNG-ILJEON SEOK-GYJIN YUN-SIKKIM GEUN-JUSON CHAE-HWAPARK SI-HYUNHAN SEONG TAEKIM JONG UK
    • H01L21/306H01L21/20H01L21/3063
    • G02B6/1225B82Y20/00G02B6/13
    • The present invention relates to a method for producing a photonic crystal device having a photonic crystal structure which can be used in photonic crystal devices such as optical waveguides, resonators, filters, antennas and Smith-Purcell free electron lasers which can be employed in a desired electromagnetic waveband by application of semiconductor processing technology and of an anisotropic wet process which uses the crystallization direction (100) of a silicon wafer; for producing a photonic crystal device which comprises a photonic crystal part having a periodic array of silicon crystals having a predetermined form and a covering part for reducing optical losses in the axial direction to be used as an optical waveguide or a resonator, thereby to be capable of being applied in a desired electromagnetic band; and which can have the conductive photonic-crystal characteristics by not coating the silicon crystal with an electrically conductive material and the metal photonic-crystal characteristics by coating the silicon crystal with an electrically conductive material. This production method makes it possible to mass-produce photonic crystal structures of relatively low cost and substantial height within a short time.
    • 本发明涉及一种用于制造具有光子晶体结构的光子晶体器件的方法,该光子晶体结构可以用于光子晶体器件,例如光波导,谐振器,滤波器,天线和Smith-Purcell自由电子激光器,其可以用于期望的 通过应用半导体处理技术的电磁波段以及使用硅晶片的结晶方向(100)的各向异性湿法工艺; 用于制造光子晶体器件,该光子晶体器件包括具有预定形状的具有周期性的硅晶体阵列的光子晶体部分和用于降低沿轴向的光学损耗以用作光波导或谐振器的覆盖部分,从而能够 应用于所需的电磁波段; 并且通过不用导电材料涂覆硅晶体而具有导电光子晶体特性,并且通过用导电材料涂覆硅晶体而具有金属光子晶体特性。 该制造方法能够在短时间内批量生产成本相对较低且高度相当高的光子晶体结构。
    • 3. 发明申请
    • LIGHT EMITTING DIODE WITH MICROLENS
    • 微光发光二极管
    • WO2008114894A1
    • 2008-09-25
    • PCT/KR2007/001367
    • 2007-03-20
    • INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITYPARK, Si-HyunSON, Su-GwangLEE, June-KeeKIM, Jin-HyeokMOON, Jong-Ha
    • PARK, Si-HyunSON, Su-GwangLEE, June-KeeKIM, Jin-HyeokMOON, Jong-Ha
    • H01L33/00
    • H01L33/44H01L2933/0083
    • The present invention provides a light emitting diode equipped with a microlens having an N type semiconductor layer, an active layer, and a P type semiconductor layer in the right order on the upper side of the substrate. From the P type semiconductor layer to the some part of the N type semiconductor layer are eliminated, so other part of the N type semiconductor layer is exposed. On the upper side of the exposed N type semiconductor layer, an N type electrode pad is formed; on the upper side of the P type semiconductor layer, a transparent conducting layer (TCL) is formed; on the upper side of the P type semiconductor layer, a P type electrode pad is formed; on the upper side of the TCL, microlenses made of UV-curable adhesives are arrayed. The LED equipped with the microlens of the present invention can enhance the external extraction efficiency without the degradation of resistance: LEDs with 10 μ m diameter-sized microlenses perform 1.24 times better than those with no integration of microlenses and LEDs with 20 μ m microlenses perform 1.17 times better.
    • 本发明提供一种发光二极管,其配置有在该基板的上侧上具有N型半导体层,有源层和P型半导体层的微透镜。 从P型半导体层到N型半导体层的一部分被去除,因此N型半导体层的其他部分被露出。 在暴露的N型半导体层的上侧,形成N型电极焊盘; 在P型半导体层的上侧形成透明导电层(TCL) 在P型半导体层的上侧形成有P型电极焊盘; 在TCL的上侧,排列由UV固化粘合剂制成的微透镜。 配备有本发明的微透镜的LED​​可以提高外部提取效率,而不会降低电阻:具有10μm直径尺寸的微透镜的LED​​比没有微透镜的集成和具有20μm微透镜的LED​​执行1.17倍的性能是1.24倍 更好。
    • 7. 发明申请
    • FABRICATION METHOD OF MICROLENS ARRAYS USING UV-CURABLE OPTICAL ADHESIVE
    • 使用UV可固化光学粘合剂的微阵列的制造方法
    • WO2008114893A1
    • 2008-09-25
    • PCT/KR2007/001363
    • 2007-03-20
    • INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITYPARK, Si-HyunSON, Su-Gwang
    • PARK, Si-HyunSON, Su-Gwang
    • G02B3/00
    • B29D11/00365B29D11/00153B29D11/00442
    • The present invention provides the fabrication method of polymer refractive microlens, which has excellent adhesive force toward substrates without regard to the kind of substrates, high optical permeability, great resistance against chemical drugs, no volatility during the fabrication process due to no usage of solvents, and is fabricated through the faster and simpler low-temperature process, without soft baking or hard baking. The fabrication method of the microlens arrays according to the present invention comprises the processes of : i) a coating process where adhesives, UV-curable resins, are coated on substrates, ii) a photo exposure process where ultraviolet is irradiated to the adhesives coated on the substrates after fixating a mask with a specific pattern on said substrates, iii) a development process where the adhesives not irradiated by ultraviolet, due to said pattern of mask, are removed by solvents, and iv) a heat treatment process where the adhesives that would not be removed from said substrates by the development process is heat treated.
    • 本发明提供了聚合物折射式微透镜的制造方法,其对基板的粘合力优异,不考虑基板的种类,高透光性,对化学药物的耐药性,由于不使用溶剂而在制造过程中没有挥发性, 并且通过更快更简单的低温工艺制造,无需软烘烤或硬烘烤。 根据本发明的微透镜阵列的制造方法包括以下过程:i)涂布工艺,其中将粘合剂,UV可固化树脂涂覆在基材上,ii)照射曝光工艺,其中紫外线照射到涂覆的粘合剂 在所述基板上固定具有特定图案的掩模之后的基板,iii)显影过程,其中由于所述掩模图案而不被紫外线照射的粘合剂通过溶剂除去,以及iv)热处理工艺,其中粘合剂 通过热处理的显影过程不会从所述基底上去除。