会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • SUBSTRATE WITH DOPED DIAMOND LAYER FOR LITHIUM-BASED SYSTEMS
    • 用于基于锂离子的系统的具有掺杂金刚石层的衬底
    • WO2017037618A1
    • 2017-03-09
    • PCT/IB2016/055176
    • 2016-08-30
    • NYHOLM, LeifREHNLUND, DavidBÖHME, Solveig
    • NYHOLM, LeifREHNLUND, DavidBÖHME, Solveig
    • H01M2/32H01M4/38H01M4/66H01M10/52
    • H01M4/667H01M2/32H01M4/382H01M4/663H01M10/52
    • An electrode has a diamond layer (500,520) with an inner-side oriented toward one or both of the first surface and the second surface of the substrate and an active layer having a composition that includes an element capable of lithium-atom insertion positioned on the outer-side of the layer(s) of diamond. The diamond layer includes polycrystalline diamond and a p-dopant element and has a doping level equal to or greater than 10 20 atoms/cm 3 The doped diamond layer, preferably doped with boron, is essentially impermeable to lithium, which prevents lithium migration from the active layer during cycling of the electrode when utilized as one or more of an anode and cathode in a Li-ion battery. The boron-doped diamond electrode exhibited a stable capacity of about 250 μΑhcm -2 and a coulombic efficiency of about 90 to 95% over 30 cycles. The electrode can be manufactured by CVD and electrochemical deposition techniques.
    • 电极具有金刚石层(500,520),其内侧朝向基板的第一表面和第二表面中的一个或两个,并且具有组成的活性层包括位于该基板上的能够进行锂原子插入的元件 金刚石层的外侧。 金刚石层包括多晶金刚石和p-掺杂元素,并且具有等于或大于1020原子/ cm 3的掺杂水平。优选掺杂硼的掺杂金刚石层基本上不渗透锂,其阻止锂从活性层迁移 在用作锂离子电池中的阳极和阴极中的一个或多个时,电极循环期间。 硼掺杂的金刚石电极在30个循环中表现出约250μA·cm-2的稳定容量和约90-95%的库仑效率。 电极可以通过CVD和电化学沉积技术制造。
    • 9. 发明申请
    • A METHOD AND DEVICE FOR CHIP ASSEMBLY
    • 一种用于芯片组装的方法和装置
    • WO1997020344A1
    • 1997-06-05
    • PCT/SE1996001556
    • 1996-11-27
    • TELEFONAKTIEBOLAGET LM ERICSSON (publ)NYHOLM, Leif, Ingmar
    • TELEFONAKTIEBOLAGET LM ERICSSON (publ)
    • H01L21/50
    • H01L23/49855G02B6/4224G02B6/4245G02B6/4249G02B6/4261G02B6/4281H01L23/13H01L2224/73204
    • With the invention of simplifying an arrangement of a chip having at least one optical active surface and positioning the chip in a correct position in relation to an optical miniature capsule for optimum light transmission between an optical fibre and the optically active surface, the chip (1) is fastened on a foil substrate (9) which has at least one conductor (4) and which is provided with alignment marks and/or guide means (8) for correct positioning of the chip on the foil substrate and for correct positioning of the foil substrate/chip assembly on the capsule. After having fastened the chip on the foil substrate, the foil with the chip can be readily fastened to the capsule and by that means the chip will be fastened to the capsule. By using guide means, for instance contact element guide pins on the capsule, the foil substrate/chip assembly can be positioned correctly in relation to the capsule, such that the ends of the optical fibres in the contact element will lie opposite to and in contact with the optically active surfaces of the chip and therewith provide optimum light transmission.
    • 通过本发明,简化具有至少一个光学活性表面的芯片的布置,并将芯片相对于光学微型胶囊定位在适当的位置,以在光纤和光学活性表面之间实现最佳的光传输,芯片(1 )紧固在具有至少一个导体(4)的箔基板(9)上,并且设置有对准标记和/或引导装置(8),用于将芯片正确定位在箔基板上,并且正确定位 胶片上的箔基片/芯片组件。 在将芯片固定在箔基片上之后,具有芯片的箔片可以容易地紧固到胶囊上,并且通过这种方式芯片将被固定到胶囊上。 通过使用引导装置,例如胶囊上的接触元件引导销,箔基板/芯片组件可以相对于胶囊正确地定位,使得接触元件中的光纤的端部将处于与之接触并且接触的位置 与芯片的光学活性表面并由此提供最佳的光透射。