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    • 3. 发明授权
    • Substrate coated with transparent conductive film and manufacturing method thereof
    • 涂有透明导电膜的基板及其制造方法
    • US06703130B2
    • 2004-03-09
    • US10234198
    • 2002-09-05
    • Morio OguraTatsuro Usuki
    • Morio OguraTatsuro Usuki
    • B32B1500
    • C22C28/00C23C14/0047C23C14/086C23C14/46Y10S428/913Y10T428/31623
    • A substrate coated with a transparent conductive film is manufactured by: disposing a substrate 3 and a target 5 constituted of alloy of In and Sn in a film deposition chamber 1; leading an Ar gas ion beam into the film deposition chamber 1, to cause collision of the ion beam with the target 5, sputtering-emission of constitutive atoms of the target 5, and supply of the emitted atoms to the substrate 3; and leading oxide gas including oxygen radicals as a main element thereof from an ECR radical source 6 into the film deposition chamber 1, to deposit an ITO film 9 on the substrate 3. In this manufacturing method, a film is deposited on a film or substrate including an organic material without damaging the organic material. The deposited film has low resistivity, high transmission and preferable flatness.
    • 通过以下步骤制造涂覆有透明导电膜的基板:将由基板3和由In和Sn的合金构成的靶5设置在成膜室1中; 将Ar气体离子束引导到成膜室1中,引起离子束与靶5的碰撞,靶5的组成原子的溅射发射,以及将发射的原子供给到基板3; 将包含氧自由基作为主要成分的氧化物气体从ECR自由基源6引入成膜室1中,在基板3上沉积ITO膜9.在该制造方法中,将膜沉积在膜或基板上 包括有机材料,而不损坏有机材料。 沉积膜具有低电阻率,高透射率和优选的平坦度。
    • 4. 发明授权
    • Substrate for surface acoustic wave device and surface acoustic wave device
    • 表面声波装置和表面声波装置用基板
    • US06420815B1
    • 2002-07-16
    • US09662766
    • 2000-09-15
    • Naoki TanakaMorio Ogura
    • Naoki TanakaMorio Ogura
    • H03H925
    • H03H9/02574H03H9/02543H03H9/02559
    • An SAW device substrate and an SAW device having a larger value of K2 than conventional SAW device substrates can be obtained by using LiNbO3 represented by Eulerian angles of (18-30°, 80-100°, 35-75°) and determining the thickness H of a piezoelectric substrate and the pitch &lgr; of electrodes so that KH is at least 2.3 and at most 4.5. Alternatively, an Li2B4O7 layer is formed as a piezoelectric substrate on a surface of a glass layer to obtain an Li2B4O7/glass structured SAW device substrate. More preferably, such Li2B4O7 that is represented by Eulerian angles of (0-45°, 85-95°, 85-95°) is employed. Furthermore, the SAW device substrate is used to form an SAW device so that the KH parameter is about 0.5.
    • 通过使用由欧拉角度(18-30°,80-100°,35-75°)表示的LiNbO 3并确定厚度可以获得具有比常规SAW器件衬底更大的K2值的SAW器件衬底和SAW器件 H和压电基片的间距,使KH为2.3以上4.5以下。 或者,在玻璃层的表面上形成作为压电基板的Li2B4O7层,得到Li2B4O7 /玻璃结构的SAW元件基板。 更优选地,使用(0-45°,85-95°,85-95°)的欧拉角表示的这种Li2B4O7。 此外,SAW器件衬底用于形成SAW器件,使得KH参数为约0.5。