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1. 发明申请

US20100113338A1 PROPHYLACTIC OR THERAPEUTIC AGENT FOR CORNEAL/CONJUNCTIVAL DISEASE 审中-公开
标题翻译：预防或治疗神经系统疾病
公开(公告)号：US20100113338A1
公开(公告)日：2010-05-06
申请号：US11993580
申请日：2006-06-21
申请人： Masanao Watanabe , Kazuo Tsubota , Masaki Hirashima , Chikateru Nozaki
发明人： Masanao Watanabe , Kazuo Tsubota , Masaki Hirashima , Chikateru Nozaki
IPC分类号： A61K38/16 , C07K14/00 , A61P27/02
CPC分类号： A61K38/1761 , A61K9/0048
摘要： Disclosed is a novel composition for the treatment of a corneal/conjunctival disease. A prophylactic or therapeutic agent for a corneal/conjunctival disease comprising selenoprotein P as an active ingredient, more specifically a prophylactic or therapeutic agent for a corneal/conjunctival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer comprising selenoprotein P as an active ingredient, particularly a prophylactic or therapeutic agent for a corneal/conjuncrtival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer accompanied by a corneal/conjunctival epithelial discorder.
摘要翻译：公开了用于治疗角膜/结膜疾病的新型组合物。一种用于角膜/结膜疾病的预防或治疗剂，其包含硒蛋白P作为活性成分，更具体地，涉及用于角膜/结膜疾病如干眼症，圆锥形结膜炎丝氨酸，浅表性点状角膜病，角膜侵蚀或角膜溃疡的预防或治疗剂，其包括硒蛋白P作为活性成分，特别是用于角膜/结膜性疾病例如干眼症，透角圆锥形结膜炎，浅表性点状角膜病变，伴随角膜/结膜上皮发生器的角膜侵蚀或角膜溃疡的预防或治疗剂。

2. 发明申请

US20090098651A1 CARDIOMYOCYTE CULTURE SUPPORT 有权
标题翻译： CARODOMYOCYTE CULTURE支持
公开(公告)号：US20090098651A1
公开(公告)日：2009-04-16
申请号：US12186572
申请日：2008-08-06
申请人： Masanao WATANABE
发明人： Masanao WATANABE
IPC分类号： C12N5/06 , B05D3/00
CPC分类号： C12N5/0657 , C12N2533/30
摘要： It is an objective of this invention to provide a cardiomyocyte culture support used for obtaining cardiomyocytes having a controlled orientation of beating that are thus available for myocardial regenerative therapy, and to provide a method for producing the same.The present invention provides a cardiomyocyte culture support having a cured polymerizable liquid crystal layer having a molecular oriented surface. In addition, the present invention provides a method for producing a cardiomyocyte culture support, such method comprising the steps of: applying a coating solution comprising a polymerizable liquid crystal on a base material having orientation ability so as to form a coating film; allowing the polymerizable liquid crystal comprised in the coating film to be oriented so as to be in a liquid crystal phase state; and forming a cured polymerizable liquid crystal layer by irradiating the coating film with ionizing radiation or ultraviolet rays so as to cure the polymerizable liquid crystal in a liquid crystal phase state by polymerization.
摘要翻译：本发明的目的是提供一种用于获得心肌细胞的心肌细胞培养支持物，所述心肌细胞具有可用于心肌再生治疗的受控搏动取向，并提供其制备方法。本发明提供了具有分子取向表面的固化的可聚合液晶层的心肌细胞培养支持体。另外，本发明提供了一种心肌细胞培养支持体的制造方法，其特征在于，包括以下步骤：在具有取向性的基材上涂布含有聚合性液晶的涂布液，形成涂膜; 使包含在涂膜中的可聚合液晶定向为液晶相状态; 以及通过用电离辐射或紫外线照射所述涂膜来形成固化的可聚合液晶层，以便通过聚合使液晶相状态下的聚合性液晶固化。

3. 发明申请

US20080227203A1 CELL CULTURE SUPPORT AND MANUFACTURE THEREOF 有权
标题翻译：细胞培养支持及其制造
公开(公告)号：US20080227203A1
公开(公告)日：2008-09-18
申请号：US12045847
申请日：2008-03-11
申请人： Masanao WATANABE , Kenichi Hagiwara
发明人： Masanao WATANABE , Kenichi Hagiwara
IPC分类号： C12N5/06 , C12M1/00 , C08J7/18
CPC分类号： C08F220/56 , C08J7/18 , C08J2367/02
摘要： An object of the present invention is to provide a cell culture support making the detachment of a cell sheet easy as well as enabling the formation of a uniform cell sheet. The present invention relates to a method for manufacturing a cell culture support having a temperature responsive polymer immobilized onto the surface thereof via covalent bonding, the method including a coating step in which a composition including a monomer that can form the polymer by polymerization by radiation irradiation, an organic solvent and, in some cases, a prepolymer formed by polymerization of the monomer is coated onto the substrate having a surface containing a material which can be covalently bonded to the temperature responsive polymer by radiation irradiation to form a film on the surface of the substrate, a radiation irradiation step in which a polymerization reaction and a binding reaction between the substrate surface and the temperature responsive polymer are allowed to proceed by irradiating radiation to the film, and a drying step to dry the film.
摘要翻译：本发明的目的是提供使细胞片分离容易以及能够形成均匀的细胞片的细胞培养支持体。本发明涉及通过共价键固定在其表面上的具有温度响应性聚合物的细胞培养支持体的制造方法，该方法包括以下步骤：包括可以通过辐射聚合聚合形成聚合物的单体的组合物有机溶剂，在一些情况下，通过单体聚合形成的预聚物被涂覆到具有包含可通过辐射照射共价键合到温度响应性聚合物的材料的表面的基材上，以在表面上形成膜通过照射辐射使膜进行聚合反应和基板表面与温度响应型聚合物之间的结合反应的放射线照射步骤，以及干燥步骤。

4. 发明授权

US06583364B1 Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards 有权
标题翻译：超声波制造装置，多层柔性布线板以及多层挠性布线板的制造方法
公开(公告)号：US06583364B1
公开(公告)日：2003-06-24
申请号：US09642638
申请日：2000-08-22
申请人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
发明人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
IPC分类号： H05K100
CPC分类号： H05K3/4635 , H01L2224/1147 , H01L2924/01019 , H05K1/0393 , H05K3/005 , H05K3/28 , H05K3/423 , H05K3/4617 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/09563 , H05K2203/0195 , H05K2203/0285 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
摘要翻译：本发明涉及一种多层柔性布线板。多层挠性布线板包括第一和第二图案化布线层，介于第一布线层的表面和第二布线层的表面之间的树脂膜和连接到所述第二布线层的表面，其中当所述凸起压入所述树脂膜中时，所述树脂膜适于形成开口，并且超声波被施加到所述凸起，并且所述凸块被留在所述开口中以电连接所述第二布线层的顶部碰到第一个接线层。

5. 发明授权

US4323659A Non-flammable adhesive compositions 失效
标题翻译：不易燃粘合剂组合物
公开(公告)号：US4323659A
公开(公告)日：1982-04-06
申请号：US212801
申请日：1980-12-04
申请人： Masanao Watanabe , Keiichi Naito , Tooru Odajima , Yoshio Fujiwara
发明人： Masanao Watanabe , Keiichi Naito , Tooru Odajima , Yoshio Fujiwara
IPC分类号： C08G59/00 , C08G59/20 , C08G59/30 , C08G59/40 , C08G59/62 , C08L33/00 , C08L33/02 , C08L63/00 , C09J133/04 , C09J163/00 , C09J163/02 , C09J163/04 , H01B3/40 , H05K1/00 , H05K3/38
CPC分类号： H05K3/386 , C08G59/62 , C08L63/00 , C09J163/00 , C09J163/04 , H01B3/40 , H05K1/0393 , H05K2201/012 , H05K2201/0355
摘要： The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.
摘要翻译：不燃性粘合剂组合物含有100重量份溴化环氧树脂如双酚型溴化环氧树脂或酚醛清漆型溴化环氧树脂; 40-80重量份的丙烯酸共聚物和5-20重量份的溴化聚乙烯基苯酚，所述丙烯酸共聚物通过（a）5-35重量％的丙烯腈，（b）0.5-10重量％的具有至少一个选自羧基，羟基和环氧基的官能团的烯键式不饱和化合物的重量，和（c）可从具有1至6个碳原子的醇和丙烯酸和/或甲基丙烯酸获得的基本上余量的。

6. 发明授权

US06774470B2 Non-contact data carrier and method of fabricating the same 失效
标题翻译：非接触式数据载体及其制造方法
公开(公告)号：US06774470B2
公开(公告)日：2004-08-10
申请号：US10327657
申请日：2002-12-24
申请人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
发明人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
IPC分类号： H01L2302
CPC分类号： G06K19/0775 , G06K19/07749 , H01F5/003 , H01F5/06 , H01F41/042 , H01L21/568 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , Y10T436/17 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
摘要翻译：非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

7. 发明授权

US08916189B2 Cell culture support for forming string-shaped cardiomyocyte aggregates 有权
标题翻译：细胞培养支持形成线状心肌细胞聚集体
公开(公告)号：US08916189B2
公开(公告)日：2014-12-23
申请号：US12122194
申请日：2008-05-16
申请人： Masanao Watanabe , Teruo Okano , Masayuki Yamato , Tatsuya Shimizu , Yoshikatsu Akiyama
发明人： Masanao Watanabe , Teruo Okano , Masayuki Yamato , Tatsuya Shimizu , Yoshikatsu Akiyama
IPC分类号： A61F2/00 , C12N5/02 , C12N5/077 , C12N5/00
CPC分类号： C12N5/0657 , C12N5/0068 , C12N2533/30 , C12N2535/10
摘要： This invention is intended to provide cell aggregates that can reproduce functions of the myocardium, such as the function of beating, and thus are available for myocardial regenerative therapy, and to provide a cell culture support for producing the same.According to this invention, a cell culture support for forming string-shaped cardiomyocyte aggregates, which has a substrate portion having one surface on which at least one linear cell-adherent region is formed is provided.
摘要翻译：本发明旨在提供可以再现心肌功能的细胞聚集体，例如打浆的功能，因此可用于心肌再生治疗，并提供用于制备心肌再生治疗的细胞培养支持物。根据本发明，提供了一种用于形成丝状心肌细胞聚集体的细胞培养支持体，其具有其上形成有至少一个线性细胞粘附区域的一个表面的基底部分。

8. 发明授权

US08557583B2 Cell culture support and manufacture thereof 有权
标题翻译：细胞培养支持和制造
公开(公告)号：US08557583B2
公开(公告)日：2013-10-15
申请号：US12045847
申请日：2008-03-11
申请人： Masanao Watanabe , Kenichi Hagiwara , Teruo Okano , Masayuki Yamato , Tatsuya Shimizu , Yoshikatsu Akiyama , Hiroya Watanabe , Keisuke Ashiba
发明人： Masanao Watanabe , Kenichi Hagiwara , Teruo Okano , Masayuki Yamato , Tatsuya Shimizu , Yoshikatsu Akiyama , Hiroya Watanabe , Keisuke Ashiba
IPC分类号： C12N5/00 , C12N5/02
CPC分类号： C08F220/56 , C08J7/18 , C08J2367/02
摘要： An object of the present invention is to provide a cell culture support making the detachment of a cell sheet easy as well as enabling the formation of a uniform cell sheet. The present invention relates to a method for manufacturing a cell culture support having a temperature responsive polymer immobilized onto the surface thereof via covalent bonding, the method including a coating step in which a composition including a monomer that can form the polymer by polymerization by radiation irradiation, an organic solvent and, in some cases, a prepolymer formed by polymerization of the monomer is coated onto the substrate having a surface containing a material which can be covalently bonded to the temperature responsive polymer by radiation irradiation to form a film on the surface of the substrate, a radiation irradiation step in which a polymerization reaction and a binding reaction between the substrate surface and the temperature responsive polymer are allowed to proceed by irradiating radiation to the film, and a drying step to dry the film.
摘要翻译：本发明的目的是提供使细胞片分离容易以及能够形成均匀的细胞片的细胞培养支持体。本发明涉及通过共价键固定在其表面上的具有温度响应性聚合物的细胞培养支持体的制造方法，该方法包括以下步骤：包括可以通过辐射聚合聚合形成聚合物的单体的组合物有机溶剂，在一些情况下，通过单体聚合形成的预聚物被涂覆到具有包含可通过辐射照射共价键合到温度响应性聚合物的材料的表面的基材上，以在表面上形成膜通过照射辐射使膜进行聚合反应和基板表面与温度响应型聚合物之间的结合反应的放射线照射步骤，以及干燥步骤。

9. 发明申请

US20050028358A1 Process for manufacturing multilayer flexible wiring boards 失效
标题翻译：多层柔性布线板制造工艺
公开(公告)号：US20050028358A1
公开(公告)日：2005-02-10
申请号：US10423978
申请日：2003-04-28
申请人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
发明人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
IPC分类号： H05K1/00 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46 , H05K1/11
CPC分类号： H05K3/4635 , H01L2224/1147 , H01L2924/01019 , H05K1/0393 , H05K3/005 , H05K3/28 , H05K3/423 , H05K3/4617 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/09563 , H05K2203/0195 , H05K2203/0285 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
摘要翻译：本发明涉及多层柔性布线板。所述多层柔性布线板包括第一和第二图案化布线层，插入在第一布线层的表面和第二布线层的表面之间的树脂膜和连接到第二布线层的表面的凸起，其中树脂当凸块被迫进入树脂膜并且超声波被施加到凸起并且凸起留在开口中以将凸起的顶部电连接到第一布线层时，膜适于形成开口。

10. 发明授权

US06840430B2 Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards 有权
标题翻译：板件，柔性布线板和柔性布线板制造工艺
公开(公告)号：US06840430B2
公开(公告)日：2005-01-11
申请号：US10458175
申请日：2003-06-10
申请人： Hideyuki Kurita , Masanao Watanabe , Toshihiro Shinohara , Mitsuhiro Fukuda , Yukio Anzai
发明人： Hideyuki Kurita , Masanao Watanabe , Toshihiro Shinohara , Mitsuhiro Fukuda , Yukio Anzai
IPC分类号： H05K1/03 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , B21D39/00
CPC分类号： H05K3/361 , H05K1/036 , H05K3/305 , H05K3/328 , H05K3/3473 , H05K3/363 , H05K2201/0129 , H05K2201/10977 , H05K2203/0285 , H05K2203/065 , H05K2203/1189 , Y10T29/49126 , Y10T29/49144 , Y10T428/2817
摘要： A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.
摘要翻译：本发明的板片2包括非热塑性树脂膜11，形成在非热塑性树脂膜11上的热塑性树脂膜10和形成在热塑性树脂膜10的表面上的金属布线8.金属布线8 被部分地暴露在板件2上以形成触点12.在触点12上形成低熔点金属涂层13，并且两个板片2a，2b在加热时被彼此挤压，其触点12a，12b与每个使得热塑性树脂膜10a，10b软化以将板片2a，2b彼此粘合并且熔融金属涂层13a，13b熔化然后固化以将触点12a，12b彼此连接。不用于连接的金属布线8的区域是将触点12彼此连接的布线17，并且可以在其表面上设置覆盖膜19。触点12a，12b也可以通过施加超声波来连接。

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