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    • 3. 发明授权
    • Resist underlayer film forming composition for electron beam lithography
    • 用于电子束光刻的抗蚀下层成膜组合物
    • US08603731B2
    • 2013-12-10
    • US12449737
    • 2008-02-19
    • Tomoyuki EnomotoTakahiro SakaguchiRikimaru SakamotoMasaki Nagai
    • Tomoyuki EnomotoTakahiro SakaguchiRikimaru SakamotoMasaki Nagai
    • G03F7/40H01L21/027G03F7/11
    • G03F7/11G03F7/2059
    • There is provided a resist underlayer film forming composition for an electron beam lithography that is used in a device production process using electron beam lithography and is effective for reducing adverse effects caused by an electron beam to obtain a favorable resist pattern, and a method of forming a resist pattern using the resist underlayer film forming composition for electron beam lithography. The resist underlayer film forming composition for an electron beam lithography comprises a polymer compound having a repeating unit structure that contains a halogen atom, and a solvent, and the composition is applied in a form of film between a film to be processed for forming a transferring pattern on a substrate and a resist film for an electron beam lithography, and used for manufacturing a semiconductor device. The polymer compound preferably contains at least 10% by mass of a halogen atom.
    • 提供了一种用于电子束光刻的抗蚀剂下层膜形成组合物,其用于使用电子束光刻的器件制造工艺中,并且有效地减少由电子束引起的不利影响以获得良好的抗蚀剂图案,以及形成方法 使用用于电子束光刻的抗蚀剂下层膜形成组合物的抗蚀剂图案。 用于电子束光刻的抗蚀剂下层膜形成用组合物包括具有含有卤原子的重复单元结构的高分子化合物和溶剂,并且将组合物以薄膜形式施加在待加工的膜之间以形成转印 衬底上的图案和用于电子束光刻的抗蚀剂膜,并用于制造半导体器件。 高分子化合物优选含有至少10质量%的卤素原子。
    • 4. 发明申请
    • RESIST UNDERLAYER FILM FORMING COMPOSITION FOR ELECTRON BEAM LITHOGRAPHY
    • 用于电子束光刻的电阻膜形成组合物
    • US20100081081A1
    • 2010-04-01
    • US12449737
    • 2008-02-19
    • Tomoyuki EnomotoTakahiro SakaguchiRikimaru SakamotoMasaki Nagai
    • Tomoyuki EnomotoTakahiro SakaguchiRikimaru SakamotoMasaki Nagai
    • G03F7/20G03F7/004
    • G03F7/11G03F7/2059
    • There is provided a resist underlayer film forming composition for an electron beam lithography that is used in a device production process using electron beam lithography and is effective for reducing adverse effects caused by an electron beam to obtain a favorable resist pattern, and a method of forming a resist pattern using the resist underlayer film forming composition for electron beam lithography. The resist underlayer film forming composition for an electron beam lithography comprises a polymer compound having a repeating unit structure that contains a halogen atom, and a solvent, and the composition is applied in a form of film between a film to be processed for forming a transferring pattern on a substrate and a resist film for an electron beam lithography, and used for manufacturing a semiconductor device. The polymer compound preferably contains at least 10% by mass of a halogen atom.
    • 提供了一种用于电子束光刻的抗蚀剂下层膜形成组合物,其用于使用电子束光刻的器件制造工艺中,并且有效地减少由电子束引起的不利影响以获得良好的抗蚀剂图案,以及形成方法 使用用于电子束光刻的抗蚀剂下层膜形成组合物的抗蚀剂图案。 用于电子束光刻的抗蚀剂下层膜形成用组合物包括具有含有卤原子的重复单元结构的高分子化合物和溶剂,并且将组合物以薄膜形式施加在待加工的膜之间以形成转印 衬底上的图案和用于电子束光刻的抗蚀剂膜,并用于制造半导体器件。 高分子化合物优选含有至少10质量%的卤素原子。