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1. 发明授权

US08206197B2 Polishing apparatus and program thereof 有权
标题翻译：抛光装置及其程序
公开(公告)号：US08206197B2
公开(公告)日：2012-06-26
申请号：US12596333
申请日：2008-04-17
申请人： Hidetaka Nakao , Masafumi Inoue , Koichi Takeda
发明人： Hidetaka Nakao , Masafumi Inoue , Koichi Takeda
IPC分类号： B24B49/00 , B24B1/00
CPC分类号： H01L21/67219 , B24B37/042 , B24B37/345 , G05B19/41865 , G05B2219/32304 , G05B2219/45232 , H01L21/02074 , H01L21/67276 , Y02P90/20
摘要： A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50). The control section determines a polishing start time in each of the first and second polishing lines (20, 30) based on a predicted polishing time in each of the first and second polishing lines (20, 30), a predicted transport time in the transport mechanism (50), a predicted cleaning time in the cleaning line (40) and a predicted cleaning start time to start cleaning by driving the transport unit (44) of the cleaning line (40).
摘要翻译：抛光装置包括用于放置其中容纳有多个抛光对象的盒（12）的装载部（14）; 用于抛光抛光对象的第一抛光线（20）和第二抛光线（30）; 清洁线（40），其具有用于清洁抛光后的抛光对象物的清洁机（42a，42b，42c，42d）和用于输送抛光对象物的输送单元（44）用于在加载部分（14），抛光线（20,30）和清洁线（40）之间传送抛光对象的传送机构（50）; 以及用于控制研磨线（20,30），清洁线（40）和输送机构（50）的控制部。控制部分基于第一和第二研磨线（20,30）中的每一个中的预测的抛光时间来确定第一和第二抛光线（20,30）中的每一个中的抛光开始时间，运送中预测的运送时间机构（50），清洁管线（40）中的预测清洁时间和通过驱动清洗管线（40）的输送单元（44）开始清洁的预测清洁开始时间。

2. 发明申请

US20100130103A1 POLISHING APPARATUS AND PROGRAM THEREOF 有权
标题翻译：抛光设备及其程序
公开(公告)号：US20100130103A1
公开(公告)日：2010-05-27
申请号：US12596333
申请日：2008-04-17
申请人： Hidetaka Nakao , Masafumi Inoue , Koichi Takeda
发明人： Hidetaka Nakao , Masafumi Inoue , Koichi Takeda
IPC分类号： B24B1/00 , B24B37/04 , H01L21/304
CPC分类号： H01L21/67219 , B24B37/042 , B24B37/345 , G05B19/41865 , G05B2219/32304 , G05B2219/45232 , H01L21/02074 , H01L21/67276 , Y02P90/20
摘要： A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50). The control section determines a polishing start time in each of the first and second polishing lines (20, 30) based on a predicted polishing time in each of the first and second polishing lines (20, 30), a predicted transport time in the transport mechanism (50), a predicted cleaning time in the cleaning line (40) and a predicted cleaning start time to start cleaning by driving the transport unit (44) of the cleaning line (40).
摘要翻译：抛光装置包括用于放置其中容纳有多个抛光对象的盒（12）的装载部（14）; 用于抛光抛光对象的第一抛光线（20）和第二抛光线（30）; 清洁线（40），其具有用于清洁抛光后的抛光对象物的清洁机（42a，42b，42c，42d）和用于输送抛光对象物的输送单元（44）用于在加载部分（14），抛光线（20,30）和清洁线（40）之间传送抛光对象的传送机构（50）; 以及用于控制研磨线（20,30），清洁线（40）和输送机构（50）的控制部。控制部分基于第一和第二研磨线（20,30）中的每一个中的预测的抛光时间来确定第一和第二抛光线（20,30）中的每一个中的抛光开始时间，运送中预测的运送时间机构（50），清洁管线（40）中的预测清洁时间和通过驱动清洗管线（40）的输送单元（44）开始清洁的预测清洁开始时间。

3. 发明申请

US20050142991A1 Substrate polishing apparatus 审中-公开
标题翻译：基材抛光装置
公开(公告)号：US20050142991A1
公开(公告)日：2005-06-30
申请号：US11013912
申请日：2004-12-17
申请人： Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
发明人： Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
IPC分类号： B24B51/00 , B24B49/03 , B24B49/12 , B24D7/12 , H01L21/304 , B24B7/00 , B24B9/00 , H01L21/76
CPC分类号： B24B37/013 , B24B49/03 , B24B49/12
摘要： A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
摘要翻译：提供了用于防止过度抛光和研磨不足的基板抛光装置，并且能够定量设定额外的抛光时间。基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保存过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。基板抛光装置构建另外的抛光数据库，用于存储从存储区域中的附加抛光结果获取的数据。

4. 发明授权

US08038136B2 Hand having rocking mechanism and substrate delivering device having the same 有权
标题翻译：具有摇摆机构的手和具有该摆动机构的基板输送装置
公开(公告)号：US08038136B2
公开(公告)日：2011-10-18
申请号：US12407826
申请日：2009-03-20
申请人： Hiroki Sanemasa , Hideo Yamamoto , Naoomi Torii , Takahiro Ogawa , Seiji Katsuoka , Hidetaka Nakao , Natsuki Makino
发明人： Hiroki Sanemasa , Hideo Yamamoto , Naoomi Torii , Takahiro Ogawa , Seiji Katsuoka , Hidetaka Nakao , Natsuki Makino
IPC分类号： H01L21/683 , B65G49/07 , B23Q3/18
CPC分类号： H01L21/68707 , Y10S414/141
摘要： A hand 1 is constituted by a hand base 4 serving as a base portion, a rocking hand 3 disposed to be superposed on the hand base 4 and serving to support a substrate 2, and a rocking mechanism 5 provided between the hand base 4 and the rocking hand 3 and serving to support the rocking hand 3 to be tiltable and movable in parallel with respect to the hand base 4.
摘要翻译：手1由用作基部的手持基座4，摆放在手基座4上并用于支撑基板2的摆动手3构成，摆动机构5设置在手持基座4和手柄基座4之间。摆动手3并且用于支撑摇摆手3以相对于手基座4平行地倾斜和移动。

5. 发明授权

US08388409B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US08388409B2
公开(公告)日：2013-03-05
申请号：US12700917
申请日：2010-02-05
申请人： Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
发明人： Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
IPC分类号： B24B51/00
CPC分类号： B24B37/013 , B24B49/03 , B24B49/12
摘要： A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
摘要翻译：提供了用于防止过度抛光和研磨不足的基板抛光装置，并且能够定量设定额外的抛光时间。基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保留过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。衬底抛光装置构建另外的抛光数据库，用于存储从存储区域中的附加抛光结果获取的数据。

6. 发明授权

US6074276A Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US6074276A
公开(公告)日：2000-06-13
申请号：US215147
申请日：1998-12-18
申请人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
发明人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
IPC分类号： B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , B24B57/02 , H01L21/302 , B24B7/24
CPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , H01L21/302 , Y10T137/5762
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括用于抛光工件表面的抛光部分，用于清洁已经被抛光的工件的清洁部分，设置在用于检测在抛光部分中发生的液体泄漏的抛光部分中的第一液体泄漏传感器，以及第二液体泄漏传感器，设置在清洁部分中，用于检测在清洁部分中发生的液体泄漏。抛光装置还包括一个控制装置，用于当第一和第二液体泄漏传感器中的任何一个检测到液体泄漏时，停止向抛光部分或清洁部分供应液体泄漏。

7. 发明申请

US20090111358A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090111358A1
公开(公告)日：2009-04-30
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
IPC分类号： B24B49/00 , B24B49/16 , B24B7/20
CPC分类号： B24B37/013 , B24B49/16
摘要： The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译：本发明提供一种用于在基板上研磨诸如膜的物体材料的装置。该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。

8. 再颁专利

USRE38215E1 Polishing apparatus 有权
公开(公告)号：USRE38215E1
公开(公告)日：2003-08-12
申请号：US09814060
申请日：2001-03-22
申请人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
发明人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
IPC分类号： B24B724
CPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , H01L21/302 , Y10T137/5762
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

9. 发明授权

US08078306B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08078306B2
公开(公告)日：2011-12-13
申请号：US12289507
申请日：2008-10-29
申请人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
发明人： Hidetaka Nakao , Eisaku Hayashi , Kunio Oishi , Isao Hayakawa , Yoshiaki Miyake , Yoshikuni Tateyama , Takeshi Ashihara
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/16
摘要： An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.
摘要翻译：一种装置在基板上抛光诸如膜之类的物体材料。该设备包括：用于保持具有抛光表面的抛光垫的抛光台，构造成驱动抛光台的电机;保持机构，其构造成保持具有待抛光物体的基板，并将基板压靠在抛光表面上; 修整器，其被配置为修整抛光表面;以及监视单元，被配置为监视对象材料的移除量。监视单元可操作以使用包含表示电机的转矩电流的积分值的变量的模型方程来计算物体材料的去除量，以及表示修整器的累积操作时间的变量。

10. 发明授权

US5885134A Polishing apparatus 失效
公开(公告)号：US5885134A
公开(公告)日：1999-03-23
申请号：US843593
申请日：1997-04-16
申请人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
发明人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
IPC分类号： B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , B24B57/02 , H01L21/302 , B24B7/24
CPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , H01L21/302 , Y10T137/5762
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

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