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    • 1. 发明授权
    • Method for detecting and characterizing plasma-etch induced damage in an integrated circuit
    • 用于检测和表征集成电路中的等离子体蚀刻引起的损伤的方法
    • US06265729B1
    • 2001-07-24
    • US09277338
    • 1999-03-26
    • Mark Michael NelsonSubhash Madhukar Deshmukh
    • Mark Michael NelsonSubhash Madhukar Deshmukh
    • H01L2358
    • H01L22/34H01L22/12
    • Characterization of plasma-induced damage in semiconductor manufacturing has long been considered unimportant because the damage had no discernible effect on circuit performance. With increasing transistor counts on an integrated circuit, the damage-induced parasitics are becoming increasingly important. Electrical characterization of such effects provides a far more sensitive method for determining the extent of damage and the effectiveness of efforts to repair the damage. A measurement of diode leakage current through a plasma-etch effect test diode which is formed completely within an active device region, removed from field oxide regions quantifies the extent of damage created by a plasma and the effectiveness of a repair technique that may be applied to the process.
    • 长期以来,半导体制造中等离子体引起的损伤的表征被认为是不重要的,因为损伤对电路性能没有明显的影响。 随着集成电路中晶体管数量的增加,损伤引起的寄生效应变得越来越重要。 这种影响的电气特性提供了一种更加敏感的方法来确定损伤的程度和修复损坏的努力的有效性。 通过等离子蚀刻效应测试二极管的二极管泄漏电流的测量,其完全在活性器件区域内形成,从场氧化物区域移除,量化了由等离子体产生的损伤程度以及修复技术的有效性,可用于 的过程。
    • 2. 发明授权
    • Operating method for ROM array which minimizes band-to-band tunneling
    • ROM阵列的操作方法,使带通隧道最小化
    • US5838046A
    • 1998-11-17
    • US665136
    • 1996-06-13
    • Rustom F. IraniBoaz EitanMark Michael NelsonLarry Willis Petersen
    • Rustom F. IraniBoaz EitanMark Michael NelsonLarry Willis Petersen
    • G11C17/12H01L29/76
    • G11C17/12
    • A read only memory (ROM) array is disclosed which includes a) a voltage supply providing an operating voltage level, b) a plurality of word-lines, c) a multiplicity of ROM transistors, and d) a word-line clamper. The ROM transistors are divided into turned on and turned off transistors. Each ROM transistor has a gate connected to one of the word-lines, a gate oxide beneath the gate, whose thickness is less than 250 .ANG., and a channel beneath the gate oxide. The turned off transistors additionally have a ROM implant in their channel whose dosage is no larger than the amount which generates a predetermined desired minimal band-to-band tunneling current The ROM implant and gate oxide thickness define a threshold voltage for the tamed off tranistors, the threshold voltage being less than the operating voltage level. The word-line damper provides a word-line voltage to each of the word-lines, the word-line voltage being clamped to a voltage level no higher than the threshold voltage of the turned off transistor.
    • 公开了一种只读存储器(ROM)阵列,其包括a)提供工作电压电平的电压源,b)多个字线,c)多个ROM晶体管,以及d)字线钳位器。 ROM晶体管分为导通和截止晶体管。 每个ROM晶体管具有连接到字线之一的栅极,栅极下方的栅极氧化物,其厚度小于250,栅极氧化物下方的沟道。 关闭晶体管另外在其通道中具有ROM植入物,其剂量不大于产生预定的期望的最小带 - 带隧穿电流的量。ROM注入和栅极氧化物厚度限定了驯化的晶体管的阈值电压, 阈值电压小于工作电压电平。 字线阻尼器对每个字线提供字线电压,字线电压被钳位到不高于截止晶体管的阈值电压的电压电平。
    • 6. 发明授权
    • Electrical diagnostic technique for silicon plasma-etch induced damage characterization
    • 硅等离子蚀刻诱导损伤表征的电气诊断技术
    • US06271539B1
    • 2001-08-07
    • US08950000
    • 1997-10-14
    • Mark Michael NelsonSubhash Madhukar Deshmukh
    • Mark Michael NelsonSubhash Madhukar Deshmukh
    • H01L2358
    • H01L22/34H01L22/12
    • Characterization of plasma-induced damage in semiconductor manufacturing has long been considered unimportant because the damage had no discernable effect on circuit performance. With increasing transistor counts on an integrated circuit, the damage-induced parasitics are becoming increasingly important. Electrical characterization of such effects provides a far more sensitive method for determining the extent of damage and the effectiveness of efforts to repair the damage. A measurement of diode leakage current through a plasma-etch effect test diode which is formed completely within an active device region, removed from field oxide regions quantifies the extent of damage created by a plasma and the effectiveness of a repair technique that may be applied to the process.
    • 长期以来,半导体制造中的等离子体引起的损伤的表征被认为是不重要的,因为损伤对电路性能没有明显的影响。 随着集成电路中晶体管数量的增加,损伤引起的寄生效应变得越来越重要。 这种影响的电气特性提供了一种更加敏感的方法来确定损伤的程度和修复损坏的努力的有效性。 通过等离子蚀刻效应测试二极管的二极管泄漏电流的测量,其完全在活性器件区域内形成,从场氧化物区域移除,量化了由等离子体产生的损伤程度以及修复技术的有效性,可用于 的过程。