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1. 发明授权

US06645052B2 Method and apparatus for controlling CMP pad surface finish 失效
公开(公告)号：US06645052B2
公开(公告)日：2003-11-11
申请号：US10039749
申请日：2001-10-26
申请人： Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
发明人： Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B21/04 , B24B37/24 , B24B49/04 , B24B53/017
摘要： A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.

2. 发明授权

US06939207B2 Method and apparatus for controlling CMP pad surface finish 失效
标题翻译：用于控制CMP垫表面光洁度的方法和设备
公开(公告)号：US06939207B2
公开(公告)日：2005-09-06
申请号：US10678727
申请日：2003-10-03
申请人： Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
发明人： Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
IPC分类号： B24B21/04 , B24B37/24 , B24B37/26 , B24B49/04 , B24B53/007 , B24B53/017 , B24B1/00
CPC分类号： B24B37/26 , B24B21/04 , B24B37/24 , B24B49/04 , B24B53/017
摘要： A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.
摘要翻译：描述了用于预处理用于半导体晶片的化学机械平面化的抛光垫的方法和装置。该装置包括具有光滑表面的预调节构件。该方法包括提供具有光滑表面的预调节构件，在移动抛光垫的同时将预处理构件压靠在抛光垫上，并且使抛光垫的表面变平，直到达到抛光垫平整度，其可以用于实现期望的半导体晶片平面度。

3. 发明授权

US06550091B1 Double-sided wafer edge scrubbing apparatus and method for using the same 有权
标题翻译：双面晶片边缘洗涤装置及其使用方法
公开(公告)号：US06550091B1
公开(公告)日：2003-04-22
申请号：US09680166
申请日：2000-10-04
申请人： Allan Radman , Mario Stella
发明人： Allan Radman , Mario Stella
IPC分类号： B08B102
CPC分类号： H01L21/67046 , B08B1/04
摘要： A substrate cleaning system incorporating an edge scrubbing roller is disclosed. The system includes a cleaning station having a first brush and a second brush. The second brush is oriented relative to the first brush so as to receive a flat circular substrate therebetween. The first brush and the second brush are configured to simultaneously scrub a first and second surface of the flat circular substrate. The cleaning station also includes a scrubbing roller that is configured to receive an edge of the flat circular substrate. The scrubbing roller has a scrubbing pad for scrubbing a first surface edge of the first surface, a second surface edge of the second surface, and an edge that is not part of either the first or second surface. The edge scrubbing provided by the scrubbing roller advantageously assists in removing edge beading, metal debris, and other particulates that form during fabrication operations, such as metal deposition. In one example, a spray nozzle or multiple nozzles can be directed at the scrubbing roller so as to deliver targeted cleaning fluids that further assist in removing the desired materials from the wafer periphery, whether it be on the top surface edge, the actual edge, or the bottom surface edge.
摘要翻译：公开了一种结合有边缘清洗辊的基板清洁系统。该系统包括具有第一刷和第二刷的清洁站。第二刷子相对于第一刷子定向，以便在其间容纳平坦的圆形基底。第一刷和第二刷配置成同时擦洗扁平圆形衬底的第一和第二表面。清洁站还包括擦拭辊，其构造成接收平坦圆形基底的边缘。擦洗辊具有用于擦洗第一表面的第一表面边缘，第二表面的第二表面边缘和不是第一表面或第二表面的一部分的边缘的擦洗垫。由洗涤辊提供的边缘洗涤有利地有助于去除在制造操作期间形成的边缘珠粒，金属碎屑和其它颗粒，例如金属沉积。在一个示例中，喷嘴或多个喷嘴可以被引导到洗涤辊，以便输送目标清洁流体，其进一步有助于从晶片周边去除期望的材料，无论它在顶表面边缘，实际边缘，或底面边缘。

4. 发明专利

IT1130668B 未知
公开(公告)号：IT1130668B
公开(公告)日：1986-06-18
申请号：IT2234480
申请日：1980-05-27
申请人： STELLA O M DI MARIO STELLA & C
发明人： STELLA MARIO
IPC分类号： F04D20060101 , F04D

5. 发明专利

IT8521063V0 未知
公开(公告)号：IT8521063V0
公开(公告)日：1985-03-12
申请号：IT2106385
申请日：1985-03-12
申请人： STELLA O M DI MARIO STELLA & C
IPC分类号： F04B20060101 , F04B

6. 发明专利

IT8022344D0 未知
公开(公告)号：IT8022344D0
公开(公告)日：1980-05-27
申请号：IT2234480
申请日：1980-05-27
申请人： STELLA O M DI MARIO STELLA & C
发明人： MARIO STELLA
IPC分类号： F04D20060101 , F04D

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