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1. 发明授权

US06550091B1 Double-sided wafer edge scrubbing apparatus and method for using the same 有权
标题翻译：双面晶片边缘洗涤装置及其使用方法
公开(公告)号：US06550091B1
公开(公告)日：2003-04-22
申请号：US09680166
申请日：2000-10-04
申请人： Allan Radman , Mario Stella
发明人： Allan Radman , Mario Stella
IPC分类号： B08B102
CPC分类号： H01L21/67046 , B08B1/04
摘要： A substrate cleaning system incorporating an edge scrubbing roller is disclosed. The system includes a cleaning station having a first brush and a second brush. The second brush is oriented relative to the first brush so as to receive a flat circular substrate therebetween. The first brush and the second brush are configured to simultaneously scrub a first and second surface of the flat circular substrate. The cleaning station also includes a scrubbing roller that is configured to receive an edge of the flat circular substrate. The scrubbing roller has a scrubbing pad for scrubbing a first surface edge of the first surface, a second surface edge of the second surface, and an edge that is not part of either the first or second surface. The edge scrubbing provided by the scrubbing roller advantageously assists in removing edge beading, metal debris, and other particulates that form during fabrication operations, such as metal deposition. In one example, a spray nozzle or multiple nozzles can be directed at the scrubbing roller so as to deliver targeted cleaning fluids that further assist in removing the desired materials from the wafer periphery, whether it be on the top surface edge, the actual edge, or the bottom surface edge.
摘要翻译：公开了一种结合有边缘清洗辊的基板清洁系统。该系统包括具有第一刷和第二刷的清洁站。第二刷子相对于第一刷子定向，以便在其间容纳平坦的圆形基底。第一刷和第二刷配置成同时擦洗扁平圆形衬底的第一和第二表面。清洁站还包括擦拭辊，其构造成接收平坦圆形基底的边缘。擦洗辊具有用于擦洗第一表面的第一表面边缘，第二表面的第二表面边缘和不是第一表面或第二表面的一部分的边缘的擦洗垫。由洗涤辊提供的边缘洗涤有利地有助于去除在制造操作期间形成的边缘珠粒，金属碎屑和其它颗粒，例如金属沉积。在一个示例中，喷嘴或多个喷嘴可以被引导到洗涤辊，以便输送目标清洁流体，其进一步有助于从晶片周边去除期望的材料，无论它在顶表面边缘，实际边缘，或底面边缘。

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