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    • 2. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110193081A1
    • 2011-08-11
    • US13018879
    • 2011-02-01
    • Hiromichi GODOYasuyuki ARAISatohiro OKAMOTOMari TERASHIMAEriko NISHIDAJunpei SUGAO
    • Hiromichi GODOYasuyuki ARAISatohiro OKAMOTOMari TERASHIMAEriko NISHIDAJunpei SUGAO
    • H01L29/78
    • H01L29/7869
    • An object is to provide a semiconductor device including an oxide semiconductor in which miniaturization is achieved while favorable characteristics are maintained. The semiconductor includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, a gate insulating layer provided between the oxide semiconductor layer and the gate electrode, and an insulating layer provided in contact with the oxide semiconductor layer. A side surface of the oxide semiconductor layer is in contact with the source electrode or the drain electrode. An upper surface of the oxide semiconductor layer overlaps with the source electrode or the drain electrode with the insulating layer interposed between the oxide semiconductor layer and the source electrode or the drain electrode.
    • 本发明的目的是提供一种包括氧化物半导体的半导体器件,其中实现了小型化,同时保持了有利的特性。 半导体包括与氧化物半导体层接触的氧化物半导体层,源电极和漏电极,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及 绝缘层设置成与氧化物半导体层接触。 氧化物半导体层的侧表面与源电极或漏电极接触。 氧化物半导体层的上表面与源电极或漏电极重叠,绝缘层介于氧化物半导体层与源电极或漏电极之间。
    • 5. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08709922B2
    • 2014-04-29
    • US13448611
    • 2012-04-17
    • Junichi KoezukaNaoto YamadeKyoko YoshiokaYuhei SatoMari Terashima
    • Junichi KoezukaNaoto YamadeKyoko YoshiokaYuhei SatoMari Terashima
    • H01L29/786H01L29/66
    • H01L29/66969H01L21/02667H01L29/78606H01L29/78693
    • A highly reliable semiconductor device which is formed using an oxide semiconductor and has stable electric characteristics is provided. A semiconductor device which includes an amorphous oxide semiconductor layer including a region containing oxygen in a proportion higher than that in the stoichiometric composition, and an aluminum oxide film provided over the amorphous oxide semiconductor layer is provided. The amorphous oxide semiconductor layer is formed as follows: oxygen implantation treatment is performed on a crystalline or amorphous oxide semiconductor layer which has been subjected to dehydration or dehydrogenation treatment, and then thermal treatment is performed on the oxide semiconductor layer provided with an aluminum oxide film at a temperature lower than or equal to 450° C.
    • 提供了使用氧化物半导体形成且具有稳定的电特性的高度可靠的半导体器件。 提供一种半导体器件,其包括非晶氧化物半导体层,所述非晶氧化物半导体层包括含有比所述化学计量组成中高的比例的氧的区域和设置在所述非晶氧化物半导体层上的氧化铝膜。 无定形氧化物半导体层如下形成:对已进行脱水或脱氢处理的结晶或非晶氧化物半导体层进行氧注入处理,然后对设置有氧化铝膜的氧化物半导体层进行热处理 在低于或等于450℃的温度下
    • 6. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08546811B2
    • 2013-10-01
    • US13018879
    • 2011-02-01
    • Hiromichi GodoYasuyuki AraiSatohiro OkamotoMari TerashimaEriko NishidaJunpei Sugao
    • Hiromichi GodoYasuyuki AraiSatohiro OkamotoMari TerashimaEriko NishidaJunpei Sugao
    • H01L27/14
    • H01L29/7869
    • An object is to provide a semiconductor device including an oxide semiconductor in which miniaturization is achieved while favorable characteristics are maintained. The semiconductor includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, a gate insulating layer provided between the oxide semiconductor layer and the gate electrode, and an insulating layer provided in contact with the oxide semiconductor layer. A side surface of the oxide semiconductor layer is in contact with the source electrode or the drain electrode. An upper surface of the oxide semiconductor layer overlaps with the source electrode or the drain electrode with the insulating layer interposed between the oxide semiconductor layer and the source electrode or the drain electrode.
    • 本发明的目的是提供一种包括氧化物半导体的半导体器件,其中实现了小型化,同时保持了有利的特性。 半导体包括与氧化物半导体层接触的氧化物半导体层,源电极和漏电极,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及 绝缘层设置成与氧化物半导体层接触。 氧化物半导体层的侧表面与源电极或漏电极接触。 氧化物半导体层的上表面与源电极或漏电极重叠,绝缘层介于氧化物半导体层与源电极或漏电极之间。