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    • 7. 发明申请
    • FLUID PATHS IN ETCHABLE MATERIALS
    • 可蚀性材料中的流体状态
    • WO2008067206A2
    • 2008-06-05
    • PCT/US2007/085086
    • 2007-11-19
    • BIOSCALE, INC.MILLER, MichaelMASTERS, Brett, P.SCHMIDT, Martin
    • MILLER, MichaelMASTERS, Brett, P.SCHMIDT, Martin
    • B81C1/00
    • B81C1/00714B81B2201/058B81B2203/033B81C2201/0112
    • The invention relates to fluid paths in etchable materials. Fluid paths are formed by forming a cavity through a substrate material with a first dry removal process to produce a first surface of the cavity. The first surface of the cavity is associated with a first roughness. The first surface of the cavity is etched with a second wet removal process to reduce the first roughness and produce a second roughness associated with the first surface of the cavity. A coating is applied to the first surface of the cavity to produce a second surface to improve wettability of the first or second surface of the cavity, reduce in size or number gas nucleation sites in the first or second surface of the cavity, reduce the amount of debris associated with the first roughness carried by the fluid flow, and/or improve hydrophilicity of the first or second surface.
    • 本发明涉及可蚀刻材料中的流体路径。 通过用第一干燥去除工艺通过基底材料形成空腔来形成流体路径,以产生空腔的第一表面。 空腔的第一表面与第一粗糙度相关联。 通过第二湿去除工艺蚀刻空腔的第一表面,以减少第一粗糙度并产生与空腔的第一表面相关联的第二粗糙度。 将涂层施加到空腔的第一表面以产生第二表面以改善空腔的第一或第二表面的润湿性,减小空腔的第一或第二表面中的气体成核位置的尺寸或数量,减少量 与由流体流动携带的第一粗糙度相关联的碎屑和/或改善第一或第二表面的亲水性。