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    • 2. 发明申请
    • FLUID PATHS IN ETCHABLE MATERIALS
    • 可蚀刻材料中的流体路径
    • WO2008067206A3
    • 2008-11-27
    • PCT/US2007085086
    • 2007-11-19
    • BIOSCALE INCMILLER MICHAELMASTERS BRETT PSCHMIDT MARTIN
    • MILLER MICHAELMASTERS BRETT PSCHMIDT MARTIN
    • B01L3/00B81C1/00
    • B81C1/00714B81B2201/058B81B2203/033B81C2201/0112
    • The invention relates to fluid paths in etchable materials. Fluid paths are formed by forming a cavity through a substrate material with a first dry removal process to produce a first surface of the cavity. The first surface of the cavity is associated with a first roughness. The first surface of the cavity is etched with a second wet removal process to reduce the first roughness and produce a second roughness associated with the first surface of the cavity. A coating is applied to the first surface of the cavity to produce a second surface to improve wettability of the first or second surface of the cavity, reduce in size or number gas nucleation sites in the first or second surface of the cavity, reduce the amount of debris associated with the first roughness carried by the fluid flow, and/or improve hydrophilicity of the first or second surface.
    • 本发明涉及可蚀刻材料中的流体路径。 流体路径通过利用第一干法去除工艺形成穿过基底材料的腔来形成,以产生腔的第一表面。 空腔的第一表面与第一粗糙度相关联。 用第二湿去除工艺蚀刻腔的第一表面以减小第一粗糙度并产生与腔的第一表面相关的第二粗糙度。 将涂层施加到空腔的第一表面以产生第二表面以改善空腔的第一或第二表面的润湿性,减小空腔的第一或第二表面中的气体成核位置的尺寸或数量, 与由流体流携带的第一粗糙度相关的碎片,和/或改善第一或第二表面的亲水性。