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    • 1. 发明申请
    • Simultaneous Multi-Layer Fill Generation
    • 同时多层填充生成
    • US20090077506A1
    • 2009-03-19
    • US12121135
    • 2008-05-15
    • Eugene AnikinFedor PikusLaurence GroddDavid A. AbercrombieJohn W. Stedman
    • Eugene AnikinFedor PikusLaurence GroddDavid A. AbercrombieJohn W. Stedman
    • G06F17/50
    • G06F17/5072G03F1/44G06F17/5045G06F17/5068G06F2217/12H01L27/0207Y02P90/265
    • Techniques are disclosed for optimizing the pattern density in the circuit layout design of a circuit layer. A layer in circuit design is analyzed to define empty regions that can be filled with fill polygons (referred to hereafter as “fill” regions). Next, a pattern of fill polygons is generated. After the fill polygons have been defined, the layout design for the layer is divided into separate areas or “windows,” and a target density for each window is determined. Once this target density for the window has been determined, the fill polygons required to most closely approach this target density are generated and added to the circuit layout design. This process may be repeated with progressively different (e.g., smaller) fill polygons, until each window meets or exceeds both the specified minimum density and complies with the specified maximum density gradient. Additionally, some implementations may allow a user to simultaneously optimize the density of multiple layers of a circuit by adding fill polygons to multiple layers of a circuit design simultaneously. Representations of sections of a multilayer fill structure will then be added to corresponding layers the circuit design until a specified target density is met.
    • 公开了用于优化电路层的电路布局设计中的图案密度的技术。 分析电路设计中的层以定义可填充填充多边形(以下称为“填充”区域)的空区域。 接下来,生成填充多边形的图案。 在定义了填充多边形之后,层的布局设计被划分为单独的区域或“窗口”,并确定每个窗口的目标密度。 一旦确定了该窗口的目标密度,则生成最接近该目标密度所需的填充多边形,并将其添加到电路布局设计中。 该过程可以随着逐渐不同(例如较小的)填充多边形重复,直到每个窗口满足或超过规定的最小密度并且符合规定的最大密度梯度。 此外,一些实施方案可允许用户通过向电路设计的多个层同时添加填充多边形来同时优化电路的多层密度。 然后将多层填充结构的部分的表示添加到电路设计的相应层中,直到满足指定的目标密度。
    • 5. 发明申请
    • Secure exchange of information in electronic design automation
    • 在电子设计自动化中安全交换信息
    • US20050071659A1
    • 2005-03-31
    • US10895485
    • 2004-07-20
    • John FergusonFedor PikusKyohei SakajiriLaurence Grodd
    • John FergusonFedor PikusKyohei SakajiriLaurence Grodd
    • H04L9/08H04L9/30H04L9/00
    • G06Q40/04H04L9/0838H04L2209/16
    • Described herein are methods and systems for secure exchange of information related to electronic design automation. Information deemed sensitive and otherwise worthy of protection may be secured by methods such as encryption, obfuscation and other security measures. The secured information may be provided to an electronic design automation tool for processing without revealing at least some of the secured information. For instance, rule files related to integrated circuit manufacturability may be selectively annotated to indicate portions thereof deserving of protection. An encryption tool may be used to secure the information so indicated and generate a file comprising secured information related to electronic design automation. An electronic design automation tool may then unlock and use the secured information without revealing the same. For instance, the tool may be a physical verification tool capable of verifying whether any of the one or more integrated circuit layouts may violate one or more of the secured rules. An error report may be generated without revealing the secured rules.
    • 这里描述了用于安全地交换与电子设计自动化相关的信息的方法和系统。 被视为敏感而其他值得保护的信息可以通过加密,混淆和其他安全措施等方法来保护。 可以将安全信息提供给电子设计自动化工具用于处理,而不暴露至少一些安全信息。 例如,可以选择性地注释与集成电路可制造性相关的规则文件,以指示其应得到保护的部分。 可以使用加密工具来保护所指示的信息,并生成包括与电子设计自动化有关的安全信息的文件。 然后,电子设计自动化工具可以解锁和使用安全信息,而不会泄露它们。 例如,该工具可以是能够验证一个或多个集成电路布局中的任一个是否可能违反一个或多个安全规则的物理验证工具。 可能会生成错误报告,而不会泄露安全规则。
    • 6. 发明申请
    • Hierarchical feature extraction for electrical interaction
    • 电相互作用的分层特征提取
    • US20060059443A1
    • 2006-03-16
    • US11202935
    • 2005-08-12
    • Thomas KauthPatrick GibsonKurt HertzLaurence Grodd
    • Thomas KauthPatrick GibsonKurt HertzLaurence Grodd
    • G06F17/50
    • G06F17/5081G06F17/5036
    • A method of calculating electrical interactions of circuit elements in an integrated circuit layout without flattening the entire database that describes the layout. In one embodiment, a hierarchical database is analyzed and resistance and capacitance calculations made for a repeating pattern of elements are re-used at each instance of the repeated pattern and adjusted for local conditions. In another embodiment, a circuit layout is converted into a number of tiles, wherein the resistance and capacitance calculations made for the circuit elements in the center and a boundary region of the tiles are computed separately and combined. Environmental information that affects electrical interaction between circuit elements in different levels of hierarchy is calculated at a lower level of hierarchy so that such calculations do not need to be made for each placement of a repeated cell and so that not all interacting elements need to be promoted to the same hierarchy level to compute the electrical interactions.
    • 计算集成电路布局中的电路元件的电学相互作用的方法,而不使整个描述布局的数据库变平坦。 在一个实施例中,分析分层数据库,并且在重复模式的每个实例处重新使用针对重复模式元素进行的电阻和电容计算,并根据局部条件进行调整。 在另一个实施例中,将电路布局转换成多个瓦片,其中对瓦片的中心的电路元件和瓦片的边界区域进行的电阻和电容计算分别计算并组合。 影响不同级别层次的电路元件之间的电气相互作用的环境信息是在较低级别的层次上进行计算,因此不需要对重复单元格的每个放置进行此类计算,因此不需要促进所有相互作用的元素 到相同的层次级别来计算电相互作用。
    • 8. 发明申请
    • Secure exchange of information in electronic design automation
    • 在电子设计自动化中安全交换信息
    • US20050071792A1
    • 2005-03-31
    • US10920988
    • 2004-08-17
    • John FergusonFedor PikusKyohei SakajiriLaurence Grodd
    • John FergusonFedor PikusKyohei SakajiriLaurence Grodd
    • G06F20060101G06F9/45H04L9/08H04L9/30G06F17/50
    • G06F21/6209G06F2221/2137
    • Information related to electronic design automation may be exchanged in a secure manner. Information deemed sensitive and otherwise worthy of protection may be secured by methods such as encryption, obfuscation and other security measures. The secured information may be processed without revealing at least some of the secured information. For instance, rule files related to integrated circuit manufacturability may be selectively annotated to indicate portions thereof deserving of protection. An encryption tool may be used to secure the information related to electronic design automation. An electronic design automation tool may then unlock and use the secured information without revealing the same. In one aspect, such access or secure use of the information may depend on one or more conditions being met (e.g., a time period or a number of uses or accesses). For instance, the tool may be a physical verification tool capable of verifying whether any of the one or more integrated circuit layouts may violate one or more of the secured rules.
    • 与电子设计自动化相关的信息可以以安全的方式交换。 被视为敏感而其他值得保护的信息可以通过加密,混淆和其他安全措施等方法来保护。 可以处理安全信息,而不泄露至少一些安全信息。 例如,可以选择性地注释与集成电路可制造性相关的规则文件,以指示其应得到保护的部分。 可以使用加密工具来保护与电子设计自动化有关的信息。 然后,电子设计自动化工具可以解锁和使用安全信息,而不会泄露它们。 在一个方面,信息的这种访问或安全使用可以取决于满足的一个或多个条件(例如,一个时间段或多个使用或访问)。 例如,该工具可以是能够验证一个或多个集成电路布局中的任一个是否可能违反一个或多个安全规则的物理验证工具。
    • 10. 发明申请
    • Optimization Of Geometry Pattern Density
    • 几何图案密度优化
    • US20080034332A1
    • 2008-02-07
    • US11743116
    • 2007-05-01
    • Eugene AnikinFedor PikusJohn StedmanLaurence GroddDavid Abercrombie
    • Eugene AnikinFedor PikusJohn StedmanLaurence GroddDavid Abercrombie
    • G06F17/50
    • G06F17/5068G06F2217/12Y02P90/265
    • Techniques are provided for optimizing the pattern density in the circuit layout design of a circuit layer. A layer in circuit design is analyzed to define fill regions that can be filled with fill polygons A pattern of fill polygons also is generated, to fill the fill regions. The layout design for the layer then is divided into separate areas or “windows,” and a target density for each window is determined. More particularly, each window is analyzed to determine a target density for the window that will satisfy specified density constraint values, such as a minimum density constraint, a maximum density constraint, or a maximum density gradient constraint. In some implementations, the target density will be the smallest density that will comply with each of the specified density value constraints. Once the target density for the window has been determined, the fill polygons required to most closely approach this target density are selected and added to the circuit layout design. With some implementations, this process may be repeated for fill polygons of different sizes or shapes.
    • 提供了用于优化电路层的电路布局设计中的图案密度的技术。 分析电路设计中的层,以定义可填充填充多边形的填充区域。还生成填充多边形的图案,以填充填充区域。 然后将层的布局设计分为单独的区域或“窗口”,并确定每个窗口的目标密度。 更具体地,分析每个窗口以确定将满足指定密度约束值(例如最小密度约束,最大密度约束或最大密度梯度约束)的窗口的目标密度。 在一些实施方式中,目标密度将是符合每个特定密度值约束的最小密度。 一旦确定了窗口的目标密度,则选择最接近该目标密度所需的填充多边形并将其添加到电路布局设计中。 对于一些实现,对于不同大小或形状的填充多边形,可以重复该过程。