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    • 2. 发明授权
    • Magnetic patterns and methods of forming magnetic patterns
    • 磁性图案和形成磁图案的方法
    • US08952434B2
    • 2015-02-10
    • US13490681
    • 2012-06-07
    • Kyung-Tae Nam
    • Kyung-Tae Nam
    • H01L21/00G11B5/33H01L43/12H01L27/22
    • H01L43/12G11C11/161H01L27/228
    • In a method of forming a magnetic pattern, a lower electrode layer is formed on a substrate. An insulating interlayer is formed on the lower electrode layer. The insulating interlayer is partially removed to form an opening. A first pinned layer pattern filling the opening is formed. A second pinned layer, a tunnel barrier layer, a free layer and an upper electrode layer are formed on the insulating interlayer and the first pinned layer pattern. The upper electrode layer, the free layer, the tunnel barrier layer and the second pinned layer are patterned to form a second pinned layer pattern, a tunnel barrier pattern, a free layer pattern and an upper electrode. The second pinned layer pattern covers an upper surface of the first pinned layer pattern.
    • 在形成磁图案的方法中,在基板上形成下电极层。 在下电极层上形成绝缘中间层。 部分去除绝缘中间层以形成开口。 形成填充开口的第一固定层图案。 在绝缘中间层和第一被钉扎层图案上形成第二被钉扎层,隧道势垒层,自由层和上部电极层。 图案化上电极层,自由层,隧道势垒层和第二被钉扎层,以形成第二固定层图案,隧道势垒图案,自由层图案和上电极。 第二钉扎层图案覆盖第一钉扎层图案的上表面。
    • 6. 发明授权
    • Magnetic memory device
    • 磁存储器件
    • US08035145B2
    • 2011-10-11
    • US12773451
    • 2010-05-04
    • Jun-Soo BaeJang-Eun LeeHyun-Jo KimSe-Chung OhKyung-Tae Nam
    • Jun-Soo BaeJang-Eun LeeHyun-Jo KimSe-Chung OhKyung-Tae Nam
    • H01L21/02
    • G11C11/15B82Y25/00B82Y40/00H01F10/3254H01F10/3272H01F10/3281H01F41/302H01L43/08
    • A magnetic memory device is provided. The magnetic memory device includes an invariable pinning pattern and a variable pinning pattern on a substrate. A tunnel barrier pattern is interposed between the invariable pinning pattern and the variable pinning pattern, and the pinned pattern is interposed between the invariable pinning pattern and the tunnel barrier pattern. A storage free pattern is interposed between the tunnel barrier pattern and the variable pinning pattern, and a guide free pattern is interposed between the storage free pattern and the variable pinning pattern. A free reversing pattern is interposed between the storage and guide free patterns. The free reversing pattern reverses a magnetization direction of the storage free pattern and a magnetization direction of the guide free pattern in the opposite directions.
    • 提供磁存储器件。 磁存储器件在衬底上包括不变的钉扎图案和可变的钉扎图案。 在不变的钉扎图案和可变钉扎图案之间插入隧道势垒图案,并且钉扎图案介于不变钉扎图案和隧道屏障图案之间。 在隧道势垒图案和可变钉扎图案之间插入无存储图案,并且在存储空闲图案和可变钉扎图案之间插入无引导图案。 在存储和无引导模式之间插入一个自由的反转模式。 自由反转图案反转无存储图案的磁化方向和反向自由图案的磁化方向。
    • 9. 发明授权
    • Magnetic random access memory device and method of forming the same
    • 磁性随机存取存储器件及其形成方法
    • US07645619B2
    • 2010-01-12
    • US12073098
    • 2008-02-29
    • Se-Chung OhJang-Eun LeeJun-Soo BaeHyun-Jo KimKyung-Tae NamYoung-Ki Ha
    • Se-Chung OhJang-Eun LeeJun-Soo BaeHyun-Jo KimKyung-Tae NamYoung-Ki Ha
    • H01L21/00
    • G11C11/16B82Y10/00B82Y25/00G11B5/3909H01L27/228H01L43/08H01L43/12Y10T29/49034Y10T29/49044
    • Example embodiments of the present invention disclose a semiconductor memory device and a method of forming a memory device. A semiconductor memory device may include a digit line disposed on a substrate, an intermediate insulating layer covering the digit line, a magnetic tunnel junction (MTJ) pattern disposed on the intermediate insulating layer and over the digit line, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., and a bit line connected to the capping pattern and disposed to intersect the digit line. A method of forming a semiconductor memory device may include forming a digit line on a substrate, forming an intermediate insulating layer covering the digit line, forming a magnetic tunnel junction (MTJ) pattern on the intermediate insulating layer, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., performing an annealing operation at a temperature of about 350° C. or higher, and forming a bit line connected to the capping pattern and disposed to intersect the digit line.
    • 本发明的示例性实施例公开了半导体存储器件和形成存储器件的方法。 半导体存储器件可以包括设置在衬底上的数字线,覆盖数字线的中间绝缘层,设置在中间绝缘层上方和数字线上的磁性隧道结(MTJ)图案,MTJ图案包括顺序堆叠 下磁性图案,上磁性图案和封盖图案,其中封盖图案在高于约280℃的温度下不与上磁性图案反应,而位线连接到封盖图案并且设置成与数字线相交 。 形成半导体存储器件的方法可以包括在衬底上形成数字线,形成覆盖数字线的中间绝缘层,在中间绝缘层上形成磁隧道结(MTJ)图案,MTJ图案包括顺序层叠的 较低的磁性图案,上部磁性图案和封盖图案,其中封盖图案在高于约280℃的温度下不与上部磁性图案反应,在约350℃或更高的温度下进行退火操作, 并且形成连接到所述封盖图案并且设置成与所述数字线相交的位线。