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1. 发明申请

US20050101161A1 Sensor module 有权
标题翻译：传感器模块
公开(公告)号：US20050101161A1
公开(公告)日：2005-05-12
申请号：US10982982
申请日：2004-11-04
申请人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
发明人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
IPC分类号： H01L27/14 , B81B7/00 , G01P1/02 , H01L23/02 , H01L31/14 , H01R13/658 , H01R33/00
CPC分类号： B81B7/0064 , B81B2201/0235 , B81B2201/0242 , G01P1/023 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01068 , H01L2924/3025 , H01R13/6594 , H01L2924/00014 , H01L2924/00
摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
摘要翻译：传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。传感器模块可以被模制或者可以具有预成型的壳体。盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

2. 发明授权

US06804883B1 Method for producing a pressure sensor 有权
标题翻译：压力传感器的制造方法
公开(公告)号：US06804883B1
公开(公告)日：2004-10-19
申请号：US09603060
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01R4300
CPC分类号： B81C1/00333 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/49169 , Y10T29/49171 , Y10T29/49174 , Y10T29/49176 , H01L2924/00014
摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.
摘要翻译：一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。半导体压力传感器电连接到引线栅格的接触部分。引线格栅与半导体压力传感器一起插入注塑模具中。模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

3. 发明授权

US06661668B2 Housing and methods of producing a housing 失效
标题翻译：住房和生产住房的方法
公开(公告)号：US06661668B2
公开(公告)日：2003-12-09
申请号：US10031814
申请日：2002-05-31
申请人： Kurt Weiblen
发明人： Kurt Weiblen
IPC分类号： H05K506
CPC分类号： H05K5/063
摘要： A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.
摘要翻译：一种壳体，特别是电子部件用壳体，其包括由塑料制成并具有至少一个开口的壳体部分和用于封闭开口的盖部。提出盖部分是作为金属冲压部分制成的，盖部分的冲压边缘在盖部分的第一侧上具有冲孔脊，在与第一侧相对的第二侧具有冲头压痕，盖子部分经由第二侧被压入壳体部分的开口中，使得盖部分经由至少两个分布在盖部分的周边上的边缘部分并且咬合而抵靠开口的内壁的指定部分通过冲孔脊以倒钩状的方式进入内壁的指定部分。

4. 发明授权

US06300169B1 Method for manufacturing a pressure sensor 有权
标题翻译：制造压力传感器的方法
公开(公告)号：US06300169B1
公开(公告)日：2001-10-09
申请号：US09603082
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01L2144
CPC分类号： G01L19/143 , G01L19/141 , H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.
摘要翻译：在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开装配段由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在避免了将注射成型化合物完全渗透到间隙中。

5. 发明授权

US5723784A Flow rate meter 失效
标题翻译：流量计
公开(公告)号：US5723784A
公开(公告)日：1998-03-03
申请号：US676850
申请日：1996-07-08
申请人： Manfred Lembke , Josef Kleinhans , Hans Hecht , Helmut Bassler , Gerhard Hueftle , Alexander Kromer , Kurt Weiblen , Stefan Lehenberger , Guenther Frick , Klaus Reymann , Axel-Werner Haag , Dieter Tank , Uwe Konzelmann , Waldemar Guenther , Henninge Marberg
发明人： Manfred Lembke , Josef Kleinhans , Hans Hecht , Helmut Bassler , Gerhard Hueftle , Alexander Kromer , Kurt Weiblen , Stefan Lehenberger , Guenther Frick , Klaus Reymann , Axel-Werner Haag , Dieter Tank , Uwe Konzelmann , Waldemar Guenther , Henninge Marberg
IPC分类号： G01F1/68 , G01F1/684 , G01F1/692
CPC分类号： G01F1/6845 , G01F1/6842
摘要： The invention proposes a device for measuring the mass of a flowing medium, in particular the mass of air aspirated by internal combustion engines. The device has a platelike sensor element which is accommodated in a recess of a sensor carrier, and which with a sensor region that has at least one measuring resistor is exposed to the flowing medium in order to measure its mass. The sensor element is accommodated essentially flush in the recess and is retained in the recess by being glued to a bottom face in the recess. The bottom face of the recess of the sensor carrier has a troughlike indentation, which extends at least partially along the circumference of the sensor element outside the sensor region that has the at least one measuring resistor. The device according to the invention is intended to measure the mass of a flowing medium, in particular for measuring the mass of air aspirated by internal combustion engines.
摘要翻译：本发明提出了一种用于测量流动介质的质量的装置，特别是由内燃机吸入的空气的质量。该装置具有平板状传感器元件，其被容纳在传感器载体的凹部中，并且具有至少一个测量电阻器的传感器区域暴露于流动介质以便测量其质量。传感器元件基本上平齐地容纳在凹部中并且通过粘合到凹部中的底面而保持在凹部中。传感器载体的凹部的底面具有凹槽形凹陷，该凹槽至少部分地沿着传感器元件的圆周延伸到具有至少一个测量电阻器的传感器区域外部。根据本发明的装置旨在测量流动介质的质量，特别是用于测量由内燃机吸入的空气的质量。

6. 发明授权

US5525943A Electromagnetic compatibility filter utilizing inherently formed capacitance 失效
标题翻译：电磁兼容滤波器利用固有的电容
公开(公告)号：US5525943A
公开(公告)日：1996-06-11
申请号：US223071
申请日：1994-04-04
申请人： Walter Roethlingshoefer , Kurt Weiblen , Peter Tauber , Uwe Lipphardt
发明人： Walter Roethlingshoefer , Kurt Weiblen , Peter Tauber , Uwe Lipphardt
IPC分类号： H04B15/02 , H05K9/00 , H03H7/00
CPC分类号： H04B15/02
摘要： An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.
摘要翻译：用于混合技术电路部件的电磁兼容（EMC）滤波器，具有载流线路和接地导体，用于防止电磁干扰。载流线和接地导体布置在陶瓷板上。载流线由电介质覆盖，电介质又由与接地导体电接触的上金属屏蔽覆盖。下部金属屏幕布置在载流线下方的陶瓷板上，并与接地导体电接触。

7. 发明授权

US07323766B2 Sensor module 有权
标题翻译：传感器模块
公开(公告)号：US07323766B2
公开(公告)日：2008-01-29
申请号：US10982982
申请日：2004-11-04
申请人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
发明人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
IPC分类号： H01L23/495
CPC分类号： B81B7/0064 , B81B2201/0235 , B81B2201/0242 , G01P1/023 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01068 , H01L2924/3025 , H01R13/6594 , H01L2924/00014 , H01L2924/00
摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
摘要翻译：传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。传感器模块可以被模制或者可以具有预成型的壳体。盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

8. 发明申请

US20070279876A1 Device for passivating at least one component by a housing and method for manufacturing a device 审中-公开
标题翻译：用于通过壳体钝化至少一个部件的装置和用于制造装置的方法
公开(公告)号：US20070279876A1
公开(公告)日：2007-12-06
申请号：US11603440
申请日：2006-11-21
申请人： Kurt Weiblen , Martin Schoefthaler , Thomas Haalboom
发明人： Kurt Weiblen , Martin Schoefthaler , Thomas Haalboom
IPC分类号： H05K5/00 , H05K3/30
CPC分类号： H05K1/0218 , B81B7/007 , B81B2207/097 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/15192 , H01L2924/16152 , H05K1/0306 , H05K3/4685 , H05K9/0026 , H05K9/0039 , H05K2201/10371 , Y10T29/49169 , H01L2924/00014
摘要： A device for passivating at least one component by a housing and a method for manufacturing the device. A cover is connected to a front side of the substrate to form an inner chamber of the housing in a connection area. The component is attached to the front side of the substrate and inside the inner chamber of the housing, at least one contact line, which is connected in an electrically conductive manner to the component, is electrically insulated in relation to the connection area and is provided in the proximity of at least a part of the connection area between the front side and a rear side of the substrate, which faces away from the front side, or on the rear side of the substrate.
摘要翻译：一种用于通过壳体钝化至少一个部件的装置和用于制造该装置的方法。盖连接到基板的前侧，以在连接区域中形成壳体的内室。该部件附接到基板的前侧并且在壳体的内室内部，至少一个以导电方式连接到部件的接触线相对于连接区域电绝缘，并且被提供在衬底的前侧和后侧之间的连接区域的至少一部分附近，其背离基板的前侧或背面。

9. 发明授权

US07064403B2 Chip assembly in a premold housing 有权
标题翻译：芯片组装在预制外壳中
公开(公告)号：US07064403B2
公开(公告)日：2006-06-20
申请号：US10832534
申请日：2004-04-26
申请人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
发明人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
IPC分类号： H01L27/14 , G01J5/00
CPC分类号： H01L31/0203 , G01J5/12 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.
摘要翻译：本发明涉及一种用于检测红外范围内的入射辐射的装置，包括至少一个用于检测红外辐射的芯片组件，至少一个接合线，其从芯片组件开始并穿过金属端子延伸到外壳的外部以及以这种方式分布的钝化材料，使得至少一个接合线实质上被钝化材料完全包围，并且芯片组件的面对入射的红外辐射的表面区域不是由钝化材料包围。

10. 发明申请

US20050179102A1 Chip assembly in a premold housing 有权
标题翻译：芯片组装在预制外壳中
公开(公告)号：US20050179102A1
公开(公告)日：2005-08-18
申请号：US10832534
申请日：2004-04-26
申请人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
发明人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
IPC分类号： G01J5/12 , H01L31/0203 , H01L31/0232
CPC分类号： H01L31/0203 , G01J5/12 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.
摘要翻译：本发明涉及一种用于检测红外范围内的入射辐射的装置，包括至少一个用于检测红外辐射的芯片组件，至少一个接合线，其从芯片组件开始并穿过金属端子延伸到外壳的外部以及以这种方式分布的钝化材料，使得至少一个接合线实质上被钝化材料完全包围，并且芯片组件的面对入射的红外辐射的表面区域不是由钝化材料包围。

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