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1. 发明申请

US20050101161A1 Sensor module 有权
标题翻译：传感器模块
公开(公告)号：US20050101161A1
公开(公告)日：2005-05-12
申请号：US10982982
申请日：2004-11-04
申请人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
发明人： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
IPC分类号： H01L27/14 , B81B7/00 , G01P1/02 , H01L23/02 , H01L31/14 , H01R13/658 , H01R33/00
CPC分类号： B81B7/0064 , B81B2201/0235 , B81B2201/0242 , G01P1/023 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01068 , H01L2924/3025 , H01R13/6594 , H01L2924/00014 , H01L2924/00
摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
摘要翻译：传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。传感器模块可以被模制或者可以具有预成型的壳体。盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

2. 发明授权

US06804883B1 Method for producing a pressure sensor 有权
标题翻译：压力传感器的制造方法
公开(公告)号：US06804883B1
公开(公告)日：2004-10-19
申请号：US09603060
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01R4300
CPC分类号： B81C1/00333 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/49169 , Y10T29/49171 , Y10T29/49174 , Y10T29/49176 , H01L2924/00014
摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.
摘要翻译：一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。半导体压力传感器电连接到引线栅格的接触部分。引线格栅与半导体压力传感器一起插入注塑模具中。模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

3. 发明授权

US06661668B2 Housing and methods of producing a housing 失效
标题翻译：住房和生产住房的方法
公开(公告)号：US06661668B2
公开(公告)日：2003-12-09
申请号：US10031814
申请日：2002-05-31
申请人： Kurt Weiblen
发明人： Kurt Weiblen
IPC分类号： H05K506
CPC分类号： H05K5/063
摘要： A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.
摘要翻译：一种壳体，特别是电子部件用壳体，其包括由塑料制成并具有至少一个开口的壳体部分和用于封闭开口的盖部。提出盖部分是作为金属冲压部分制成的，盖部分的冲压边缘在盖部分的第一侧上具有冲孔脊，在与第一侧相对的第二侧具有冲头压痕，盖子部分经由第二侧被压入壳体部分的开口中，使得盖部分经由至少两个分布在盖部分的周边上的边缘部分并且咬合而抵靠开口的内壁的指定部分通过冲孔脊以倒钩状的方式进入内壁的指定部分。

4. 发明授权

US06300169B1 Method for manufacturing a pressure sensor 有权
标题翻译：制造压力传感器的方法
公开(公告)号：US06300169B1
公开(公告)日：2001-10-09
申请号：US09603082
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01L2144
CPC分类号： G01L19/143 , G01L19/141 , H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.
摘要翻译：在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开装配段由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在避免了将注射成型化合物完全渗透到间隙中。

5. 发明授权

US5723784A Flow rate meter 失效
标题翻译：流量计
公开(公告)号：US5723784A
公开(公告)日：1998-03-03
申请号：US676850
申请日：1996-07-08
申请人： Manfred Lembke , Josef Kleinhans , Hans Hecht , Helmut Bassler , Gerhard Hueftle , Alexander Kromer , Kurt Weiblen , Stefan Lehenberger , Guenther Frick , Klaus Reymann , Axel-Werner Haag , Dieter Tank , Uwe Konzelmann , Waldemar Guenther , Henninge Marberg
发明人： Manfred Lembke , Josef Kleinhans , Hans Hecht , Helmut Bassler , Gerhard Hueftle , Alexander Kromer , Kurt Weiblen , Stefan Lehenberger , Guenther Frick , Klaus Reymann , Axel-Werner Haag , Dieter Tank , Uwe Konzelmann , Waldemar Guenther , Henninge Marberg
IPC分类号： G01F1/68 , G01F1/684 , G01F1/692
CPC分类号： G01F1/6845 , G01F1/6842
摘要： The invention proposes a device for measuring the mass of a flowing medium, in particular the mass of air aspirated by internal combustion engines. The device has a platelike sensor element which is accommodated in a recess of a sensor carrier, and which with a sensor region that has at least one measuring resistor is exposed to the flowing medium in order to measure its mass. The sensor element is accommodated essentially flush in the recess and is retained in the recess by being glued to a bottom face in the recess. The bottom face of the recess of the sensor carrier has a troughlike indentation, which extends at least partially along the circumference of the sensor element outside the sensor region that has the at least one measuring resistor. The device according to the invention is intended to measure the mass of a flowing medium, in particular for measuring the mass of air aspirated by internal combustion engines.
摘要翻译：本发明提出了一种用于测量流动介质的质量的装置，特别是由内燃机吸入的空气的质量。该装置具有平板状传感器元件，其被容纳在传感器载体的凹部中，并且具有至少一个测量电阻器的传感器区域暴露于流动介质以便测量其质量。传感器元件基本上平齐地容纳在凹部中并且通过粘合到凹部中的底面而保持在凹部中。传感器载体的凹部的底面具有凹槽形凹陷，该凹槽至少部分地沿着传感器元件的圆周延伸到具有至少一个测量电阻器的传感器区域外部。根据本发明的装置旨在测量流动介质的质量，特别是用于测量由内燃机吸入的空气的质量。

6. 发明授权

US5525943A Electromagnetic compatibility filter utilizing inherently formed capacitance 失效
标题翻译：电磁兼容滤波器利用固有的电容
公开(公告)号：US5525943A
公开(公告)日：1996-06-11
申请号：US223071
申请日：1994-04-04
申请人： Walter Roethlingshoefer , Kurt Weiblen , Peter Tauber , Uwe Lipphardt
发明人： Walter Roethlingshoefer , Kurt Weiblen , Peter Tauber , Uwe Lipphardt
IPC分类号： H04B15/02 , H05K9/00 , H03H7/00
CPC分类号： H04B15/02
摘要： An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.
摘要翻译：用于混合技术电路部件的电磁兼容（EMC）滤波器，具有载流线路和接地导体，用于防止电磁干扰。载流线和接地导体布置在陶瓷板上。载流线由电介质覆盖，电介质又由与接地导体电接触的上金属屏蔽覆盖。下部金属屏幕布置在载流线下方的陶瓷板上，并与接地导体电接触。

7. 发明授权

US07585662B2 Container for an analysis chip 有权
标题翻译：容器用于分析芯片
公开(公告)号：US07585662B2
公开(公告)日：2009-09-08
申请号：US10477160
申请日：2002-03-27
申请人： Kurt Weiblen , Hubert Benzel
发明人： Kurt Weiblen , Hubert Benzel
IPC分类号： C12M1/34 , C12M3/00 , C12Q1/70
CPC分类号： B01L3/502715 , B01L9/52 , B01L2200/027 , B01L2200/0689 , B01L2300/045 , B01L2300/0636 , B01L2300/0877
摘要： A receptacle is provided for accommodating an analysis chip, which receptacle has openings in a housing having access to the analysis chip, which openings are protected from external influences by a movable protector, and for carrying out an analysis, a mechanism for moving the protector is provided such that an opening in the protector coincides with the receptacle openings.
摘要翻译：提供容纳分析芯片的插座，该插座在具有进入分析芯片的壳体中具有开口，该开口被可移动保护器保护免受外部影响，并且为了进行分析，用于移动保护器的机构是设置成使得保护器中的开口与容器开口重合。

8. 发明授权

US06778400B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06778400B2
公开(公告)日：2004-08-17
申请号：US10030994
申请日：2002-05-13
申请人： Juergen Kurle , Kurt Weiblen , Stefan Pinter , Frieder Haag
发明人： Juergen Kurle , Kurt Weiblen , Stefan Pinter , Frieder Haag
IPC分类号： H05K500
CPC分类号： H01R12/585 , H05K7/1417 , H05K7/142
摘要： An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board. To protect impact-sensitive and vibration-sensitive components, it is proposed to provide the contact elements, on a part of their length not inserted into the contact openings, with elastically deformable segments and to flexibly support the printed circuit board in the housing part by the contact element configured in this way, and, additionally, to connect it via damping elements at least indirectly to the housing part.
摘要翻译：一种电子设备，包括具有至少一个可闭合开口和一个插入部分的壳体部分，所述壳体部分容纳布置在其上的至少一个电气和/或电子部件的印刷电路板和电接触元件，其中电连接到插入部分，并且其在壳体内部中的彼此平行延伸并且沿至少一个开口的方向突出的端部，端部穿过印刷电路板的接触开口，并且是与印刷电路板导电连接。为了保护冲击敏感和振动敏感的部件，建议在其长度的一部分长度上未插入接触开口中的可弹性变形的部分提供接触元件，并且通过以下方式灵活地支撑外壳部件中的印刷电路板：以这种方式构造的接触元件，并且另外通过阻尼元件至少间接地连接到壳体部分。

9. 发明授权

US06711033B2 Sealed housing for an electronic device and the respective seal 失效
标题翻译：用于电子设备的密封外壳和相应的密封件
公开(公告)号：US06711033B2
公开(公告)日：2004-03-23
申请号：US10041352
申请日：2002-01-08
申请人： Kurt Weiblen , Frieder Haag
发明人： Kurt Weiblen , Frieder Haag
IPC分类号： H05K900
CPC分类号： H05K5/061
摘要： A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.
摘要翻译：一种用于电子设备的密封壳体具有壳体底部，其具有第一接触表面; 具有第二接触表面的壳体顶部; 所述壳体底部可连接到所述壳体顶部; 以及密封件，其可插入在壳体底部部分和壳体顶部部分之间，使得当壳体底部部分和壳体顶部部分接合时，该密封件接触第一接触表面和第二接触表面以形成密封。密封是连续盘的形式。

10. 发明授权

US5404753A Mass flow sensor 失效
标题翻译：质量流量传感器
公开(公告)号：US5404753A
公开(公告)日：1995-04-11
申请号：US69888
申请日：1993-06-01
申请人： Hans Hecht , Wolfgang Kienzle , Rudolf Sauer , Eckart Reihlen , Kurt Weiblen
发明人： Hans Hecht , Wolfgang Kienzle , Rudolf Sauer , Eckart Reihlen , Kurt Weiblen
IPC分类号： G01F1/68 , G01F1/684 , G01F1/688 , G01F1/692
CPC分类号： G01F1/6842 , G01F1/684 , G01F1/6845 , H01L2224/73265
摘要： A mass flow sensor detects the intensity of a media flow. The mass flow sensor includes a measurement chip, with a dielectric membrane and a frame of monocrystalline silicon. At least one heater is arranged on the membrane. The measurement chip is installed in the in-flow channel of a housing. By means of the structure of the housing, contamination of the measurement chip is reduced, thermal equalization with the media flow is improved, the resistance of the sensor to sudden pressure variations is increased, and the dielectric contacts are improved.
摘要翻译：质量流量传感器检测介质流的强度。质量流量传感器包括具有电介质膜和单晶硅框架的测量芯片。膜上至少设有一个加热器。测量芯片安装在外壳的流入通道中。通过壳体的结构，测量芯片的污染降低，与介质流的热平衡得到改善，传感器对突然压力变化的阻力增加，并且电介质触点得到改善。

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