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1. 发明授权

US07064403B2 Chip assembly in a premold housing 有权
标题翻译：芯片组装在预制外壳中
公开(公告)号：US07064403B2
公开(公告)日：2006-06-20
申请号：US10832534
申请日：2004-04-26
申请人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
发明人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
IPC分类号： H01L27/14 , G01J5/00
CPC分类号： H01L31/0203 , G01J5/12 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.
摘要翻译：本发明涉及一种用于检测红外范围内的入射辐射的装置，包括至少一个用于检测红外辐射的芯片组件，至少一个接合线，其从芯片组件开始并穿过金属端子延伸到外壳的外部以及以这种方式分布的钝化材料，使得至少一个接合线实质上被钝化材料完全包围，并且芯片组件的面对入射的红外辐射的表面区域不是由钝化材料包围。

2. 发明申请

US20050179102A1 Chip assembly in a premold housing 有权
标题翻译：芯片组装在预制外壳中
公开(公告)号：US20050179102A1
公开(公告)日：2005-08-18
申请号：US10832534
申请日：2004-04-26
申请人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
发明人： Kurt Weiblen , Michael Arndt , Ronny Ludwig
IPC分类号： G01J5/12 , H01L31/0203 , H01L31/0232
CPC分类号： H01L31/0203 , G01J5/12 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.
摘要翻译：本发明涉及一种用于检测红外范围内的入射辐射的装置，包括至少一个用于检测红外辐射的芯片组件，至少一个接合线，其从芯片组件开始并穿过金属端子延伸到外壳的外部以及以这种方式分布的钝化材料，使得至少一个接合线实质上被钝化材料完全包围，并且芯片组件的面对入射的红外辐射的表面区域不是由钝化材料包围。

3. 发明申请

US20090039267A1 Reflector module for a photometric gas sensor 审中-公开
标题翻译：用于光度气体传感器的反射器模块
公开(公告)号：US20090039267A1
公开(公告)日：2009-02-12
申请号：US11660121
申请日：2005-07-14
申请人： Michael Arndt , Gerd Lorenz , Johann Wehrmann , Ronny Ludwig , Hans Lubik , Thomas Sperlich , Vincent Thominet , Maximilian Sauer
发明人： Michael Arndt , Gerd Lorenz , Johann Wehrmann , Ronny Ludwig , Hans Lubik , Thomas Sperlich , Vincent Thominet , Maximilian Sauer
IPC分类号： G01J5/08
CPC分类号： G01N21/3504 , G01N21/0303
摘要： The invention relates to a photometric gas sensor containing at least an infrared radiation source; a first reflector for deflecting to a second reflector an infrared radiation coming from an infrared radiation source; a second reflector for deflecting to an infrared detector the radiation coming from the first reflector; and an infrared detector.
摘要翻译：本发明涉及一种至少含有红外线辐射源的测光气体传感器; 第一反射器，用于将来自红外辐射源的红外辐射偏转到第二反射器; 第二反射器，用于将来自第一反射器的辐射偏转到红外检测器; 和红外探测器。

4. 发明授权

US08904864B2 Electronic component and method for manufacturing the electronic component 有权
标题翻译：用于制造电子部件的电子部件和方法
公开(公告)号：US08904864B2
公开(公告)日：2014-12-09
申请号：US13376439
申请日：2010-04-23
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： G01P15/00 , H05K13/00 , H05K5/00 , G01D11/24
CPC分类号： H05K5/0095 , G01D11/245 , Y10T29/49002
摘要： AN electronic component includes at least one microcomponent which is contacted with, and fastened to, a support element. The support element includes a spring element which is configured for fastening the microcomponent, and the spring element is engaged in the support element with the aid of a detent in order to fasten the microcomponent to the support element.
摘要翻译：电子部件包括与支撑元件接触并紧固到支撑元件的至少一个微组件。支撑元件包括弹簧元件，弹簧元件被构造成用于紧固微元件，并且弹簧元件借助于止动件接合在支撑元件中，以将微元件紧固到支撑元件。

5. 发明申请

US20120161362A1 Method for Producing an Electronic Component 有权
标题翻译：生产电子元器件的方法
公开(公告)号：US20120161362A1
公开(公告)日：2012-06-28
申请号：US13381273
申请日：2010-04-30
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： B29C45/14
CPC分类号： H01L23/3135 , H01L21/565 , H01L2224/48137 , H01L2924/1433 , H01L2924/1461 , H01L2924/19105 , H01L2924/00
摘要： A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle.
摘要翻译：一种用于制造电子部件的方法包括：提供至少一个载体元件，该载体元件具有构造成用于接触至少一个微组件的微组件插座，在所述载体元件周围注射模制壳体，所述微组件插座位于所述外壳的空腔中，在至少一侧上，将微组件引入空腔中的微组件容器中以将微组件接触载体元件，并使用填充材料注入空腔，以将微组件固定在壳体和微组件容器中。

6. 发明授权

US07268351B2 Gas sensor module for the spectroscopic measurement of a gas concentration 有权
标题翻译：气体传感器模块，用于光谱测量气体浓度
公开(公告)号：US07268351B2
公开(公告)日：2007-09-11
申请号：US11113373
申请日：2005-04-21
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： G01N21/35
CPC分类号： G01N21/3504 , G01N21/05 , G01N2021/3185 , G01N2201/0228
摘要： A gas sensor module for the spectroscopic measurement of at least one gas concentration, including at least: a spectroscopic gas sensor having a sensor chip which has a micropatterned measuring structure, and having an IR-transparent cap chip covering the measuring structure; a premolded package having a package bottom and a package edge to which a cover having a screen opening provided above the measuring structure is attached; a filter chip provided between the cover and the cap chip; and a lead frame which is partially injected into the premolded package and has multiple leads that include connecting pins for contacting a substrate and contact pads which contact the contact pads of the gas sensor, the connecting pins being bent upward from the package edge. The gas sensor module is mountable by its connecting pins to a substrate in such a way that the measuring structure having the filter chip is positioned directly opposite a substrate opening. Compact dimensions of the finished sensor unit are achieved, while minimizing the production time and ensuring a high degree of radiation shielding.
摘要翻译：一种用于至少一种气体浓度的光谱测量的气体传感器模块，其至少包括：具有传感器芯片的分光气体传感器，所述传感器芯片具有微图案测量结构，并且具有覆盖所述测量结构的IR透明盖芯片; 具有封装底部和封装边缘的预成型封装，附接有设置在测量结构上方的具有筛网开口的盖; 设置在盖和盖芯片之间的过滤芯片; 以及引线框架，其部分地注入到预成型封装中并具有多个引线，其包括用于接触基板的连接引脚和与气体传感器的接触焊盘接触的接触焊盘，连接引脚从封装边缘向上弯曲。气体传感器模块可通过其连接销安装到基板上，使得具有过滤芯片的测量结构直接与基板开口相对。实现成品传感器单元的紧凑尺寸，同时最小化生产时间并确保高度的辐射屏蔽。

7. 发明授权

US07157707B2 Radiation detector, sensor module having a radiation detector, and method for manufacturing a radiation detector 有权
标题翻译：辐射检测器，具有放射线检测器的传感器模块和用于制造辐射探测器的方法
公开(公告)号：US07157707B2
公开(公告)日：2007-01-02
申请号：US11031480
申请日：2005-01-07
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： G01J5/00 , H01L35/28
CPC分类号： G01J5/12 , G01J5/10 , H01L2224/48247 , H01L2224/73265
摘要： A radiation detector, a method for manufacturing a radiation detector, and a sensor module having a radiation detector. The radiation detector may include a thermopile chip having a diaphragm, a first cavity formed underneath the diaphragm, a thermopile structure formed on the diaphragm and an absorber layer applied to the thermopile structure, a cover chip, which has a second cavity on its bottom and is attached to the thermopile chip in such a way that the diaphragm having the thermopile structure and the absorber layer is located between the first cavity and the second cavity and, a filter plate attached to the cover chip via an adhesive layer of a defined layer thickness for transmitting infrared radiation of a defined wavelength range. Spacer means, for example, spacers may be provided for the defined layer thickness.
摘要翻译：放射线检测器，辐射检测器的制造方法以及具有放射线检测器的传感器模块。放射线检测器可以包括具有膜片的热电堆芯片，形成在隔膜下方的第一空腔，形成在隔膜上的热电堆结构和施加到热电堆结构的吸收层，盖芯片，其底部具有第二腔，以这样的方式附接到热电堆芯片，使得具有热电堆结构和吸收层的隔膜位于第一腔和第二空腔之间，并且滤板通过限定层厚度的粘合剂层附接到盖芯片用于发射具有确定波长范围的红外辐射。间隔装置例如可以为限定的层厚度提供间隔物。

8. 发明申请

US20060071348A1 Increasing the adhesion of an adhesive connection in housings 有权
标题翻译：增加外壳中粘合剂连接的粘附力
公开(公告)号：US20060071348A1
公开(公告)日：2006-04-06
申请号：US11246747
申请日：2005-10-06
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： H01L23/48 , H01L23/24 , H01L23/02
CPC分类号： B81B7/0077 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/83385 , H01L2924/10158 , H01L2924/00014 , H01L2924/00
摘要： A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of the component and/or of the housing has depressions for receiving the bonding material. These depressions may be designed as grooves, for example.
摘要翻译：特别是使用柔性接合材料具有与微机械部件的不可分离接合的壳体。包括壳体和微机械部件的组合以及该组合的制造方法。部件和/或壳体的至少一部分具有用于接收接合材料的凹陷部。这些凹陷可以设计为凹槽，例如。

9. 发明申请

US20050136740A1 Premolded housing 审中-公开
标题翻译：预制住房
公开(公告)号：US20050136740A1
公开(公告)日：2005-06-23
申请号：US11016634
申请日：2004-12-17
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： H01L23/08 , G01D11/24 , H01L21/52 , H01L23/28 , H01L23/50 , H01R9/03 , H01R13/66 , H01R43/24
CPC分类号： H01R13/6683 , H01R43/24
摘要： A premolded housing for receiving a component. The housing includes a housing body made of a plastic material or molding compound material, a leadframe of metal, partially molded into the housing body, having a plurality of connector pins projecting from a connecting side of the housing body, for contacting a substrate, a die pad for receiving the component, and two side support areas connected to the die pad via direction-changing areas, the direction-changing areas projecting from housing body on opposite sides and side support areas being situated outside of the housing body, and side support areas and the connector pins extending in the same connecting direction for installation on the substrate. After the soldering tabs and the side support areas have been bent over, the premolded housing is mounted vertically on a substrate, for example a circuit board, and in particular receives a thermopile chip for a gas sensor.
摘要翻译：用于接收组件的预制外壳。壳体包括由塑料材料或模制复合材料制成的壳体，金属引线框架，部分地模制到壳体中，具有从壳体主体的连接侧突出的多个连接器销，用于接触基板，用于接收部件的管芯焊盘和通过方向转换区域连接到管芯焊盘的两个侧支撑区域，从壳体在相对侧突出的方向变化区域和位于壳体外侧的侧支撑区域，以及侧支撑件区域和连接器销在相同的连接方向上延伸以安装在基板上。在焊接片和侧支撑区域已经弯曲之后，预成型的壳体垂直地安装在基板（例如电路板）上，并且特别地接收用于气体传感器的热电堆芯片。

10. 发明授权

US08596120B2 Electronic sensor or sensor device, in particular an acceleration sensor, having a chip module mounted in a sensor housing 有权
标题翻译：具有安装在传感器壳体中的芯片模块的电子传感器或传感器装置，特别是加速度传感器
公开(公告)号：US08596120B2
公开(公告)日：2013-12-03
申请号：US12737657
申请日：2009-06-09
申请人： Ronny Ludwig
发明人： Ronny Ludwig
IPC分类号： G01P1/02
CPC分类号： G01P1/026 , G01D11/245 , H05K3/202 , H05K3/308 , H05K3/326 , H05K2201/1059
摘要： An electronic sensor has a sensor housing in which a chip module having a module housing is mounted. The module housing has terminal pins that protrude laterally outward, each having a tapering at its free end. In addition, at least one metallic bearer strip is provided that is fashioned, in a first end area, as a plug contact, and that has in a second end area for at least one terminal pin a respective spring-clamp contact point that forms a flexible press-in zone for the corresponding terminal pin.
摘要翻译：电子传感器具有安装有模块壳体的芯片模块的传感器外壳。模块壳体具有横向向外突出的端子销，每个端子在其自由端具有锥形。另外，提供了至少一个金属承载带，其在第一端部区域中形成为插头接触，并且在第二端部区域中具有用于至少一个端子销的相应的弹簧夹接触点，形成柔性压入区用于相应的端子销。

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