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    • 2. 发明授权
    • Apparatus and method for processing a semiconductor lead frame
    • 用于处理半导体引线框架的装置和方法
    • US4627159A
    • 1986-12-09
    • US656818
    • 1984-10-01
    • Kurt Waldner
    • Kurt Waldner
    • H01L21/00H01R43/00
    • H01L21/67144Y10T29/49121
    • Apparatus and a method for processing a semiconductor lead frame, such as deflashing a plurality of molded chip housings on the lead frame as they move along a predetermined path. A support has a pair of sides, and a track on each side respectively, one track guides lead frames upwardly in a first stack to a position laterally aligned with a die on a vertically movable die plate. The other track receives processed lead frames and allows the processed lead frames to be lowered in a second stack. A reciprocal shuttle member extending between said tracks strips off the uppermost lead frame from the first stack and moves it into a position beneath the die which is then lowered by a power device sequentially to process, i.e., deflash, the lead frame. Then, the die elevates, allowing the shuttle member to reverse so that it can pick up the top lead frame from the first stack to advance it along with the processed lead frame laterally, the processed lead frame being movable onto the second stack. The power device includes a tubular coil having an open end for receiving a magnetic core secured to the die plate. When a signal energizes the coil, a magnetic force attracts the core into the coil member, moving the die plate downwardly. A spring biases the die plate upwardly.
    • 用于处理半导体引线框架的装置和方法,例如当引线框架沿着预定路径移动时,将引线框架上的多个模制芯片外壳去屑。 支撑体分别具有一对侧面和轨道,一个轨道将引导框架在第一堆叠中向上引导到在垂直移动的模板上与模具横向对准的位置。 另一个轨道接收经处理的引线框架,并允许处理的引线框架在第二堆叠中降低。 在所述轨道之间延伸的往复梭子件从第一叠层剥离最上面的引线框架并将其移动到模具下方的位置,然后由功率器件依次降低以处理,即消除引线框架。 然后,模具升高,允许往复运动构件反向,使得其可以从第一堆叠拾起顶部引线框架,以使其与处理的引线框架横向前进,处理的引线框架可移动到第二堆叠上。 功率器件包括具有用于接收固定到模板的磁芯的开口端的管状线圈。 当信号激励线圈时,磁力将芯吸引到线圈构件中,使模板向下移动。 弹簧向上偏压模板。
    • 3. 发明授权
    • Semiconductor lead frame
    • 半导体引线框架
    • US4809054A
    • 1989-02-28
    • US889655
    • 1986-07-25
    • Kurt Waldner
    • Kurt Waldner
    • H01L23/495H01L23/48
    • H01L24/39H01L23/49503H01L23/49548H01L23/49562H01L2924/01006H01L2924/01033H01L2924/01082Y10T29/49121
    • A semiconductor lead frame suitable for making electronic components from semiconductor chips. The lead frame is of one-piece construction and is provided with a pair of spaced outer side strips and a plurality of spaced cross strips integral with and spanning the distance between the side strips. A plurality of pairs of pads are on the lead frame, there being a pair of spaced pads between each pair of adjacent cross strips. One of the pads of each pair is coupled to the outer ends of a pair of spaced, parallel legs which extend along the adjacent cross strips. The legs are bendable intermediate their ends sufficiently to cause the legs to become doubled upon themselves so that the pad coupled to the leg can be moved from an initial position generally spaced longitudinally from the corresponding other pad to a final position in overlying, spaced relationship to the other pad. A coating of solder applied to each pad, respectively, permits a semiconductor chip between the pads to be bonded to the pads when the lead frame is directed through a heating zone.
    • 适用于从半导体芯片制造电子部件的半导体引线框架。 引线框架是一体式结构,并且设置有一对间隔开的外侧条带和与侧条之间的距离成一体并跨越侧条之间的距离的多个间隔开的交叉条。 多个衬垫对在引线框架上,在每对相邻的横向条之间存在一对隔开的衬垫。 每对的一个垫片联接到一对间隔开的平行腿部的外端,其沿着相邻的横条延伸。 这些腿可以在它们的端部之间弯曲成足以使腿部自身变得双倍,使得联接到腿部的垫可以从与相应的其他垫片纵向间隔开的初始位置移动到与上面相隔的关系的最终位置 另一个垫。 分别施加到每个焊盘的焊料涂层允许当引线框架被引导通过加热区时,焊盘之间的半导体芯片被焊接到焊盘。
    • 4. 发明授权
    • Die apparatus having an electromagnetic drive
    • 具有电磁驱动的模具装置
    • US4703644A
    • 1987-11-03
    • US828154
    • 1986-02-10
    • Kurt Waldner
    • Kurt Waldner
    • B21D37/10B21J7/30B21J15/24B30B1/42
    • B30B1/42B21D37/10B21J15/24B21J7/30Y10S100/917Y10S72/707Y10T83/8765
    • Apparatus for mounting a pair of die members so that one die member can move toward and away from the other die member. The apparatus includes a pair of spaced die shoes for mounting respective die members and an electromagnetic unit for moving one of the die shoes toward the other die shoe. The electromagnetic unit includes a coil mounted on one of the die shoes and an armature mounted on the other die shoe, the electromagnet and the armature being between the die shoes. The armature is aligned with and partially extends into a recess in the central portion of the coil so that, when current flows through the coil, the armature is attracted to the coil and moves the other die shoe toward the one die shoe. A bias structure biases the other die shoe away from the one die shoe. Such bias structure can take the form of an air cylinder or a spring.
    • 用于安装一对模具构件的装置,使得一个模具构件能够朝向和远离另一个模具构件移动。 该装置包括一对分开的模具,用于安装相应的模具构件和用于将模具中的一个移动到另一模具的电磁单元。 电磁单元包括安装在模具之一上的线圈和安装在另一个模具靴上的电枢,电磁体和电枢位于模具之间。 电枢与线圈的中心部分对准并部分地延伸到凹部中,使得当电流流过线圈时,电枢被吸引到线圈并使另一个模具靴朝向一个模具靴移动。 偏置结构使另一个模具鞋离开一个模具鞋。 这种偏置结构可以采用气缸或弹簧的形式。
    • 5. 发明授权
    • Apparatus and method for forming die-cut articles from sheet material
    • 用于从片材形成冲切制品的装置和方法
    • US4681004A
    • 1987-07-21
    • US656612
    • 1984-10-01
    • Kurt Waldner
    • Kurt Waldner
    • B26F1/14B21D28/02B23D35/00B26D7/18B26F1/40B65H23/185
    • B26F1/40B23D35/008B26D7/1854B65H23/185Y10T83/094Y10T83/141Y10T83/2066Y10T83/2216Y10T83/4551Y10T83/8765Y10T83/9473
    • Apparatus and method for forming disks or other articles from flexible sheet material. The disks can be used, for example, as substrates of magnetic recording disks known as floppy disks. The apparatus includes an upper die plate shiftably mounted above a lower die plate and having a die thereon so that a strip of material moveable between the die plates can be sequentially die-cut to form the disks. The upper die plate has quick release latches attaching the upper die plate to a support so that, when the latches are retracted, the upper die plate can be quickly and easily removed from the apparatus to permit the die to be sharpened or replaced. The apparatus includes air delivery ports near the upper and lower die plates to direct air under pressure against a disk after it has been die-cut from the strip so that the disk will be moved laterally and into a chute and onto a spindle which receives a stack of the disks. The strip is incrementally unwound from a roll and forms a low-tension loop near the entry point between the upper and lower die plates. The loop is controlled by an electric eye device which senses the presence or absence of the loop. A pair of adjacent pressure rollers receive and frictionally engage the strip near the opposite end of the apparatus to incrementally pull the strip past the die plate. A timing device controls the advancement of the strip, the lowering of the upper die plate, and the blowing of air against the disks after they are die-cut.
    • 用于从柔性片材形成盘或其它制品的装置和方法。 磁盘可以用作例如称为软盘的磁记录盘的基板。 该装置包括可移动地安装在下模板上并具有模具的上模板,使得可在模板之间移动的材料条可以被顺序地模切以形成盘。 上模板具有将上模板附接到支撑件的快速释放闩锁,使得当闩锁缩回时,上模板可以快速且容易地从装置移除,以允许模具被削尖或更换。 该装置包括在上模板和下模板附近的空气输送端口,以将空气压在压板上以将其从带材中切割出来之后将空气引导到盘上,使得盘将被横向移动并进入滑槽并接收到主轴上, 堆栈的磁盘。 该带从辊逐渐展开,并在上模和下模板之间的入口附近形成低压环。 环路由电眼装置控制,该装置检测环路的存在或不存在。 一对相邻的压力辊接收并摩擦地接合设备的相对端附近的条带,以递增地将带材拉过模板。 定时装置控制条带的推进,上模板的降低,以及在它们被切割之后将空气吹向盘。
    • 6. 发明授权
    • Tool and method for welding to IC frames
    • 焊接到IC框架的工具和方法
    • US06717247B1
    • 2004-04-06
    • US10190826
    • 2002-07-05
    • Kurt Waldner
    • Kurt Waldner
    • H01L2302
    • H01L21/4842H01L21/565H01L23/3135H01L2924/0002H01L2924/00
    • A device for forming an encapsulated end of a wire bonded to a metal surface. The device includes a clamp being an end surface of a bar is pressed against a surface of a plate. The end surface has a ridge formed around its edge. Therefore, when a clamping force is applied to the bar against the plate, the metal sheet clamped between the plate surface and end surface of the bar, the clamping force is concentrated at an interface between the metal surface and ridge. When encapsulate is injected into the contact region, the ridge prevents contaminating material from migrating over interface between bar and plate where the welding step is to be performed. The bar is then withdrawn leaving a tunnel through which the wire is positioned with the end of the wire in contact bondable to the clean surface of metal. The wire is positioned in the tunnel and bonded to the metal surface.
    • 一种用于形成接合到金属表面的引线的封装端的装置。 该装置包括一个将棒的端面压靠在板的表面上的夹具。 端面具有围绕其边缘形成的脊。 因此,当将夹持力施加到杆抵靠板时,金属片夹在板表面和杆的端面之间,夹紧力集中在金属表面和脊之间的界面处。 当封装被注入到接触区域中时,脊防止污染物质在要进行焊接步骤的棒和板之间的界面上迁移。 然后退出钢条,留下一条隧道,电线定位在该隧道内,电线的端部与金属的清洁表面接触。 电线定位在隧道内并与金属表面结合。
    • 7. 发明授权
    • Telescopic nozzle for an air gun with safe pressure release
    • 用于安全压力释放的气枪的伸缩喷嘴
    • US06283340B1
    • 2001-09-04
    • US09442050
    • 1999-11-16
    • Kurt Waldner
    • Kurt Waldner
    • B67D506
    • B05B1/005B05B15/656
    • A telescopic extendable nozzle attachable to a pressurized source of gas. The nozzle permits blowing out otherwise inaccessible crannies with the nozzle extended or providing a blast of air over a wide area as required. An anchor section of the nozzle has an exit end connect connected to the entrance end of the telescoping section and an entrance end of the anchor section is connected to the exit end of the source. The anchor section has a passageway escape for gas that prevents sudden build up of pressure when the exit end of the nozzle is inadvertently obstructed. In one embodiment, the anchor section comprises an outer sleeve slidably mounted on an inner sleeve, both sleeves having apertures providing an adjustable passageway. A plug is positioned inside the inner sleeve and has a central bore for passing gas through the nozzle and a plurality of planet bores that provide relief from excessive pressure such as when the nozzle is inadvertently and suddenly stopped up.
    • 可伸缩的可伸缩喷嘴,可连接到加压气体源。 喷嘴允许吹出其他不可接近的喷嘴,喷嘴延伸或在需要时在广泛的区域提供空气。 喷嘴的锚固部分具有连接到伸缩部分的入口端的出口端连接部,并且锚固部分的入口端连接到源的出口端。 锚定部分具有用于气体的通道逃逸,当喷嘴的出口端无意中被阻塞时,防止突然的压力增加。 在一个实施例中,锚固部分包括可滑动地安装在内部套筒上的外部套筒,两个套筒具有提供可调节通道的孔。 塞子位于内套筒的内部,并且具有用于使气体通过喷嘴的中心孔和多个行星孔,其提供避免过度压力的行星孔,例如当喷嘴无意中突然停止时。
    • 8. 发明授权
    • Die apparatus
    • 模具设备
    • US4926677A
    • 1990-05-22
    • US128291
    • 1987-12-03
    • Kurt Waldner
    • Kurt Waldner
    • H01L21/00
    • H01L21/67144Y10S100/917Y10S72/707Y10T83/8765
    • Apparatus and a method for processing work pieces, such as semiconductor lead frames, wherein the apparatus includes a power device such as a solenoid assembly, for driving an upper die into processing relationship to a work piece on a lower die with the stroke of the power device being relatively short, such as in the range of 0 to 0.375 inch. This is achieved by providing a second power device, such as a piston and cylinder assembly, in which the piston rod of the assembly raises the upper die high enough to allow clearance between the dies for the passage of the work piece between the dies, then the second power device is allowed to lower relatively slowly until the upper die is substantially in proximity to the work piece. When this occurs, the first power device is ready to be actuated and, when so actuated, moves a relatively short distance during the power stroke to process the work piece between the dies with a minimum of noise because of the greatly reduced distance of travel of the power device during the power stroke. In this way, the apparatus is more effectively used in the presence of one or more workmen so that there will be no injury to their hearing because of the greatly reduced noise levels associated with the improved die apparatus of the present invention.
    • 用于处理诸如半导体引线框架的工件的装置和方法,其中该装置包括诸如螺线管组件的功率装置,用于通过电力行程驱动上模与下模上的工件的处理关系 装置相对较短,例如在0至0.375英寸的范围内。 这通过提供第二动力装置(例如活塞和气缸组件)来实现,其中组件的活塞杆将上模具升高到​​足以允许模具之间的间隙以使工件在模具之间通过,然后 允许第二功率器件相对缓慢地下降,直到上模具基本上接近工件。 当这种情况发生时,第一功率器件准备被致动,并且当被致动时,在功率冲程期间移动相对较短的距离,以最小的噪声来处理模具之间的工件,因为大大减小了 动力设备在动力冲程期间。 以这种方式,在一个或多个工人的存在下,更有效地使用该装置,使得由于与本发明的改进的模具装置相关联的大大降低的噪声水平,不会对其听力造成伤害。