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    • 1. 发明申请
    • Methods of forming threshold voltage implant regions
    • 形成阈值电压注入区域的方法
    • US20060199341A1
    • 2006-09-07
    • US11406893
    • 2006-04-18
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • H01L21/336
    • H01L21/26513H01L21/324H01L21/823412H01L27/0811H01L27/088H01L29/66537H01L29/7833
    • The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.
    • 本发明包括同时形成两个晶体管器件的沟道区域植入物的方法,其中掩模用于阻挡相对于另一个器件之一的较大百分比的沟道区域位置。 本发明还涉及形成电容器结构的方法,其中第一电容器电极通过电介质材料与半导体衬底隔开,第二电容器电极包括半导体材料内的导电掺杂扩散区,电容器通道区位置为 在介电材料的下方并与导电掺杂的扩散区相邻。 形成注入掩模以仅覆盖电容器沟道区位置的第一部分并且留下未覆盖的电容器沟道区位置的第二部分。 当植入掩模就位时,掺杂剂被注入到电容器通道区域位置的未覆盖的第二部分中。
    • 10. 发明申请
    • Methods of implanting dopant into channel regions
    • 将掺杂剂注入通道区域的方法
    • US20060199340A1
    • 2006-09-07
    • US11406863
    • 2006-04-18
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • Hongmei WangKurt BeigelFred FishburnRongsheng Yang
    • H01L21/336
    • H01L21/26513H01L21/324H01L21/823412H01L27/0811H01L27/088H01L29/66537H01L29/7833
    • The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.
    • 本发明包括同时形成两个晶体管器件的沟道区域植入物的方法,其中掩模用于阻挡相对于另一个器件之一的较大百分比的沟道区域位置。 本发明还涉及形成电容器结构的方法,其中第一电容器电极通过电介质材料与半导体衬底隔开,第二电容器电极包括半导体材料内的导电掺杂扩散区,电容器通道区位置为 在介电材料的下方并与导电掺杂的扩散区相邻。 形成注入掩模以仅覆盖电容器沟道区位置的第一部分并且留下未覆盖的电容器沟道区位置的第二部分。 当植入掩模就位时,掺杂剂被注入到电容器通道区域位置的未覆盖的第二部分中。