专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07187066B2 Radiant energy heating for die attach 失效
标题翻译：辐射能量加热用于芯片附着
公开(公告)号：US07187066B2
公开(公告)日：2007-03-06
申请号：US10947515
申请日：2004-09-22
申请人： Kristopher J. Frutschy
发明人： Kristopher J. Frutschy
IPC分类号： H01L23/02 , H01L23/06 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/563 , H01L24/10 , H01L24/13 , H01L24/97 , H01L2224/0554 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/7598 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81224 , H01L2224/8123 , H01L2224/81801 , H01L2224/83192 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
摘要翻译：描述了通过在芯片背面引导辐射能而基本上防止下一级封装的照射来将芯片附接到下一级封装的方法和系统。

2. 发明授权

US07691671B2 Radiant energy heating for die attach 失效
标题翻译：辐射能量加热用于芯片附着
公开(公告)号：US07691671B2
公开(公告)日：2010-04-06
申请号：US11590163
申请日：2006-10-30
申请人： Kristopher J. Frutschy
发明人： Kristopher J. Frutschy
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/563 , H01L24/10 , H01L24/13 , H01L24/97 , H01L2224/0554 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/7598 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81224 , H01L2224/8123 , H01L2224/81801 , H01L2224/83192 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
摘要翻译：描述了通过在芯片背面引导辐射能而基本上防止下一级封装的照射来将芯片附接到下一级封装的方法和系统。

3. 发明授权

US07064004B2 Induction-based heating for chip attach 失效
标题翻译：基于感应加热芯片连接
公开(公告)号：US07064004B2
公开(公告)日：2006-06-20
申请号：US10748344
申请日：2003-12-29
申请人： Kristopher J. Frutschy
发明人： Kristopher J. Frutschy
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/46
CPC分类号： H01L24/81 , H01L2224/13147 , H01L2224/75 , H01L2224/7525 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/19042 , H01L2924/00
摘要： A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using induction heating to form the bond.
摘要翻译：描述将半导体管芯接合到衬底的方法。该方法包括以适当的配置布置半导体管芯，互连件和衬底，并且使用感应加热来形成接合。

4. 发明授权

US07585693B2 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method 失效
标题翻译：使用模具和衬底差分扩展的控制形成微电子封装的方法以及根据该方法形成的微电子封装
公开(公告)号：US07585693B2
公开(公告)日：2009-09-08
申请号：US11395102
申请日：2006-03-31
申请人： Kristopher J. Frutschy , Sudarshan V. Rangaraj , Kevin B. George
发明人： Kristopher J. Frutschy , Sudarshan V. Rangaraj , Kevin B. George
IPC分类号： H01L21/00
CPC分类号： H05K3/3494 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81054 , H01L2224/81209 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01044 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H05K3/3436 , H05K2203/1121 , H01L2924/00 , H01L2924/3512
摘要： Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.
摘要翻译：使用管芯和衬底差分扩展的控制形成微电子封装的方法。该方法包括：提供包括基板，设置在基板上的管芯和设置在管芯和基板之间的多个焊膏的管芯基板组合; 通过将模具 - 基板组合暴露于包括加热模具 - 基板组合以液化焊膏的温度变化，以及冷却模具 - 基板组合直到焊膏固化形成焊点以产生封装，来回流焊膏; 以及至少在冷却期间控制模具和基材的膨胀以减轻模头和基板之间的体积应变的相对差异。控制可以包括至少在冷却期间使模具 - 基板组合暴露于压力变化。

5. 发明授权

US07131850B2 Socket for a microelectronic component having reduced electrical resistance and inductance 有权
标题翻译：用于具有降低的电阻和电感的微电子部件的插座
公开(公告)号：US07131850B2
公开(公告)日：2006-11-07
申请号：US10630583
申请日：2003-07-29
申请人： Kristopher J. Frutschy
发明人： Kristopher J. Frutschy
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , H01R12/523 , H01R12/585
摘要： A socket for a microelectronic component is provided. The socket has a base with metal power and ground layers, and further includes a plurality of electrically conductive socket members, some of which are connected in parallel to the metal power layer, others being connected in parallel to the metal ground layer, while others are insulated from both the metal power and ground layers for purposes of providing signals. Each electrically conductive socket member has a protrusion that breaks through an inner insulating layer that defines an opening into which the electrically conductive socket member is inserted. The protrusions are at different heights, so that some of the protrusions make contact with the metal power layer, while others are connected to the metal ground layer or to a dielectric core layer.
摘要翻译：提供了一种用于微电子部件的插座。插座具有带有金属电源和接地层的底座，并且还包括多个导电插座构件，其中一些导电插座构件与金属功率层平行地连接，而另一些与金属接地层并联连接，而另一些与金属电源和接地层绝缘，以提供信号。每个导电插座构件具有突出部，该突起突破限定了插入导电插座构件的开口的内部绝缘层。突起处于不同的高度，使得一些突起与金属功率层接触，而其它突起与金属接地层或介电芯层连接。

6. 发明授权

US06221459B1 Controlling the heat expansion of electrical couplings 有权
标题翻译：控制电气联轴器的热膨胀
公开(公告)号：US06221459B1
公开(公告)日：2001-04-24
申请号：US09201537
申请日：1998-11-30
申请人： Gregory A. James , Kristopher J. Frutschy , Larry L. Moresco
发明人： Gregory A. James , Kristopher J. Frutschy , Larry L. Moresco
IPC分类号： H01R1214
CPC分类号： H01R12/57 , H05K1/0271 , H05K3/3436 , H05K2201/068 , H05K2201/10325 , H05K2201/10416 , H05K2201/10734 , Y10T428/24058 , Y10T428/24132 , Y10T428/249924 , Y10T442/109 , Y10T442/124 , Y10T442/131
摘要： A coupling such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket may differentially expand relative to a printed circuit board. By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.
摘要翻译：诸如插座的联接器可将一个电子设备耦合到另一个，并且可以减少两个耦合设备之间的差分热膨胀。例如，表面安装插座可以相对于印刷电路板差异地扩展。通过结合具有与印刷电路板的热膨胀系数匹配的热膨胀系数的结构，可以减小差分热膨胀，并且可能降低机械损伤的可能性。

7. 发明授权

US07209026B2 Integrated package inductor for integrated circuit devices 有权
标题翻译：用于集成电路器件的集成封装电感
公开(公告)号：US07209026B2
公开(公告)日：2007-04-24
申请号：US10932396
申请日：2004-09-01
申请人： Kristopher J. Frutschy , Udbhava A. Shrivastava
发明人： Kristopher J. Frutschy , Udbhava A. Shrivastava
IPC分类号： H01F5/00
CPC分类号： H01L21/4857 , H01F17/0006 , H01F17/045 , H01F27/027 , H01L23/49822 , H01L23/66 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/165 , H01L2224/0401
摘要： Provided are methods and devices in which an inductor is embedded in a package adapted to carry an integrated circuit and a magnetically permeable material is also embedded in the package so that the inductor and the magnetically permeable material are magnetically coupled to each other. In one embodiment, the magnetic permeable material is shaped as a pin which is press-fit into the core of a helix-shaped inductor embedded in the package substrate.
摘要翻译：提供了一种方法和装置，其中电感器嵌入在适于承载集成电路的封装中，并且导磁材料也嵌入封装中，使得电感器和导磁材料彼此磁耦合。在一个实施例中，磁性可渗透材料成形为压入配合到嵌入在封装衬底中的螺旋形电感器的芯的引脚。

8. 发明授权

US06535386B2 Electronic assembly having a heat pipe that conducts heat from a semiconductor die 有权
公开(公告)号：US06535386B2
公开(公告)日：2003-03-18
申请号：US09730621
申请日：2000-12-05
申请人： Ajit V. Sathe , Michael J. Witherspoon , Ravi S. Prasher , Kristopher J. Frutschy
发明人： Ajit V. Sathe , Michael J. Witherspoon , Ravi S. Prasher , Kristopher J. Frutschy
IPC分类号： H05K720
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式