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1. 发明授权

US06221459B1 Controlling the heat expansion of electrical couplings 有权
标题翻译：控制电气联轴器的热膨胀
公开(公告)号：US06221459B1
公开(公告)日：2001-04-24
申请号：US09201537
申请日：1998-11-30
申请人： Gregory A. James , Kristopher J. Frutschy , Larry L. Moresco
发明人： Gregory A. James , Kristopher J. Frutschy , Larry L. Moresco
IPC分类号： H01R1214
CPC分类号： H01R12/57 , H05K1/0271 , H05K3/3436 , H05K2201/068 , H05K2201/10325 , H05K2201/10416 , H05K2201/10734 , Y10T428/24058 , Y10T428/24132 , Y10T428/249924 , Y10T442/109 , Y10T442/124 , Y10T442/131
摘要： A coupling such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket may differentially expand relative to a printed circuit board. By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.
摘要翻译：诸如插座的联接器可将一个电子设备耦合到另一个，并且可以减少两个耦合设备之间的差分热膨胀。例如，表面安装插座可以相对于印刷电路板差异地扩展。通过结合具有与印刷电路板的热膨胀系数匹配的热膨胀系数的结构，可以减小差分热膨胀，并且可能降低机械损伤的可能性。

2. 发明授权

US06798076B2 Method and apparatus for encoding information in an IC package 失效
标题翻译：用于对IC封装中的信息进行编码的方法和装置
公开(公告)号：US06798076B2
公开(公告)日：2004-09-28
申请号：US09470092
申请日：1999-12-21
申请人： John W. Horigan , Larry L. Moresco
发明人： John W. Horigan , Larry L. Moresco
IPC分类号： H01L2348
CPC分类号： H05K1/0266 , H01L23/544 , H01L2223/5444 , H01L2223/54473 , H01L2224/16 , H01L2924/01004 , H05K1/029 , H05K3/3436 , H05K2201/10734
摘要： An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.
摘要翻译：集成电路（IC）封装包括衬底，接地线和编码区域。编码区域基于电耦合到地线的焊球的选择性沉积提供信息。

3. 发明授权

US06324436B1 Method for optimizing cost of manufacturing memory arrays 有权
标题翻译：优化制造存储阵列成本的方法
公开(公告)号：US06324436B1
公开(公告)日：2001-11-27
申请号：US09152739
申请日：1998-09-14
申请人： Larry L. Moresco
发明人： Larry L. Moresco
IPC分类号： G05B1302
CPC分类号： G06Q10/04 , G06F17/50 , G06F2217/40
摘要： A method of determining the most cost effective manner in which to provide a given number of memory or logic gates for a particular application. The method takes into consideration both the cost per memory bit of fabricating memory cells on a semiconductor chip as a function of the number of memory cells on the chip (i.e, the chip size), and the costs of assembling multiple memory chips into a larger memory device using different assembly and packaging configurations. By considering the fabrication and packaging costs together, the most economically efficient combination of memory chip size and packaging method to produce a desired memory capacity can be determined.
摘要翻译：确定为特定应用提供给定数量的存储器或逻辑门的最具成本效益的方式。该方法考虑了半导体芯片上制造存储器单元的每个存储器单元的成本作为芯片上的存储单元数量（即，芯片尺寸）的函数，以及将多个存储器芯片组装成更大的成本存储器件使用不同的组装和封装配置。通过一起考虑制造和封装成本，可以确定产生期望的存储容量的最经济有效的存储器芯片尺寸和封装方法的组合。

4. 发明申请

US20130301213A1 METHOD AND AN APPARATUS FOR COOLING A COMPUTER 审中-公开
公开(公告)号：US20130301213A1
公开(公告)日：2013-11-14
申请号：US13945755
申请日：2013-07-18
申请人： Borys S. Senyk , Larry L. Moresco
发明人： Borys S. Senyk , Larry L. Moresco
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

5. 发明授权

US6026895A Flexible foil finned heatsink structure and method of making same 失效
标题翻译：柔性箔翅片散热器结构及其制作方法
公开(公告)号：US6026895A
公开(公告)日：2000-02-22
申请号：US20052
申请日：1998-02-06
申请人： Larry L. Moresco , Vivek Mansingh
发明人： Larry L. Moresco , Vivek Mansingh
IPC分类号： F28F3/02 , H01L23/367 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28F3/02 , H01L23/3672 , H01L23/3677 , F28F2215/00 , H01L2924/0002
摘要： Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.
摘要翻译：公开了用于集成电路芯片，芯片封装，印刷电路板等的散热结构。根据本发明的散热器结构具有在冷却流体的流动下移动和振动的薄柔性冷却片。在一个实施例中，翅片包括层压到薄聚合物层上的薄金属膜，例如铜或铝。聚合物层为金属膜和冷却片提供弹性和弹性。

6. 发明授权

US5426563A Three-dimensional multichip module 失效
标题翻译：三维多芯片模块
公开(公告)号：US5426563A
公开(公告)日：1995-06-20
申请号：US157332
申请日：1993-11-22
申请人： Larry L. Moresco , David A. Horine , Wen-Chou V. Wang
发明人： Larry L. Moresco , David A. Horine , Wen-Chou V. Wang
IPC分类号： H01L21/48 , H01L23/473 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/065 , H05K1/14 , H05K7/20
CPC分类号： H01L23/4985 , H01L21/486 , H01L23/473 , H01L23/49827 , H01L23/49838 , H01L23/5385 , H01L23/66 , H01L25/0652 , H05K1/144 , H01L2224/16 , H01L2924/00013 , H01L2924/01019 , H01L2924/01078 , H01L2924/3011 , Y10T29/49126
摘要： A three dimensional module for housing a plurality of integrated circuit chips is shown. The IC chips are mounted in rows on a plurality of substrates. Parallel to each row are communications bars which provide signal paths allowing chips on one substrate to communicate with those on another substrate. The communications bars also serve as spacers between substrates, thereby forming cooling channels. The IC chips are disposed in the cooling channels so that they come into direct contact with the cooling fluid. Signal lines to and from the IC chips are kept as separated as possible from the power lines so as to minimize noise. To this end, relatively thick power supply straps are mounted to each substrate below each row of IC chips. The power supply straps are, in turn, connected to power feed straps such that a very low impedance power supply path to the IC chips is maintained. The overall design of the three dimensional structure of the present invention is highly modular to facilitate high yield fabrication and repair.
摘要翻译：示出了用于容纳多个集成电路芯片的三维模块。 IC芯片以多个基板的方式安装。平行于每行是提供信号路径的通信条，允许一个基板上的芯片与另一个基板上的芯片通信。通信条也用作衬底之间的间隔物，从而形成冷却通道。 IC芯片设置在冷却通道中，使得它们与冷却流体直接接触。来往于IC芯片的信号线保持尽可能与电源线分开，以使噪声最小化。为此，相对较厚的电源带安装到每行IC芯片下方的每个基板。电源带又连接到馈电带，使得保持到IC芯片的非常低的阻抗电源路径。本发明的三维结构的总体设计是高度模块化的，以便于高产量的制造和修理。

7. 发明授权

US08016023B2 Method and an apparatus for cooling a computer 有权
标题翻译：用于冷却计算机的方法和装置
公开(公告)号：US08016023B2
公开(公告)日：2011-09-13
申请号：US12372660
申请日：2009-02-17
申请人： Borys S. Senyk , Larry L. Moresco
发明人： Borys S. Senyk , Larry L. Moresco
IPC分类号： B60H1/00 , F28F7/00 , F28D15/00
CPC分类号： G06F1/203 , G06F2200/201
摘要： A method including sensing a temperature of an electronic component in a portable computing device; circulating a fluid between one of a first heat transfer plate and a second heat transfer plate in response to a threshold temperature being sensed; and stopping the circulating in response to sensing a temperature is below the threshold temperature. A heat exchanging system including a first heat transfer plate coupled to an electronic component and to a second heat transfer plate; and a fluid for circulating through one of the first heat transfer plate and the second heat transfer plate in response to a threshold temperature being sensed by a sensor. An apparatus including a heat generating element; a first heat transfer plate coupled to the heat generating element; a second heat transfer plate; and a fluid for circulating through a tube, the first part and the second part of the portable computing device in response to a threshold temperature being sensed by a sensor.
摘要翻译：一种包括感测便携式计算设备中的电子部件的温度的方法; 响应于感测到的阈值温度，在第一传热板和第二传热板之一之间循环流体; 并且响应于感测温度停止循环低于阈值温度。一种热交换系统，包括耦合到电子部件和第二传热板的第一传热板; 以及用于响应于由传感器感测到的阈值温度而循环通过第一传热板和第二传热板之一的流体。一种包括发热元件的设备; 耦合到所述发热元件的第一传热板; 第二传热板; 以及用于响应于传感器感测到的阈值温度而通过管，便携式计算设备的第一部分和第二部分循环的流体。

8. 发明申请

US20090145579A1 METHOD AND AN APPARATUS FOR COOLING A COMPUTER 有权
标题翻译：用于冷却计算机的方法和装置
公开(公告)号：US20090145579A1
公开(公告)日：2009-06-11
申请号：US12372660
申请日：2009-02-17
申请人： BORYS S. SENYK , Larry L. Moresco
发明人： BORYS S. SENYK , Larry L. Moresco
IPC分类号： F28F7/00
CPC分类号： G06F1/203 , G06F2200/201
摘要： A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.
摘要翻译：一种热交换系统，包括通过耦合到计算设备的第一部分中的电子部件的管和循环流体到计算设备的第二部分中的传热板。

9. 发明授权

US06535398B1 Multichip module substrates with buried discrete capacitors and components and methods for making 有权
标题翻译：具有埋入式分立电容器和组件的多芯片模块基板和制造方法
公开(公告)号：US06535398B1
公开(公告)日：2003-03-18
申请号：US09519713
申请日：2000-03-07
申请人： Larry L. Moresco
发明人： Larry L. Moresco
IPC分类号： H05K706
CPC分类号： H05K1/185 , H01L23/50 , H01L23/5385 , H01L2224/16 , H01L2924/01078 , H01L2924/10253 , H01L2924/15192 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H05K1/023 , H05K3/4644 , H01L2924/00
摘要： Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate, preferably in a regular pattern. Power supply substrates are preferably attached to the base substrate along with the miniature substrates. All of the attached components are preferably pretested and have thicknesses close to one another. The pretesting substantially increases the manufacturing yield. Gaps between the miniature substrates and power supply substrates are filled with a polymer material, such as a powder-filled polyimide precursor. Thereafter, dielectric layer is formed over the components to provide a more planar surface. The dielectric layer is preferably planarized, such as by a chemical mechanical polishing process, to provide for a more planar layer. Thereafter, a plurality of interleaving metal and dielectric layers are formed over the assembled components to provide power distribution planes and signal lines.
摘要翻译：公开了模块化构造的多芯片模块。多个微型电容器基板和/或微型电阻器基板组装并附接到基底，优选地以规则的图案。电源基板优选地与微型基板一起附接到基底基板。所有附着的组分优选是预先测试的并且具有彼此接近的厚度。预测试大大提高了制造产量。微型基板和电源基板之间的间隙填充有聚合物材料，例如粉末填充的聚酰亚胺前体。此后，在部件上形成电介质层以提供更平的表面。电介质层优选地通过化学机械抛光工艺进行平面化，以提供更平坦的层。此后，在组装的组件上形成多个交错金属和电介质层，以提供配电面和信号线。

10. 发明授权

US06223814B1 Flexible foil finned heatsink structure and method of making same 失效
标题翻译：柔性箔翅片散热器结构及其制作方法
公开(公告)号：US06223814B1
公开(公告)日：2001-05-01
申请号：US09491235
申请日：2000-01-25
申请人： Larry L. Moresco , Vivek Mansingh
发明人： Larry L. Moresco , Vivek Mansingh
IPC分类号： H05K720
CPC分类号： H01L23/467 , F28F3/02 , F28F2215/00 , H01L23/3672 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.
摘要翻译：公开了用于集成电路芯片，芯片封装，印刷电路板等的散热结构。根据本发明的散热器结构具有在冷却流体的流动下移动和振动的薄柔性冷却片。在一个实施例中，翅片包括层压到薄聚合物层上的薄金属膜，例如铜或铝。聚合物层为金属膜和冷却片提供弹性和弹性。

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