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1. 发明授权

US06535386B2 Electronic assembly having a heat pipe that conducts heat from a semiconductor die 有权
公开(公告)号：US06535386B2
公开(公告)日：2003-03-18
申请号：US09730621
申请日：2000-12-05
申请人： Ajit V. Sathe , Michael J. Witherspoon , Ravi S. Prasher , Kristopher J. Frutschy
发明人： Ajit V. Sathe , Michael J. Witherspoon , Ravi S. Prasher , Kristopher J. Frutschy
IPC分类号： H05K720
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

2. 发明授权

US07104313B2 Apparatus for using fluid laden with nanoparticles for application in electronic cooling 失效
标题翻译：使用载有纳米颗粒的流体用于电子冷却的装置
公开(公告)号：US07104313B2
公开(公告)日：2006-09-12
申请号：US10750722
申请日：2003-12-31
申请人： Himanshu Pokharna , Rajiv K. Mongia , Ravi S. Prasher , Sridhar V. Machiroutu , Je-Young Chang , John W. Horigan
发明人： Himanshu Pokharna , Rajiv K. Mongia , Ravi S. Prasher , Sridhar V. Machiroutu , Je-Young Chang , John W. Horigan
IPC分类号： F28D15/00 , C09K5/00 , F28F7/00
CPC分类号： H02K44/04 , F28D15/00 , F28F23/00 , H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.
摘要翻译：描述了一种使用载有纳米颗粒的液体用于电子冷却的装置。在一个实施例中，电磁泵用于使载有纳米颗粒的流体循环。

3. 发明授权

US07031159B2 Parallel heat exchanger for a component in a mobile system 有权
标题翻译：用于移动系统中组件的平行热交换器
公开(公告)号：US07031159B2
公开(公告)日：2006-04-18
申请号：US11070700
申请日：2005-03-01
申请人： Eric DiStefano , Ravi S. Prasher , Himanshu Pokharna
发明人： Eric DiStefano , Ravi S. Prasher , Himanshu Pokharna
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.
摘要翻译：公开了一种使用平行热交换器来分散来自移动计算系统的热量的系统和方法。在一个可能的实施例中，多个热交换器热耦合到热附接平台。多个远程热交换器可以使用每个远程热交换器的热管或用于所有远程热交换器的单个热管热耦合到热附接平台。在一个实施例中，热连接平台可以是铜块或热管室。空气循环单元可以与每个远程热交换器相邻地连接。直接连接热交换器可以直接连接到热连接平台。诸如风扇的空气循环单元可以垂直或水平地联接在直接附接热交换器附近。

4. 发明授权

US07071552B2 IC die with directly bonded liquid cooling device 失效
标题翻译： IC模具具有直接粘合的液体冷却装置
公开(公告)号：US07071552B2
公开(公告)日：2006-07-04
申请号：US10813187
申请日：2004-03-29
申请人： Kramadhati V. Ravi , Ravi S. Prasher , Gregory M. Chrysler
发明人： Kramadhati V. Ravi , Ravi S. Prasher , Gregory M. Chrysler
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.
摘要翻译：一种装置包括具有由第一半导体材料形成的衬底和第二半导体材料的冷却装置形式的集成电路（IC）裸片。冷却装置直接安装在IC芯片的基板上。

5. 发明授权

US07259965B2 Integrated circuit coolant microchannel assembly with targeted channel configuration 有权
标题翻译：具有目标通道配置的集成电路冷却液微通道组件
公开(公告)号：US07259965B2
公开(公告)日：2007-08-21
申请号：US11101061
申请日：2005-04-07
申请人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory M. Chrysler , Ravi S. Prasher , Rajiv K. Mongia , Himanshu Pokharna , Eric DiStefano
发明人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory M. Chrysler , Ravi S. Prasher , Rajiv K. Mongia , Himanshu Pokharna , Eric DiStefano
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
摘要翻译：微通道结构中形成有微通道。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。每个子通道具有大于第一宽高比的相应的第二宽高比。

6. 发明授权

US07218519B2 Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels 有权
标题翻译：具有耦合到高热通量通道的低热通量流动的热管理装置
公开(公告)号：US07218519B2
公开(公告)日：2007-05-15
申请号：US10869186
申请日：2004-06-15
申请人： Ravi S. Prasher , Gregory M. Chrysler
发明人： Ravi S. Prasher , Gregory M. Chrysler
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.
摘要翻译：本发明的实施例包括一种用于热管理装置的装置，方法和系统，其具有耦合到高热通量通道的低热通量流动流。

7. 发明授权

US07212405B2 Method and apparatus for providing distributed fluid flows in a thermal management arrangement 有权
标题翻译：用于在热管理装置中提供分布式流体流的方法和装置
公开(公告)号：US07212405B2
公开(公告)日：2007-05-01
申请号：US10856896
申请日：2004-05-27
申请人： Ravi S. Prasher , Robert Sankman
发明人： Ravi S. Prasher , Robert Sankman
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F2210/02 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and system for providing a flow distributive interface for a thermal management arrangement.
摘要翻译：本发明的实施例包括用于提供用于热管理装置的流动分配接口的装置，方法和系统。

8. 发明申请

US20070284089A1 Method, apparatus and system for carbon nanotube wick structures 审中-公开
标题翻译：碳纳米管芯结构的方法，装置和系统
公开(公告)号：US20070284089A1
公开(公告)日：2007-12-13
申请号：US11444739
申请日：2006-05-31
申请人： Unnikrishnan Vadakkanmaruveedu , Gregory M. Chrysler , Ravi S. Prasher , Himanshu Pokharna
发明人： Unnikrishnan Vadakkanmaruveedu , Gregory M. Chrysler , Ravi S. Prasher , Himanshu Pokharna
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A method, apparatus and system are described for carbon nanotube wick structures. The system may include a frame and an apparatus. The apparatus may include a heat exchanger, a cold plate with a cold plate internal volume, and a heat pipe in the cold plate internal volume. In some embodiments, the heat pipe includes a thermally conductive wall material forming the inner dimensions of the heat pipe, a catalyst layer deposited onto the wall material, a carbon nanotube array formed on the catalyst layer, and a volume of working fluid. Other embodiments may be described.
摘要翻译：碳纳米管芯结构描述了一种方法，装置和系统。系统可以包括框架和装置。该装置可以包括热交换器，具有冷板内部容积的冷板和冷板内部容积中的热管。在一些实施例中，热管包括形成热管的内部尺寸的导热壁材料，沉积在壁材料上的催化剂层，形成在催化剂层上的碳纳米管阵列和一定体积的工作流体。可以描述其他实施例。

9. 发明授权

US06903930B2 Parallel heat exchanger for a component in a mobile system 有权
公开(公告)号：US06903930B2
公开(公告)日：2005-06-07
申请号：US10335425
申请日：2002-12-30
申请人： Eric DiStefano , Ravi S. Prasher , Himanshu Pokharna
发明人： Eric DiStefano , Ravi S. Prasher , Himanshu Pokharna
IPC分类号： G06F1/20 , H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

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