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1. 发明授权

US06464122B1 Soldering method and soldering apparatus 失效
标题翻译：焊接方法和焊接设备
公开(公告)号：US06464122B1
公开(公告)日：2002-10-15
申请号：US09645595
申请日：2000-08-25
申请人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
发明人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
IPC分类号： B23K3700
CPC分类号： B23K1/06 , B23K35/262 , B23K2101/40
摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.
摘要翻译：公开了一种用于焊接基材的方法和装置。制备基本上由锡和可与锡形成共晶合金并且不含铅的金属组成的二元焊料。其他金属成分的含量为0.1重量％以下，氧含量为100ppm以下。二元焊料在非氧化环境中熔化，并在氧含量为2,000ppm以下的气氛中分配到基材，以用二元焊料来焊接基材。焊接装置包括用于向基材提供频率为15KHz至1MHz的振荡波能量的振荡器。焊接装置也可以以焊接喷嘴或烙铁的形式实现。

2. 发明授权

US06457632B1 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy 有权
标题翻译：焊料合金及焊接方法与电焊或焊接合金电子部件
公开(公告)号：US06457632B1
公开(公告)日：2002-10-01
申请号：US09619445
申请日：2000-07-19
申请人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
发明人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要翻译：公开了用于粘接电子或电子部件的焊料合金，其包含：3至12重量％的锌组分; 和锡组分。焊料合金的氧含量降低到100ppm以下。使用焊料合金，在基板上形成接合部，并且将电子部件安装在其上，以获得用于安装电子部件的基板和安装有电子部件的基板。由上述焊料合金制成的接合部可以防止迁移。

3. 发明授权

US06386426B1 Solder material and method of manufacturing solder material 有权
标题翻译：焊料材料及其制造方法
公开(公告)号：US06386426B1
公开(公告)日：2002-05-14
申请号：US09655344
申请日：2000-09-05
申请人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
发明人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
IPC分类号： B23K3102
CPC分类号： H05K3/3463 , B23K35/0227 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/282 , Y10T29/302
摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.
摘要翻译：公开了一种焊料及其制造方法。焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖第一层围绕第一层的轴线。焊料材料为线材，颗粒，片材，带子或平面片段的形式。该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

4. 发明授权

US06280858B1 Substrate with solder alloy for mounting electronic parts 有权
标题翻译：带焊料合金的基板用于安装电子部件
公开(公告)号：US06280858B1
公开(公告)日：2001-08-28
申请号：US09619470
申请日：2000-07-19
申请人： Kouichi Teshima
发明人： Kouichi Teshima
IPC分类号： B32B1504
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要翻译：公开了用于粘接电子或电子部件的焊料合金，其包含：3至12重量％的锌组分; 和锡组分。焊料合金的氧含量降低到100ppm以下。使用焊料合金，在基板上形成接合部，并且将电子部件安装在其上，以获得用于安装电子部件的基板和安装有电子部件的基板。由上述焊料合金制成的接合部可以防止迁移。

5. 发明授权

US06186390B1 Solder material and method of manufacturing solder material 有权
标题翻译：焊料材料及其制造方法
公开(公告)号：US06186390B1
公开(公告)日：2001-02-13
申请号：US09220343
申请日：1998-12-24
申请人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
发明人： Masahiro Tadauchi , Kouichi Teshima , Izuru Komatsu , Mitsuhiro Tomita
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/0227 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/282 , Y10T29/302
摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.
摘要翻译：公开了一种焊料及其制造方法。焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖第一层围绕第一层的轴线。焊料材料为线材，颗粒，片材，带子或平面片段的形式。该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

6. 发明授权

US6123248A Soldering method and soldering apparatus 失效
公开(公告)号：US6123248A
公开(公告)日：2000-09-26
申请号：US99522
申请日：1998-06-18
申请人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
发明人： Masahiro Tadauchi , Makoto Gonda , Yoshiyuki Goto , Tomiaki Furuya , Kouichi Teshima , Izuru Komatsu , Takeshi Gotanda
IPC分类号： B23K1/06 , B23K3/04 , B23K31/02 , B23K35/26 , C22C13/00 , H05K3/34 , B23K20/10 , B23K35/38
CPC分类号： B23K1/06 , B23K35/262 , B23K2201/40
摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

7. 发明授权

US06332909B1 Processing apparatus, processing system and processing method 有权
标题翻译：处理装置，处理系统及处理方法
公开(公告)号：US06332909B1
公开(公告)日：2001-12-25
申请号：US09142742
申请日：1999-02-23
申请人： Kouichi Teshima , Tomohiro Todoroki , Terunobu Hayata , Fuminobu Tezuka , Masao Koyama , Naohiko Oyasato , Tomiaki Furuya , Yoshiaki Yokoyama , Teruhisa Ogihara , Kaichiro Ogihara
发明人： Kouichi Teshima , Tomohiro Todoroki , Terunobu Hayata , Fuminobu Tezuka , Masao Koyama , Naohiko Oyasato , Tomiaki Furuya , Yoshiaki Yokoyama , Teruhisa Ogihara , Kaichiro Ogihara
IPC分类号： C22B700
CPC分类号： C10B7/14 , B09B3/00 , C10B53/07 , C22B7/001 , F23G2201/301 , F23G2201/50 , Y02P10/214 , Y02P20/143
摘要： A processing apparatus capable of separating and recovering resins and metals, respectively, from an object being processed, which has resins and metals as its constituent, comprises a first gastight area (102), in which temperature and pressure are regulated so as to permit selective thermal decomposition of resins from the object (150) being processed, a second gastight area (103), which is partitioned from the first gastight area by an openable and closeable partition (105C) and in which temperature and pressure are regulated so as to permit selective vaporization of metals from the object, first recovering chamber (111) connected to the first gastight area for recovering gases produced by thermal decomposition of resins, and second recovering chamber (115) connected to the second gastight area for recovering vaporized metals.
摘要翻译：能够分别从具有树脂和金属作为其成分的被加工物分离和回收树脂和金属的加工设备包括第一气密区域（102），其中调节温度和压力以允许选择性来自被加工物体（150）的树脂的热分解，第二气密区域（103），其通过可开闭的隔板（105C）从第一气密区域分隔开，并且其中温度和压力被调节以允许从物体选择性蒸发金属，连接到第一气密区域的第一回收室（111）用于回收由树脂热分解产生的气体;以及第二回收室（115），其连接到第二气密区域以回收蒸发的金属。

8. 发明授权

US06651870B2 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate 有权
公开(公告)号：US06651870B2
公开(公告)日：2003-11-25
申请号：US10214187
申请日：2002-08-08
申请人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
发明人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.

9. 发明授权

US06220501B1 Method of joining metallic members, and joined metallic members 有权
标题翻译：连接金属构件和接合的金属构件的方法
公开(公告)号：US06220501B1
公开(公告)日：2001-04-24
申请号：US09169981
申请日：1998-10-13
申请人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
发明人： Masahiro Tadauchi , Izuru Komatsu , Kouichi Teshima , Rikiya Katoh , Jun Sugimoto , Takayuki Suzuki , Mitsuyoshi Hirayama
IPC分类号： B23K120
CPC分类号： B23K35/262 , B23K35/3613 , C22C13/00 , H05K3/3463
摘要： Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.
摘要翻译：公开了将金属构件连接在一起的方法。金属构件涂覆有由锡和锌的合金构成的底涂层，并通过包含锡和锌的焊料和助熔剂的混合物彼此接触，同时加热金属构件以熔化焊料。然后将熔融的焊料固化，以将金属构件接合。这里，底涂层中的锌的比例由x（重量％）表示，焊料中的锌的比例由y（重量％）表示，x的比例和y的比例为y 在由图1中的线A或B包围的区域内。 1，其满足以下公式：1 <= x <= 20,3 <= y <= 13和3 <=（x + y）/ 2 <= 13或式：0.1 <= x <= 25,2 = y <= 15和2 <=（x + y）/ 2 <= 15。

10. 发明授权

US06673310B2 Solder material, device using the same and manufacturing process thereof 失效
标题翻译：焊料，使用该材料的装置及其制造方法
公开(公告)号：US06673310B2
公开(公告)日：2004-01-06
申请号：US09749606
申请日：2000-12-28
申请人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
发明人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
IPC分类号： C22C1300
CPC分类号： B23K35/282 , B23K35/0222 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/28 , B23K35/30 , B23K35/3006 , B23K35/36 , B23K2101/36 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/97 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K3/3463 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
摘要翻译：公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％以下。焊料用于生产电气或电子设备和设备。

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