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1. 发明授权

US07826778B2 Powder supplying device and image forming device 有权
标题翻译：粉末供应装置和图像形成装置
公开(公告)号：US07826778B2
公开(公告)日：2010-11-02
申请号：US11911598
申请日：2007-01-29
申请人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Hiroshi Tateishi , Tetsuo Noji , Kazuhisa Sudo , Fumihito Itoh
发明人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Hiroshi Tateishi , Tetsuo Noji , Kazuhisa Sudo , Fumihito Itoh
IPC分类号： G03G15/08
CPC分类号： G03G15/0898 , G03G15/0856 , G03G15/086 , G03G15/0877 , G03G15/0879 , G03G2221/163
摘要： In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.
摘要翻译：在粉末供给装置中，粉末容器中含有粉末，并且在粉末容器的底部设置有用于将气体喷射到粉末容器的内部的气体吹出部。粉末输送单元从吸入口吸引容纳在粉末容器中的粉末，并将粉末输送到粉末接收装置。第一检测单元设置在粉末容器中以检测粉末容器中的剩余粉末。

2. 发明授权

US07773918B2 Imaging apparatus having particle supply and collection apparatus arranged outside imaging apparatus 有权
标题翻译：具有设置在成像装置外部的颗粒供给和收集装置的成像装置
公开(公告)号：US07773918B2
公开(公告)日：2010-08-10
申请号：US12354344
申请日：2009-01-15
申请人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Tetsuo Noji , Hiroshi Tateishi , Kazuhisa Sudo , Fumihito Itoh
发明人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Tetsuo Noji , Hiroshi Tateishi , Kazuhisa Sudo , Fumihito Itoh
IPC分类号： G03G15/08
CPC分类号： G03G21/105 , G03G15/0855 , G03G15/0865 , G03G15/0875 , G03G15/0879
摘要： A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.
摘要翻译：公开了一种颗粒供给装置，其包括容纳颗粒的颗粒容纳单元，布置在颗粒容纳单元的底部并被配置为朝向颗粒喷出气体的气体喷射单元，容纳在颗粒容纳单元中并将颗粒输送到供给目的地的颗粒;以及气体排出单元，其将容纳在颗粒容纳单元内的气体朝向颗粒容纳单元的外侧排出。

3. 发明申请

US20080193161A1 Power Supplying Device and Image Forming Device 有权
标题翻译：供电装置及成像装置
公开(公告)号：US20080193161A1
公开(公告)日：2008-08-14
申请号：US11911598
申请日：2007-01-29
申请人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Hiroshi Tateishi , Tetsuo Noji , Kazuhisa Sudo , Fumihito Itoh
发明人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Hiroshi Tateishi , Tetsuo Noji , Kazuhisa Sudo , Fumihito Itoh
IPC分类号： G03G15/08
CPC分类号： G03G15/0898 , G03G15/0856 , G03G15/086 , G03G15/0877 , G03G15/0879 , G03G2221/163
摘要： In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.
摘要翻译：在粉末供给装置中，粉末容器中含有粉末，并且在粉末容器的底部设置有用于将气体喷射到粉末容器的内部的气体吹出部。粉末输送单元从吸入口吸引容纳在粉末容器中的粉末，并将粉末输送到粉末接收装置。第一检测单元设置在粉末容器中以检测粉末容器中的剩余粉末。

4. 发明授权

US06673310B2 Solder material, device using the same and manufacturing process thereof 失效
标题翻译：焊料，使用该材料的装置及其制造方法
公开(公告)号：US06673310B2
公开(公告)日：2004-01-06
申请号：US09749606
申请日：2000-12-28
申请人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
发明人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
IPC分类号： C22C1300
CPC分类号： B23K35/282 , B23K35/0222 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/28 , B23K35/30 , B23K35/3006 , B23K35/36 , B23K2101/36 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/97 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K3/3463 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
摘要翻译：公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％以下。焊料用于生产电气或电子设备和设备。

5. 发明授权

US6092461A Heat-sensitive stencil, process of fabricating same and method of producing printing master using same 有权
标题翻译：热敏模板，其制造方法以及使用其制造印刷母版的方法
公开(公告)号：US6092461A
公开(公告)日：2000-07-25
申请号：US469537
申请日：1999-12-22
申请人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
发明人： Tetsuo Tanaka , Hiroshi Tateishi , Fumiaki Arai , Masanori Rimoto , Hiroshi Adachi , Kohichi Ohshima
IPC分类号： B41C1/055 , B32B5/18 , B41C1/14 , B41N1/24
CPC分类号： B41N1/242 , B41C1/144 , B41N1/245 , Y10T428/24802
摘要： A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.
摘要翻译：包括多孔载体的热敏模板和层压在载体上的表面平滑度至少为10,000秒的热塑性树脂膜。通过用具有特定粘度和特定挥发性物质含量的粘合剂将热塑性树脂膜粘合到多孔载体上，同时将每个载体和膜保持在特定张力下来制造模版。模板也可以通过涂布含有树脂的涂料组合物和具有特定溶解度和特定蒸发速率的第一溶剂和第二溶剂，并干燥所施加的组合物以形成多孔载体来制造。通过以不大于0.05mJ /点的加热能量的热头加热上述模版来制造印刷母版。

6. 发明授权

US5924360A Smooth stencil base sheet, method of producing a printing master from the stencil base sheet and method of performing stencil printing 失效
标题翻译：平滑模版基片，从模板基片制造印刷母版的方法和执行模版印刷的方法
公开(公告)号：US5924360A
公开(公告)日：1999-07-20
申请号：US867477
申请日：1997-06-02
申请人： Hiroshi Adachi , Kouichi Ohshima , Masanori Rimoto , Fumiaki Arai , Hiroshi Tateishi , Tetsuo Tanaka
发明人： Hiroshi Adachi , Kouichi Ohshima , Masanori Rimoto , Fumiaki Arai , Hiroshi Tateishi , Tetsuo Tanaka
IPC分类号： B41C1/14 , B41N1/24
CPC分类号： B41C1/144
摘要： A stencil base sheet includes a thermoplastic resin film, with a surface of the stencil base sheet on the side of the thermoplastic resin film having a surface smoothness of at least 6000 seconds. From this stencil base sheet, a printing master is prepared by use of a heat-emitting resistor with the application of electric signals thereto with pulse modulation corresponding to image recording density, thereby forming perforations of a different size corresponding to recording image density in the stencil base sheet by thermal fusing. Furthermore, a monochrome or multi-color stencil printing is performed by using the printing master.
摘要翻译：蜡纸底片包括热塑性树脂膜，其中在热塑性树脂膜侧面上的蜡纸基片的表面具有至少6000秒的表面平滑度。通过该模板基片，通过使用发射电阻器对其进行脉冲调制而对图像记录密度施加电脉冲来准备打印母版，从而形成与模板中的记录图像密度对应的不同大小的穿孔基片通过热熔。此外，通过使用打印母版来执行单色或多色模版印刷。

7. 发明授权

US5875711A Heat sensitive stencil having a porous substrate with tightly bound fibers 失效
标题翻译：热敏模板具有带有紧密结合纤维的多孔基材
公开(公告)号：US5875711A
公开(公告)日：1999-03-02
申请号：US949493
申请日：1997-10-14
申请人： Hiroshi Tateishi , Masayasu Nonogaki
发明人： Hiroshi Tateishi , Masayasu Nonogaki
IPC分类号： B41C1/14 , B41N1/24
CPC分类号： B41N1/241 , B41C1/14 , B41C1/144 , B41N1/24 , Y10T428/24802
摘要： A heat-sensitive stencil is disclosed which includes a porous substrate having opposing first and second surfaces, and a thermoplastic resin film bonded to the first surface of the substrate with an adhesive, wherein the second surface of the substrate is negative to a wax No. 6 pick test defined in the specification herein so that the fibers constituting the substrate are not picked off during its contact with a platen roller in the master forming stage.
摘要翻译：公开了一种热敏模板，其包括具有相对的第一表面和第二表面的多孔基材和用粘合剂粘合到基材的第一表面的热塑性树脂膜，其中基材的第二表面对蜡编号是负的 6拾取试验，使得构成基材的纤维在与母版成型阶段中的压纸辊接触期间不被拾取。

8. 发明授权

US5643690A Molten carbonate fuel cell 失效
标题翻译：熔融碳酸盐燃料电池
公开(公告)号：US5643690A
公开(公告)日：1997-07-01
申请号：US555080
申请日：1995-11-08
申请人： Hiroshi Tateishi , Norihiro Tomimatsu , Kazuaki Nakagawa , Hideyuki Ozu , Yoshihiro Akasaka
发明人： Hiroshi Tateishi , Norihiro Tomimatsu , Kazuaki Nakagawa , Hideyuki Ozu , Yoshihiro Akasaka
IPC分类号： H01M8/02 , H01M8/14
CPC分类号： H01M8/0271 , H01M8/0206 , H01M8/0232 , H01M8/0236 , H01M8/0245 , H01M8/0247 , H01M8/0254 , H01M8/026 , H01M2008/147 , H01M2300/0051 , Y02E60/526
摘要： There is proposed a molten carbonate fuel cell of high performance and long life which is provided with an oxidizing gas side-collector plate having on its surface a non-stoichiometric composite oxide layer excellent in electric conductivity and corrosion resistance, and hardly attracting electrolyte. This molter carbonate fuel cell comprises a unit cell comprising an electrolyte body formed of a porous body impregnated therein with a carbonate, a cathode disposed on one main surface of the electrolyte body, and an anode disposed on the other main surface of the electrolyte body, corrugated collector plates, disposed alternatively on a surface of the anode and on a surface of the cathode, and interconnectors, each being disposed on a surface of each of the collector plates, wherein the collector plate disposed on the cathode comprises a main body made of austenitic stainless steel, an Fe-Cr-Ni alloy layer covering a surface of the main body and consisting of 23 to 45 wt % of Fe, 12 to 27 wt % of Cr, the balance of Ni and not more than 1 wt % of unavoidable impurities, and a nickel-ferrite-based non-stoichiometric composite oxide layer formed on a surface of the Fe-Cr-Ni alloy layer.
摘要翻译：提出了具有高性能和长寿命的熔融碳酸盐燃料电池，其具有在其表面上具有导电性和耐腐蚀性优异的非化学计量的复合氧化物层，并且几乎不吸引电解质的氧化性气体侧集电板。该含碳酸酯燃料电池包括：单体电池，其包含由浸渍有碳酸盐的多孔体形成的电解质体，设置在所述电解质体的一个主表面上的阴极和设置在所述电解质体的另一个主表面上的阳极，瓦楞集电板，交替设置在阳极的表面和阴极的表面上，以及互连器，每个互连器设置在每个集电板的表面上，其中设置在阴极上的集电板包括：主体，奥氏体不锈钢，覆盖主体表面的Fe-Cr-Ni合金层，由23〜45重量％的Fe，12〜27重量％的Cr，余量的Ni和不大于1重量％的Fe 在Fe-Cr-Ni合金层的表面形成有不可避免的杂质和镍 - 铁系元素的非化学计量的复合氧化物层。

9. 发明授权

US07463853B2 Particle supply apparatus, imaging apparatus, and monitoring system 有权
标题翻译：粒子供给装置，成像装置和监视系统
公开(公告)号：US07463853B2
公开(公告)日：2008-12-09
申请号：US11679949
申请日：2007-02-28
申请人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Tetsuo Noji , Hiroshi Tateishi , Kazuhisa Sudo , Fumihito Itoh
发明人： Hiroshi Sano , Hirosato Amano , Keizo Chiba , Tetsuo Noji , Hiroshi Tateishi , Kazuhisa Sudo , Fumihito Itoh
IPC分类号： G03G15/08
CPC分类号： G03G21/105 , G03G15/0855 , G03G15/0865 , G03G15/0875 , G03G15/0879
摘要： A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, and a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination.
摘要翻译：公开了一种颗粒供给装置，其包括容纳颗粒的颗粒容纳单元，布置在颗粒容纳单元的底部并被配置为朝向颗粒喷出气体的气体喷射单元，以及将吸力施加到容纳在颗粒容纳单元中的颗粒将颗粒输送到供给目的地。

10. 发明授权

US06949814B2 Mounting material, semiconductor device and method of manufacturing semiconductor device 失效
标题翻译：半导体器件的安装材料，半导体器件及其制造方法
公开(公告)号：US06949814B2
公开(公告)日：2005-09-27
申请号：US10252088
申请日：2002-09-23
申请人： Cao Minh Thai , Hiroshi Tateishi , Koichi Teshima , Masahiro Tadauchi , Izuru Komatsu , Tetsuji Hori
发明人： Cao Minh Thai , Hiroshi Tateishi , Koichi Teshima , Masahiro Tadauchi , Izuru Komatsu , Tetsuji Hori
IPC分类号： H01L21/52 , H01L21/60 , H01L23/495
CPC分类号： H01L24/83 , H01L23/49513 , H01L23/4952 , H01L23/49551 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83101 , H01L2224/83194 , H01L2224/83439 , H01L2224/83801 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/13091 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.
摘要翻译：一种半导体器件，包括：包括管芯焊盘和引线部分的框架; 半导体元件电线，其包括连接到所述半导体元件的一端和连接到所述引线部分的另一端; 由焊料材料形成的至少一个第一接合部分，并且将所述管芯焊盘的上表面的一部分接合到所述半导体元件的下表面上的与所述管芯的上表面的一部分相对的部分垫; 以及由热固性树脂形成的至少一个第二接合部分，并且将所述管芯焊盘的上表面的另一部分接合到位于所述半导体元件的下表面上并与所述半导体元件的所述上表面的另一部分相对的另一部分芯片垫。

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