专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008278778A Desktop soybean curd-producing set 审中-公开
标题翻译：桌面大豆生产套装
公开(公告)号：JP2008278778A
公开(公告)日：2008-11-20
申请号：JP2007124605
申请日：2007-05-09
申请人： Katayama:Kk , Koji Maruyama , Nihon Atlon Corp , 幸司丸山 , 有限会社片山 , 株式会社日本アトロン
发明人： MARUYAMA KOJI
IPC分类号： A23L11/00
摘要： PROBLEM TO BE SOLVED: To provide a desktop soybean curd-producing set capable of producing, on the desk, delicious soybean curd which is equally finished in hardness from the periphery to the central part, using solid fuel. SOLUTION: This desktop soybean curd-producing set is constituted of a cooking stove 2, a solid fuel dish 3 which is set on the inner bottom of the cooking stove 2, an inside box 4, which is held in the cooking stove 2 and covers the solid fuel dish 3 from the upper side, and a pan 6 which is placed on the cooking stove 2 via a wire net 5. The inside box 4 is formed to a ceramic ware, formed into a container-like form with a hemispherical upper part and an opened lower part by using a mixture of clay, soil and petalite as the material, and set with a plurality of holes 9 on the peripheral wall, and the pan 6 is formed into a ceramic ware by using the similar material. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种台式大豆凝乳生产装置，其能够在桌子上使用固体燃料在周边至中央部分的硬度上生产出可口的大豆凝乳。解决方案：该台式大豆凝乳生产装置由烹饪炉2，设置在烹饪炉2的内底上的固体燃料盘3，保持在烹饪炉中的内箱4 2并且从上侧覆盖固体燃料盘3和通过丝网5放置在烹饪炉2上的锅6.内盒4形成为陶瓷制品，形成为容器状，通过使用粘土，土壤和石榴石的混合物作为材料的半球形上部和打开的下部，并且在周壁上设置有多个孔9，并且通过使用类似的方式将锅6形成陶瓷制品材料。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008254292A Tape-type paper binder 审中-公开
标题翻译：胶带型纸捆
公开(公告)号：JP2008254292A
公开(公告)日：2008-10-23
申请号：JP2007098082
申请日：2007-04-04
申请人： Koji Maruyama , 耕二丸山
发明人： MARUYAMA MASAYOSHI , MARUYAMA KOJI
IPC分类号： B42F7/00 , B42C9/00 , B42F11/00
摘要： PROBLEM TO BE SOLVED: To provide a tape-type paper binder which enables filing the bound sheets of paper in a pipe-type file due to punching holes kept open in a binding condition and which makes it easy to identify the bound sheets of paper when colored. SOLUTION: After sheets of paper are bound in use of punching holes by a tape or film of a thin material in a loop, the punching holes remain open, so that the sheets of paper in a bound condition can be filed in a pipe-type file. Furthermore, by coloring a tape or sticker, providing a printing thereon, or enabling writing a note thereon, the sheets of paper can be easily identified. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种带状纸粘合剂，其能够由于打孔在捆扎状态下保持打开而能够将管束的纸张排列在管型文件中，并且易于识别装订页的纸张着色。
解决方案：在一张纸之间用薄片材料的胶带或薄膜将纸张捆绑在一起，冲孔保持打开，从而可以将一张纸张在一张纸上管道型文件。此外，通过着色胶带或贴纸，在其上提供印刷，或使得能够在其上书写纸币，可以容易地识别纸张。版权所有（C）2009，JPO＆INPIT

3. 发明授权

US08787728B2 Data reproduction apparatus and data reproduction control method 失效
公开(公告)号：US08787728B2
公开(公告)日：2014-07-22
申请号：US12538011
申请日：2009-08-07
申请人： Koji Maruyama , Mitsutaka Kuwabara , Satoshi Kataoka
发明人： Koji Maruyama , Mitsutaka Kuwabara , Satoshi Kataoka
IPC分类号： H04N5/765
CPC分类号： G11B27/105 , H04N7/012 , H04N21/2393 , H04N21/440218 , H04N21/4621 , H04N21/482
摘要： According to one embodiment, a data reproduction apparatus comprises a reproduction module configured to reproduce image data, a resolution selection module configured to select one of resolutions, an image quality mode selection module configured to select on or off state of an image quality mode, a selection disable module configured to disable the resolution selection module to select a prescribed resolution when the image quality mode selection module selects the on state of the image quality mode, and an image processor configured to improve a quality of the image data reproduced by the reproduction module in accordance with the resolution selected by the resolution selection module when the image quality mode selection module selects the on state of the image quality mode.

4. 发明授权

US08716144B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08716144B2
公开(公告)日：2014-05-06
申请号：US13512372
申请日：2010-11-17
申请人： Shuichiro Uda , Koji Maruyama , Yusuke Hirayama
发明人： Shuichiro Uda , Koji Maruyama , Yusuke Hirayama
IPC分类号： H01L21/302
CPC分类号： H01L21/3065
摘要： A method for manufacturing a semiconductor device for forming a deep hole in a substrate by using a photoresist film formed on the substrate includes a positioning step of positioning a substrate inside an etching chamber, the substrate having a photoresist film including an opening part formed thereon, a first etching step of performing plasma etching on the substrate positioned inside the etching chamber by using a first mixed gas including at least SiF4 and O2 with the photoresist film as a mask, and a second etching step of forming a hole in the substrate by performing plasma etching on the substrate by using a second mixed gas including at least SF6, O2, and HBr after the first etching step.
摘要翻译：通过使用形成在基板上的光致抗蚀剂膜来制造用于在基板中形成深孔的半导体器件的方法包括：将蚀刻室内的基板定位的定位步骤，所述基板具有包括形成在其上的开口部的光致抗蚀剂膜，第一蚀刻步骤，通过使用至少包含SiF 4和O 2的第一混合气体与光致抗蚀剂膜作为掩模，在位于蚀刻室内的基板上进行等离子体蚀刻;以及第二蚀刻步骤，通过执行在基板中形成孔在第一蚀刻步骤之后通过使用至少包括SF 6，O 2和HBr的第二混合气体在衬底上进行等离子体蚀刻。

5. 发明申请

US20120176439A1 INKJET PRINTER 有权
标题翻译：喷墨打印机
公开(公告)号：US20120176439A1
公开(公告)日：2012-07-12
申请号：US13425418
申请日：2012-03-21
申请人： Hiroshi KANAI , Masaru OHNISHI , Kenji HASHIZUME , Shinichi UEHARA , Koji MARUYAMA , Katsuhisa TSUCHIYA
发明人： Hiroshi KANAI , Masaru OHNISHI , Kenji HASHIZUME , Shinichi UEHARA , Koji MARUYAMA , Katsuhisa TSUCHIYA
IPC分类号： B41J29/38
CPC分类号： B41J2/2107 , B41J11/002
摘要： An inkjet printer includes a platen, a printing head, a feeding device, a pre-heater and a print heater. The printing head is configured to move in a right-left direction above the platen and to eject solvent ink from nozzles of the printing head on a printing surface of a medium at a printing position. The feeding device is configured to feed the medium on the platen in a forward direction substantially perpendicular to the right-left direction. The temperature controller is configured to control a pre-heater heating temperature of the pre-heater and a print heater heating temperature of the print heater such that a surface temperature of the printing surface of the medium at the printing position becomes within a range of from 30° C. to 70° C.
摘要翻译：喷墨打印机包括压板，打印头，进给装置，预热器和打印加热器。打印头构造成在压板上方的左右方向上移动，并且在打印位置的介质的打印表面上从打印头的喷嘴喷射溶剂墨。进给装置构造成沿着与左右方向大致垂直的向前方向将介质供给到压板上。温度控制器被配置为控制预热器的预热器加热温度和打印加热器的打印加热器加热温度，使得打印位置处的介质的打印表面的表面温度变为 30°C至70°C

6. 发明申请

US20120056360A1 Process for producing metal composite material 审中-公开
标题翻译：金属复合材料生产工艺
公开(公告)号：US20120056360A1
公开(公告)日：2012-03-08
申请号：US13199747
申请日：2011-09-08
申请人： Makoto Fujita , Koji Maruyama , Ikuo Suzuki
发明人： Makoto Fujita , Koji Maruyama , Ikuo Suzuki
IPC分类号： C04B35/10
CPC分类号： C04B41/5155 , C04B38/009 , C04B41/009 , C04B41/88 , C04B35/10 , C04B38/00 , C04B41/4523 , C04B41/457
摘要： Producing a metal composite material by mixing hydrated ceramic particles, having water of crystallization that is bound within fine pores which have an average pore diameter of 1 nm or more and 80 nm or less, with a reinforcing material, the resulting mixture being sintered to form a preform which is then impregnated with a melt of an aluminum alloy and subjected to surface polishing. The ceramic particles, from which water of crystallization has been removed while the average pore diameter of the pores thereof is maintained, are dispersed uniformly, it is possible to obtain the metal composite material in which the ceramic particles that have fine pores are exposed on surfaces evenly in a stable manner by surface polishing that is conducted after the melt impregnation. The metal composite material can permit infiltration of a lubricating oil into the fine pores.
摘要翻译：通过将具有结晶的水结合的水合陶瓷颗粒与平均孔径为1nm以上且80nm以下的细孔混合，形成金属复合材料，所得到的混合物被烧结而形成预制件，然后用铝合金熔体浸渍并进行表面抛光。在保持结晶孔的平均孔径的同时除去了结晶水的陶瓷颗粒被均匀地分散，可以获得具有细孔的陶瓷颗粒暴露在表面上的金属复合材料通过在熔融浸渍之后进行的表面抛光以均匀的方式均匀。金属复合材料可以允许润滑油渗透到细孔中。

7. 发明申请

US20100034525A1 DATA REPRODUCTION APPARATUS AND DATA REPRODUCTION CONTROL METHOD 失效
标题翻译：数据再现设备和数据复制控制方法
公开(公告)号：US20100034525A1
公开(公告)日：2010-02-11
申请号：US12538011
申请日：2009-08-07
申请人： Koji MARUYAMA , Mitsutaka KUWABARA , Satoshi KATAOKA
发明人： Koji MARUYAMA , Mitsutaka KUWABARA , Satoshi KATAOKA
IPC分类号： H04N5/00
CPC分类号： G11B27/105 , H04N7/012 , H04N21/2393 , H04N21/440218 , H04N21/4621 , H04N21/482
摘要： According to one embodiment, a data reproduction apparatus comprises a reproduction module configured to reproduce image data, a resolution selection module configured to select one of resolutions, an image quality mode selection module configured to select on or off state of an image quality mode, a selection disable module configured to disable the resolution selection module to select a prescribed resolution when the image quality mode selection module selects the on state of the image quality mode, and an image processor configured to improve a quality of the image data reproduced by the reproduction module in accordance with the resolution selected by the resolution selection module when the image quality mode selection module selects the on state of the image quality mode.
摘要翻译：根据一个实施例，数据再现装置包括被配置为再现图像数据的再现模块，被配置为选择分辨率之一的分辨率选择模块，被配置为选择图像质量模式的打开或关闭状态的图像质量模式选择模块，所述选择禁止模块被配置为当所述图像质量模式选择模块选择所述图像质量模式的接通状态时禁止所述分辨率选择模块选择规定的分辨率;以及图像处理器，被配置为提高由所述再现模块再现的图像数据的质量当图像质量模式选择模块选择图像质量模式的开状态时，根据由分辨率选择模块选择的分辨率。

8. 发明授权

US07470998B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07470998B2
公开(公告)日：2008-12-30
申请号：US11373154
申请日：2006-03-13
申请人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
发明人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
IPC分类号： H01L23/84 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.
摘要翻译：本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接，其制造方法。根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。基本上所有的第一基板的所有后表面被结合到布线结构的主表面。形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

9. 外观设计

USD544912S1 Housing of damper mechanism for ink jet printer 有权
标题翻译：喷墨打印机阻尼机构的外壳
公开(公告)号：USD544912S1
公开(公告)日：2007-06-19
申请号：US29261746
申请日：2006-06-20
申请人： Koji Maruyama
设计人： Koji Maruyama

10. 发明申请

US20050172904A1 Plasma processing apparatus and plasma processing method 有权
标题翻译：等离子体处理装置和等离子体处理方法
公开(公告)号：US20050172904A1
公开(公告)日：2005-08-11
申请号：US10675966
申请日：2003-10-02
申请人： Chishio Koshimizu , Hiroyuki Ishihara , Kimihiro Higuchi , Koji Maruyama
发明人： Chishio Koshimizu , Hiroyuki Ishihara , Kimihiro Higuchi , Koji Maruyama
IPC分类号： H05H1/46 , C23C16/00 , C23F4/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/68 , H01L21/683 , H05H1/00
CPC分类号： H01L21/6831 , H01J37/32623 , H01J37/32642 , H01J2237/2001 , H01L21/67248 , Y10S156/915
摘要： An electrostatic chuck 108 is provided on a lower electrode 106 provided inside a processing chamber 102 of an etching apparatus 100, and a conductive inner ring body 112a and an insulating outer ring body 112b are encompassing the outer edges of a wafer W mounted on the chuck surface. The temperatures of the wafer W and the inner and outer ring bodies 112a and 112b are detected by first third temperature sensors 142, 144 and 146. A controller 140 controls the pressure levels of He supplied to the space between the center of the wafer W and the electrostatic chuck 108 via first gas outlet ducts 114 and to the space between the outer edges of the wafer W and the electrostatic chuck 108 via second gas outlet ducts 116 and the quantity of heat generated by a heater 148 inside the outer ring body 112b based upon the information on the temperatures thus detected so that the temperatures of the wafer W and the inner ring body 112a are set roughly equal to each other.
摘要翻译：静电吸盘108设置在设置在蚀刻装置100的处理室102内部的下部电极106上，并且导电内圈主体112a和绝缘外圈主体112b围绕安装在晶片W的外边缘卡盘表面。晶片W和内外环体112a和112b的温度由第一第三温度传感器142,144和146检测。控制器140控制供应给晶片中心之间的空间的He的压力水平 W和静电卡盘108经由第一气体出口管114以及经由第二气体出口管道116到晶片W的外边缘和静电卡盘108之间的空间以及由外部环体内的加热器148产生的热量 112b基于如此检测的温度的信息，使得晶片W和内环体112a的温度大致相等。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式